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XL2012E1

XLSEMI · DC-DC Converters · SOIC-8

XL2012E1 from XLSEMI, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 FB input Feedback pin with a feedback threshold voltage of 5V; the output short shutdown triggers when FB falls below 1.5V.
2 NC unconnected No internal connection.
3 VC power_out Internal voltage regulator bypass pin; connect a 1uF capacitor from VC to VIN.
4 VIN power_in Supply voltage input operating from 8V to 40V DC; bypass VIN to GND with a suitably large capacitor to suppress input noise.
5 SW output Power switch output node that supplies power to the output; voltage limited to -0.3 V to VIN per the absolute maximum ratings.
6 SW output Power switch output node that supplies power to the output; voltage limited to -0.3 V to VIN per the absolute maximum ratings.
7 GND power_in Ground pin; route it outside the Schottky diode to output capacitor ground path to keep switching current spikes from injecting noise into the IC.
8 GND power_in Ground pin; route it outside the Schottky diode to output capacitor ground path to keep switching current spikes from injecting noise into the IC.

Key specifications

Parameter Value
Manufacturer XLSEMI
Package SOIC-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Feedback Voltage VFB 4.9 5 5.1 V Vin = 8V to 40V, Vout=5V; Iload=0.5A to 2.4A 5
Input operation voltage Vin 8 40 V 5
Quiescent Supply Current Iq 4.7 10 mA VFB =Vin 5
Oscillator Frequency Fosc 128 150 173 KHz 5
Output Power PMOS Rdson 60 80 mohm VFB=0V, Vin=12V, ISW=2.4A 5
Output Short Supply Current Iosp 5 mA 5
Input Voltage Vin -0.3 45 V 4
Feedback Pin Voltage VFB -0.3 V 4
Output Switch Pin Voltage VSW -0.3 V 4
Thermal Resistance (SOP8) Junction to Ambient RJA 100 ℃/W No Heatsink, Free Air 4
Operating Junction Temperature TJ -40 125 ℃ 4
Storage Temperature TSTG -65 150 ℃ 4
Lead Temperature TLEAD 260 ℃ Soldering, 10 sec 4
ESD (HBM) 2000 V 4

CAD (KiCad official)

  • Symbol: XL2012E1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: xl2012e1-etched.step / xl2012e1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xl2012e1.step / xl2012e1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XLSEMI datasheet (10 pp, sha256 245fdfd918ae0ca3, retrieved 2026-10-09, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF