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Ray Publish 0.1.0 7548630 17d ago

XL1509A-12E1

XLSEMI(芯龙) · DC-DC Converters · SOP-8

XL1509A-12E1 from XLSEMI(芯龙), in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Power supply input pin, supporting a DC 4.5V to 50V wide operating voltage range; an electrolytic capacitor must be connected in parallel between VIN and GND to eliminate noise.
2 SW output Power switch output pin; SW is the switching node of the output power, with VSW limited to -0.3V to VIN per the absolute maximum ratings.
3 FB input Feedback pin that senses the output voltage through an external resistor divider to regulate it; the reference voltage is 1.23V for the adjustable version.
4 EN input Enable pin, active low: a low level turns the device on and a high level (above 1.4V) shuts it down, and it is pulled low when left floating.
5 GND power_in Ground pin.
6 GND power_in Ground pin.
7 GND power_in Ground pin.
8 GND power_in Ground pin.

Key specifications

Parameter Value
Manufacturer XLSEMI(芯龙)
Package SOP-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
输出电压 VOUT 11.82 12 12.18 V VIN =24V IOUT=0.25A 4
工作电压 VIN 4.5 50 V 5
振荡频率 FOSC 135 150 165 KHz 5
关机电流 IS 46 100 uA VEN =2V 5
静态电流 IQ 1.3 2 mA 注 2: 12V版本 VFB=15V 5
EN引脚阈值电压 高电平(关断) VEN_H 1.4 V 高电平(关断) 5
EN引脚阈值电压 低电平(开启) VEN_L 0.8 V 低电平(开启) 5
饱和压降 VCE 1.1 1.3 V VFB=0V IOUT=2A 5
最大占空比 DMAX 100 % VFB=0V 5
输入电压 VIN -0.3 60 V 3
反馈引脚电压 VFB -0.3 20 V 3
使能引脚电压 VEN -0.3 7 V 3
输出开关引脚电压 VSW -0.3 V max printed as VIN 3
操作结温 TJ -40 150 oC 3
贮存温度范围 TSTG -65 150 oC 3
引脚温度(焊接10秒) TLEAD 260 oC 焊接10秒 3
ESD (HBM) ESD 8000 V HBM; printed as >8000 3
开关电流限值 IL 3 A VFB =0V 5
EN引脚电流 IEN 5 uA VEN =2.0V 5
热关断温度 TSD 180 ℃ 5
热关断迟滞 TD 50 ℃ 5
热阻 (SOP8) 结到环境 RJA 100 oC /W 结到环境,无外部散热片 3

CAD (KiCad official)

  • Symbol: XL1509A-12E1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: xl1509a-12e1-etched.step / xl1509a-12e1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xl1509a-12e1.step / xl1509a-12e1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XLSEMI(芯龙) datasheet (17 pp, sha256 a4865b1dcf3ac763, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF