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XL2596HVP-5.0E1

XLSEMI(芯龙) · DC-DC Converters · SOP-8-EP

XL2596HVP-5.0E1 from XLSEMI(芯龙), in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Power input pin for a DC 4.5V to 50V wide operating voltage range, with an electrolytic capacitor required in parallel between VIN and GND to suppress noise.
2 SW output Power switch output pin and the switching node that carries the output power.
3 FB input Feedback pin that senses the output voltage through an external resistor divider; the reference voltage is 1.23V for the adjustable version.
4 EN input Enable pin, active low: a high level (VEN_H minimum 1.4V) shuts the device down, a low level (VEN_L maximum 0.8V) enables it, and it is low when left floating.
5 GND power_in Ground pin, one of the four GND pins (5 to 8) that are internally common with the exposed pad on the package back.
6 GND power_in Ground pin, one of the four GND pins (5 to 8) that are internally common with the exposed pad on the package back.
7 GND power_in Ground pin, one of the four GND pins (5 to 8) that are internally common with the exposed pad on the package back.
8 GND power_in Ground pin, one of the four GND pins (5 to 8) that are internally common with the exposed pad on the package back.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer XLSEMI(芯龙)
Package SOP-8-EP
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
输出电压 (-5.0 variant, VOUT=5.0V) VOUT 4.925 5 5.075 V VIN =12V, IOUT=0.5A 4
工作电压 VIN 4.5 50 V 5
关机电流 IS 46 100 uA VEN =2V 5
静态电流 IQ 1.3 2 mA 注 2: VFB=10V (ADJ、3.3V、5.0V版本) 5
振荡频率 FOSC 135 150 165 KHz 5
饱和压降 VCE 1.1 1.3 V VFB=0V, IOUT=2A 5
输入电压 (absolute maximum) VIN -0.3 60 V 3
反馈引脚电压 VFB -0.3 20 V 3
使能引脚电压 VEN -0.3 7 V 3
输出开关引脚电压 VSW -0.3 V upper limit printed as VIN 3
操作结温 TJ -40 150 oC 3
贮存温度范围 TSTG -65 150 oC 3
引脚温度(焊接) TLEAD 260 oC 焊接10秒 (10 s soldering) 3
ESD (HBM) 8000 V HBM; printed as >8000 3
热阻 (SOP8-EP) 结到环境 RJA 60 oC /W 结到环境,无外部散热片 (junction to ambient, no external heatsink); value printed without min/typ/max column 3
环境工作温度范围 -40 125 ℃ 温度等级1级 (grade 1 ambient operating range, feature list) 1

CAD (KiCad official)

  • Symbol: XL2596HVP-5.0E1
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: xl2596hvp-5-0e1-etched.step / xl2596hvp-5-0e1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xl2596hvp-5-0e1.step / xl2596hvp-5-0e1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XLSEMI(芯龙) datasheet (17 pp, sha256 5a6d81fc8b895f6d, retrieved 2026-10-29, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF