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XL2576HVS-12E1

XLSEMI · DC-DC Converters · TO-263-5L

XL2576HVS-12E1 from XLSEMI, in a TO-263-5L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Supply input for the wide 4.5V to 50V operating range, and an electrolytic capacitor must be connected in parallel between VIN and GND to suppress noise.
2 SW output Power switch output pin; it is the switch node that carries the output power and switches between VIN and ground.
3 GND power_in Ground pin for the device.
4 FB input Feedback pin that senses the output voltage through an external resistor divider to regulate it; the reference voltage for the adjustable version is 1.23V.
5 EN input Enable pin, active low: a high level shuts the device down and it is low when left floating.
6 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer XLSEMI
Package TO-263-5L
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
输入电压 (working voltage) VIN 4.5 50 V TA=25℃, VIN=12V, VEN=0V (DC table header) 5
关机电流 (shutdown current) IS 46 100 uA VEN=2V 5
静态电源电流 (quiescent supply current) IQ 1.3 2 mA 注2 (12V版本): VFB=15V 5
振荡频率 (oscillator frequency) FOSC 42.8 52 57.2 KHz 5
最大占空比 (maximum duty cycle) DMAX 90 % VFB=0V 5
饱和压降 (saturation voltage) VCE 1.1 1.3 V VFB=0V, IOUT=2A 5
输出电压 (output voltage, 12V version) VOUT 11.82 12 12.18 V VIN=24V, IOUT=0.25A 4
输入电压 (absolute maximum) VIN -0.3 60 V 3
反馈引脚电压 (absolute maximum) VFB -0.3 20 V 3
使能引脚电压 (absolute maximum) VEN -0.3 7 V 3
输出开关引脚电压 (absolute maximum) VSW -0.3 V maximum printed as VIN 3
ESD (HBM) ESD 8000 V HBM; printed as >8000 3
引脚温度 (lead temperature, soldering) TLEAD 260 oC soldering 10 s 3
贮存温度范围 (storage temperature) TSTG -65 150 oC 3
操作结温 (operating junction temperature) TJ -40 150 oC 3
环境工作温度范围 (ambient operating temperature) TA -40 125 oC temperature grade 1 1
热阻 (thermal resistance, junction to ambient) RJA 30 oC/W TO263-5L, junction to ambient, no external heatsink 3
内部反馈电阻 (block diagram, 12V version) R2 22.51 K 12V version, block diagram 3
内部电阻 (block diagram, 5.0V and 12V versions) R1 2.57 K 5.0V and 12V versions, block diagram 3

CAD (KiCad official)

  • Symbol: XL2576HVS-12E1
  • Footprint: Package_TO_SOT_SMD:TO-263-5_TabPin6
  • 3D model: TO-263-5L (KiCad packages3D, STEP)
  • 3D model files: xl2576hvs-12e1-etched.step / xl2576hvs-12e1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xl2576hvs-12e1.step / xl2576hvs-12e1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XLSEMI datasheet (15 pp, sha256 f2ab9385f37ad139, retrieved 2026-10-28, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF