XL3001E1

{
 "schema": "adom.pads/1",
 "slug": "xl3001e1",
 "footprint": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm",
 "generated_from": {
  "footprint": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm@sha256:5848244c5e72002e",
  "pins": "page.json:component.pins",
  "overrides": null
 },
 "pin1": {
  "pad": "1",
  "at": [
   -2.475,
   -1.905
  ],
  "corner": "top-left",
  "source": "silk-marker",
  "derived_from": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm@sha256:5848244c5e72002e"
 },
 "pad_count": 9,
 "symbol_pins": [
  "1",
  "2",
  "3",
  "4",
  "5",
  "6",
  "7",
  "8",
  "9"
 ],
 "paste_apertures": 4,
 "issues": [],
 "pads": [
  {
   "pad": "1",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "1",
   "name": "CS",
   "type": "input",
   "description": "Output current-sense input. Regulated to an internal 0.21 V reference (IOUT = 0.21 V / RCS). Connect to the high side of the current-sense resistor to set LED current.",
   "is_pin1": true,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "2",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "2",
   "name": "NC",
   "type": "unconnected",
   "description": "No connection. Leave floating or tie to any convenient net; the pin is not internally bonded.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "3",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "3",
   "name": "VC",
   "type": "passive",
   "description": "Internal voltage-regulator bypass pin. Connect a 1 µF ceramic capacitor between VIN and VC in typical applications for internal LDO decoupling.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "4",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "4",
   "name": "VIN",
   "type": "power_in",
   "description": "Power supply input, 8 V to 40 V DC (absolute max 45 V). Bypass VIN to GND with an electrolytic capacitor (e.g. 100 µF/50 V) plus a ceramic to suppress switching noise.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "5",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "5",
   "name": "SW",
   "type": "output",
   "description": "Power switching output (drain of internal high-side power MOSFET). Connect to the buck inductor / catch diode node; rated for up to 3 A switching current at 220 kHz. Electrically tied to the exposed metal pad on the package back.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "6",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "6",
   "name": "SW",
   "type": "output",
   "description": "Power switching output (drain of internal high-side power MOSFET). Tie to pin 5 and to the exposed pad; carries the buck switch-node current.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "7",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "7",
   "name": "GND",
   "type": "power_in",
   "description": "Device ground. Tie to pin 8 and to the PCB ground plane; return path for VIN bypass and CS sense resistor.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "8",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "8",
   "name": "GND",
   "type": "power_in",
   "description": "Device ground. Tie to pin 7 and to the PCB ground plane.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "9",
   "kind": "smd",
   "shape": "rect",
   "at": [
    0.0,
    0.0
   ],
   "rot": 0.0,
   "size": [
    2.41,
    3.3
   ],
   "layers": [],
   "thermal": true,
   "pin": "9",
   "name": "EP/SW",
   "type": "output",
   "description": "Exposed thermal pad on the back of the SOP8-EP package. Electrically the SW node (the datasheet notes '背部焊盘为 SW'). Solder to the SW copper pour to conduct switch-node current and heat.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  }
 ]
}