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Ray Publish 0.1.0 8ab1def 17d ago

XL236-2.5

XINLUDA · Voltage Reference · SOP-8

XL236-2.5 from XINLUDA, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection.
2 NC unconnected No connection.
3 NC unconnected No connection.
4 - passive Cathode-side negative terminal of the 2.5V shunt reference diode (reverse current 400 µA to 10 mA operating, 15 mA absolute maximum).
5 ADJ passive Adjust pin used to trim the reference for minimum temperature drift.
6 NC unconnected No connection.
7 NC unconnected No connection.
8 + passive Positive terminal of the 2.5V shunt reference diode (forward current 10 mA absolute maximum).

Key specifications

Parameter Value
Manufacturer XINLUDA
Package SOP-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage 2.44 2.49 2.54 V TA=25°C, IR=1 mA 3
Reverse Breakdown Change With Current 2.6 6 mV TA=25°C, 400 μA≤IR≤10 mA 3
Reverse Dynamic Impedance 0.2 0.6 Ω TA=25°C, IR=1 mA, f = 100 Hz 3
Temperature Stability 7.5 18 mV −25°C ≤ TA ≤ +85°C (XL236); VR adjusted to 2.490V, IR=1 mA 3
Reverse Breakdown Change With Current 3 10 mV 400 μA≤IR≤10 mA 3
Reverse Dynamic Impedance 0.4 1 Ω IR=1 mA 3
Long Term Stability 20 ppm TA=25°C ±0.1°C, IR=1 mA, t = 1000 hrs 3
Reverse Current 15 mA 3
Forward Current 10 mA 3
Storage Temperature -60 150 °C 3
Operating Temperature Range -40 85 °C XL236 3
SOP Soldering Vapor Phase 215 °C Vapor Phase (60 sec.) 3
SOP Soldering Infrared 220 °C Infrared (15 sec.) 3
Thermal Resistance Junction to Ambient (SOP) θja 165 °C/W SOP package 3
Reverse Operating Current (minimum) 400 μA Wide operating current range stated in Features 1
Reverse Operating Current (maximum) 10 mA Wide operating current range stated in Features 1

CAD (KiCad official)

  • Symbol: XL236-2.5
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: xl236-2-5-etched.step / xl236-2-5-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xl236-2-5.step / xl236-2-5.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XINLUDA datasheet (11 pp, sha256 570a459261570e57, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF