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docs xl1583e1: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
package.json Publish 0.2.0 · Ray
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
page.json xl1583e1: specified limits as data (metadata.characteristics, 20 rows from the datasheet) · Ray
README.md xl1583e1: specified limits as data (metadata.characteristics, 20 rows from the datasheet) · Ray
xl1583e1-etched.fit.json xl1583e1: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
xl1583e1-etched.glb xl1583e1: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
xl1583e1-etched.step xl1583e1: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
xl1583e1.glb Publish 0.1.0 · Ray
xl1583e1.kicad_mod Publish 0.1.0 · Ray
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xl1583e1.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an… · Ray
xl1583e1.step Publish 0.1.0 · Ray

XL1583E1

XLSEMI · DC-DC Converters · SOIC-8

XL1583E1 from XLSEMI, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connect. Not internally bonded; leave floating or tie to ground for mechanical stability.
2 VIN power_in Supply voltage input. Operates from 3.6V to 28V DC (absolute max 32V). Bypass to GND with a suitably large low-ESR capacitor (typ. 220uF/35V) placed close to the pin to eliminate input noise.
3 SW output Power switch output node. Internal high-side MOSFET (~43mOhm) switches this pin between VIN and GND at 380 kHz; connects to the external inductor and catch Schottky diode of the buck converter. Current limit is typically 4.7A.
4 GND power_in Ground reference for the IC. Route outside the Schottky diode-to-output-capacitor ground path to prevent switching current spikes from injecting noise into the device.
5 FB input Feedback input. Compares the divided output voltage against the internal 1.222V reference to regulate VOUT via an external resistor divider: VOUT = 1.222 * (1 + R2/R1).
6 NC unconnected No connect. Not internally bonded; leave floating or tie to ground for mechanical stability.
7 EN input Enable input with hysteresis. Drive high (>=1.4V typ.) to turn the regulator on; drive low (<=0.8V typ.) to shut down (Is ~60uA). Floating defaults high. Absolute max VEN = VIN.
8 NC unconnected No connect. Not internally bonded; leave floating or tie to ground for mechanical stability.

Key specifications

Parameter Value
Manufacturer XLSEMI
Package SOIC-8
Category PMIC
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • XL1583E1

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Feedback Voltage VFB 1.186 1.222 1.258 V Vin = 7V to 28V, Vout=5V, Iload=0.2A to 3A 5
Input operation voltage Vin 3.6 28 V 5
Oscillator Frequency Fosc 323 380 437 Khz 5
EN Pin Threshold, High (Regulator ON) VEN 1.4 V High (Regulator ON) 5
EN Pin Threshold, Low (Regulator OFF) VEN 0.8 V Low (Regulator OFF) 5
Shutdown Supply Current IS 60 200 uA VEN=0V 5
Quiescent Supply Current Iq 3 5 mA VEN =2V, VFB =Vin 5
Switch Current Limit IL 4.7 A VFB =0V 5
EN Pin Input Leakage Current (ON) IH 1 15 uA VEN =2V (ON) 5
EN Pin Input Leakage Current (OFF) IL 1 15 uA VEN =0V (OFF) 5
Max. Duty Cycle DMAX 100 % VFB=0V 5
Input Voltage (absolute maximum range) Vin -0.3 32 V 4
Feedback Pin Voltage (upper limit Vin) VFB -0.3 V 4
EN Pin Voltage (upper limit Vin) VEN -0.3 V 4
Output Switch Pin Voltage (upper limit Vin) VSW -0.3 V 4
Thermal Resistance (SOP8), Junction to Ambient, No Heatsink, Free Air RJA 100 ℃/W Junction to Ambient, No Heatsink, Free Air 4
Operating Junction Temperature TJ -40 125 ℃ 4
Storage Temperature TSTG -65 150 ℃ 4
Lead Temperature (Soldering) TLEAD 260 ℃ Soldering, 10 sec 4
ESD (HBM) 2000 V HBM 4

CAD (KiCad official)

  • Symbol: XL1583E1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: xl1583e1-etched.step / xl1583e1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xl1583e1.step / xl1583e1.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
xl1583e1.step 122 KB You want the bare part, or you mark your own boards.
xl1583e1-etched.step 1.7 MB You want the part with XL1583E1 already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 427 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XLSEMI datasheet (10 pp, sha256 3c15efb52e39a748, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF