component
XL1509-ADJ
Public Made by Adomby adom
UMW DC-DC Converters, SOIC-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownXL1509-ADJ
UMW · DC-DC Converters · SOIC-8
XL1509-ADJ from UMW, in a SOIC-8. Pinout and pin descriptions extracted from the datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Supply Voltage Input Pin. Operates from a 4.5 V to 40 V DC supply (absolute max 45 V). Bypass VIN to GND with a suitably large capacitor (e.g. 470 uF/35 V in the typical application) to eliminate input noise. |
| 2 | OUTPUT | output | Power Switch Output Pin (SW). Internal power transistor switch node that supplies power to the external inductor/Schottky diode network driving the output. Rated -0.3 V to VIN. |
| 3 | FEEDBACK | input | Feedback Pin (FB). Through an external resistor divider network, FEEDBACK senses the output voltage and regulates it. The internal feedback threshold voltage is 1.23 V. Rated -0.3 V to VIN. |
| 4 | ON/OFF | input | Enable Pin with hysteresis. Drive ON/OFF low (TTL) to turn on the device; drive high to turn it off. Floating defaults to low (device ON). Rated -0.3 V to VIN. |
| 5 | GND | power_in | Ground Pin. Care must be taken in layout: this pin should be placed outside of the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing voltage noise into XL1509. Pins 5, 6, 7, 8 are all GND. |
| 6 | GND | power_in | Ground Pin. Care must be taken in layout: this pin should be placed outside of the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing voltage noise into XL1509. Pins 5, 6, 7, 8 are all GND. |
| 7 | GND | power_in | Ground Pin. Care must be taken in layout: this pin should be placed outside of the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing voltage noise into XL1509. Pins 5, 6, 7, 8 are all GND. |
| 8 | GND | power_in | Ground Pin. Care must be taken in layout: this pin should be placed outside of the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing voltage noise into XL1509. Pins 5, 6, 7, 8 are all GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | UMW |
| Package | SOIC-8 |
| Category | PMIC |
| Pins | 8 |
Ordering variants
Same part, different packaging or reel option.
Related parts (NOT interchangeable)
The extractor listed these alongside XL1509-ADJ, but they are different parts with different electrical characteristics. Do not order them as substitutes.
XL1509-ADJUMW XL1509-ADJXL1509-ADJUMW XL1509E-ADJ
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Oscillator Frequency | FOSC | 117 | 150 | 183 | Khz | VFB=0 | 6 |
| Input operation voltage | VIN | 4.5 | 40 | V | 6 | ||
| Output Voltage (ADJ version) | VOUT | 1.193 | 1.23 | 1.267 | V | TA=25°C; VIN=4.5V to 40V; ILOAD=0.2A to 2A; VIN=12V, VOUT=3V, IOUT=2A | 5 |
| Input operation voltage (recommended) | VIN | 4.5 | 40 | V | Pin description: XL1509 operates from a 4.5V to 40V DC voltage | 2 | |
| Input Voltage | VIN | -0.3 | 45 | V | 4 | ||
| Feedback Pin Voltage | VFB | -0.3 | V | Upper limit printed as VIN | 4 | ||
| ON/OFF Pin Voltage | VON/OFF | -0.3 | V | Upper limit printed as VIN | 4 | ||
| Output Switch Pin Voltage | VOutput | -0.3 | V | Upper limit printed as VIN | 4 | ||
| Operating Junction Temperature | TJ | -40 | 125 | °C | 4 | ||
| Storage Temperature | TSTG | -65 | 150 | °C | 4 | ||
| Lead Temperature (Soldering) | TLEAD | 260 | °C | Soldering, 10 sec | 4 | ||
| ESD (HBM) | ESD | 2000 | V | HBM | 4 | ||
| Thermal Resistance (SOIC8), Junction to Ambient | RJA | 100 | °C/W | No heatsink, free air | 4 |
CAD (KiCad official)
- Symbol:
XL1509-ADJ - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
xl1509-adj-etched.step/xl1509-adj-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xl1509-adj.step/xl1509-adj.glbare the bare package body.
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
xl1509-adj.step |
122 KB | You want the bare part, or you mark your own boards. |
xl1509-adj-etched.step |
1.8 MB | You want the part with XL1509-ADJ already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 454 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: UMW datasheet (15 pp, sha256
bd5713838034a224, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).