component
XL236-2.5
Public Made by Adomby adom
XINLUDA Voltage Reference, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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XL236-2.5
XINLUDA · Voltage Reference · SOP-8
XL236-2.5 from XINLUDA, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection. |
| 2 | NC | unconnected | No connection. |
| 3 | NC | unconnected | No connection. |
| 4 | - | passive | Cathode-side negative terminal of the 2.5V shunt reference diode (reverse current 400 µA to 10 mA operating, 15 mA absolute maximum). |
| 5 | ADJ | passive | Adjust pin used to trim the reference for minimum temperature drift. |
| 6 | NC | unconnected | No connection. |
| 7 | NC | unconnected | No connection. |
| 8 | + | passive | Positive terminal of the 2.5V shunt reference diode (forward current 10 mA absolute maximum). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XINLUDA |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | 2.44 | 2.49 | 2.54 | V | TA=25°C, IR=1 mA | 3 | |
| Reverse Breakdown Change With Current | 2.6 | 6 | mV | TA=25°C, 400 μA≤IR≤10 mA | 3 | ||
| Reverse Dynamic Impedance | 0.2 | 0.6 | Ω | TA=25°C, IR=1 mA, f = 100 Hz | 3 | ||
| Temperature Stability | 7.5 | 18 | mV | −25°C ≤ TA ≤ +85°C (XL236); VR adjusted to 2.490V, IR=1 mA | 3 | ||
| Reverse Breakdown Change With Current | 3 | 10 | mV | 400 μA≤IR≤10 mA | 3 | ||
| Reverse Dynamic Impedance | 0.4 | 1 | Ω | IR=1 mA | 3 | ||
| Long Term Stability | 20 | ppm | TA=25°C ±0.1°C, IR=1 mA, t = 1000 hrs | 3 | |||
| Reverse Current | 15 | mA | 3 | ||||
| Forward Current | 10 | mA | 3 | ||||
| Storage Temperature | -60 | 150 | °C | 3 | |||
| Operating Temperature Range | -40 | 85 | °C | XL236 | 3 | ||
| SOP Soldering Vapor Phase | 215 | °C | Vapor Phase (60 sec.) | 3 | |||
| SOP Soldering Infrared | 220 | °C | Infrared (15 sec.) | 3 | |||
| Thermal Resistance Junction to Ambient (SOP) | θja | 165 | °C/W | SOP package | 3 | ||
| Reverse Operating Current (minimum) | 400 | μA | Wide operating current range stated in Features | 1 | |||
| Reverse Operating Current (maximum) | 10 | mA | Wide operating current range stated in Features | 1 |
CAD (KiCad official)
- Symbol:
XL236-2.5 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
xl236-2-5-etched.step/xl236-2-5-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xl236-2-5.step/xl236-2-5.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XINLUDA datasheet (11 pp, sha256
570a459261570e57, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# XL236-2.5
**XINLUDA** · Voltage Reference · SOP-8
XL236-2.5 from XINLUDA, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection. |
| 2 | NC | unconnected | No connection. |
| 3 | NC | unconnected | No connection. |
| 4 | - | passive | Cathode-side negative terminal of the 2.5V shunt reference diode (reverse current 400 µA to 10 mA operating, 15 mA absolute maximum). |
| 5 | ADJ | passive | Adjust pin used to trim the reference for minimum temperature drift. |
| 6 | NC | unconnected | No connection. |
| 7 | NC | unconnected | No connection. |
| 8 | + | passive | Positive terminal of the 2.5V shunt reference diode (forward current 10 mA absolute maximum). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XINLUDA |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | | 2.44 | 2.49 | 2.54 | V | TA=25°C, IR=1 mA | 3 |
| Reverse Breakdown Change With Current | | | 2.6 | 6 | mV | TA=25°C, 400 μA≤IR≤10 mA | 3 |
| Reverse Dynamic Impedance | | | 0.2 | 0.6 | Ω | TA=25°C, IR=1 mA, f = 100 Hz | 3 |
| Temperature Stability | | | 7.5 | 18 | mV | −25°C ≤ TA ≤ +85°C (XL236); VR adjusted to 2.490V, IR=1 mA | 3 |
| Reverse Breakdown Change With Current | | | 3 | 10 | mV | 400 μA≤IR≤10 mA | 3 |
| Reverse Dynamic Impedance | | | 0.4 | 1 | Ω | IR=1 mA | 3 |
| Long Term Stability | | | 20 | | ppm | TA=25°C ±0.1°C, IR=1 mA, t = 1000 hrs | 3 |
| Reverse Current | | | | 15 | mA | | 3 |
| Forward Current | | | | 10 | mA | | 3 |
| Storage Temperature | | -60 | | 150 | °C | | 3 |
| Operating Temperature Range | | -40 | | 85 | °C | XL236 | 3 |
| SOP Soldering Vapor Phase | | | | 215 | °C | Vapor Phase (60 sec.) | 3 |
| SOP Soldering Infrared | | | | 220 | °C | Infrared (15 sec.) | 3 |
| Thermal Resistance Junction to Ambient (SOP) | θja | | 165 | | °C/W | SOP package | 3 |
| Reverse Operating Current (minimum) | | 400 | | | μA | Wide operating current range stated in Features | 1 |
| Reverse Operating Current (maximum) | | | | 10 | mA | Wide operating current range stated in Features | 1 |
## CAD (KiCad official)
- Symbol: `XL236-2.5`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `xl236-2-5-etched.step` / `xl236-2-5-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `xl236-2-5.step` / `xl236-2-5.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [XINLUDA datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588912247359328256) (11 pp, sha256 `570a459261570e57`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/xl236-2-5-datasheet.pdf)