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XL13085

XINLUDA · RS-485/RS-422 ICs · SOP-8

XL13085 from XINLUDA, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: when RE is low, RO is high if (A - B) is greater than or equal to -50mV and low if (A - B) is less than or equal to -200mV.
2 RE input Receiver output enable: drive low to enable RO, which is high impedance when RE is high; driving RE high and DE low enters low-power shutdown, and RE is a hot-swap input.
3 DE input Driver output enable: drive high to enable the driver outputs, which are high impedance when DE is low; driving RE high and DE low enters low-power shutdown, and DE is a hot-swap input.
4 DI input Driver input: with DE high, a low on DI forces the noninverting output low and the inverting output high, and a high on DI forces the noninverting output high and the inverting output low.
5 GND power_in Ground reference for the device.
6 A bidirectional Noninverting receiver input and noninverting driver output on the RS-485/RS-422 bus.
7 B bidirectional Inverting receiver input and inverting driver output on the RS-485/RS-422 bus.
8 VCC power_in Positive supply, VCC = +5.0V ±10%; bypass VCC to GND with a 0.1µF capacitor.

Key specifications

Parameter Value
Manufacturer XINLUDA
Package SOP-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 6 V 3
Control input voltage VCIN 6 V 3
Driver input voltage VDIV 6 V 3
Driver output voltage VO -8 13 V 3
Output clamp current (printed unit V) IOC -8 13 V 3
Receiver input voltage IRIV -20 20 V 3
Driver output current IDOC -250 -250 mA Continuous 3
Continuous power dissipation PSO 471 mW TA = +70°C; SO derate 5.9mW/°C above +70°C 3
Operating temperature range Totr -40 85 ℃ Operating 3
Junction temperature TJT 150 ℃ 3
Storage temperature range TSTR -65 150 ℃ 3
Lead temperature (as printed) TLT -40 85 ℃ Soldering, 10s 3
Soldering temperature TSTL 260 ℃ Reflow 3
Supply-voltage range VCC 4.5 5.5 V VCC = +5.0V ±10% 4
Differential driver output (RS-422) VOD 3 V RL = 100Ω (RS-422), Figure 1 4
Differential driver output (RS-485) VOD 2 V RL = 54Ω (RS-485), Figure 1 4
Change in magnitude of differential output voltage ΔVOD 0.2 V RL = 100Ω or 54Ω, Figure 1 (Note 2) 4
Driver common-mode output voltage VOC 3 V RL = 100Ω or 54Ω, Figure 1 4
Change in magnitude of common-mode voltage ΔVOC 0.2 V RL = 100Ω or 54Ω, Figure 1 (Note 2) 4
Input-high voltage VIH 3 V DE, DI, RE 4
Input-low voltage VIL 0.8 V DE, DI, RE 4
Input current IIN1 -1 1 µA DE, DI, RE 4
Input impedance at first transition at power-up RPWUP 3.65 8.8 kΩ VDE, VRE = 2V 4
Input impedance on first transition after POR delay Rft 7 60 kΩ VDE = VRE = 2V 4
Driver short-circuit output current IOSD 40 250 mA 0 ≤ VOUT ≤ +12V (Note 3) 4
Driver short-circuit output current IOSD -250 -40 mA -7V ≤ VOUT ≤ VCC (Note 3) 4
Input current (A and B) IA, B 125 µA VDE = 0V, VCC = 0V or VCC, VIN = +12V 4
Input current (A and B) IA, B -100 µA VDE = 0V, VCC = 0V or VCC, VIN = -7V 4
Receiver differential threshold voltage VTH -200 -125 -50 mV -7V ≤ VCM ≤ +12V 4
RO output-low voltage VOL 0.4 V IO = 1mA 4
Receiver input resistance RIN 96 kΩ -7V ≤ VCM ≤ +12V 4
Supply current ICC 1.2 1.8 mA No load, VRE = 0V, DE = VCC 4
Supply current in shutdown mode ISHDN 2.8 10 µA RE = VCC, VDE = 0V 4
ESD protection for A and B, Human Body Model -15 15 kV Human Body Model 4
ESD protection for A and B, contact discharge -8 8 kV Contact discharge, IEC 61000-4-2, level 4 4
ESD protection for A and B, air-gap discharge -15 15 kV Air-gap discharge, IEC 61000-4-2 4
Driver propagation delay (low to high) tDPLH 200 1000 ns CL = 50pF, RL = 54Ω, Figures 2 and 3 5
Driver propagation delay (high to low) tDPHL 200 1000 ns CL = 50pF, RL = 54Ω, Figures 2 and 3 5
Driver differential output rise or fall time tR, tF 250 900 ns CL = 50pF, RL = 54Ω, Figures 2 and 3 5
Differential driver output skew tDSKEW 140 ns CL = 50pF, RL = 54Ω, Figures 2 and 3 5
Driver enable to output high tDZH 2500 ns Figure 4 5
Driver enable to output low tDZL 2500 ns Figure 5 5
Driver disable time from low tDLZ 100 ns Figure 5 5
Driver disable time from high tDHZ 100 ns Figure 4 5
Driver enable from shutdown to output high tDZH(SHDN) 5500 ns Figure 4 5
Driver enable from shutdown to output low tDZL(SHDN) 5500 ns Figure 5 5
Time to shutdown (driver) tSHDN 50 340 700 ns 5
Receiver propagation delay (low to high) tRPLH 200 ns CL = 15pF, Figures 6 and 7 5
Receiver propagation delay (high to low) tRPHL 200 ns CL = 15pF, Figures 6 and 7 5
Receiver output skew tRSKEW 30 ns CL = 15pF, Figures 6 and 7 5
Receiver enable to output low tRZL 50 ns Figure 8 5
Receiver enable to output high tRZH 50 ns Figure 8 5
Receiver disable time from low tRLZ 50 ns Figure 8 5
Receiver disable time from high tRHZ 50 ns Figure 8 5
Receiver enable from shutdown to output high tRZH(SHDN) 5500 ns Figure 8 5
Receiver enable from shutdown to output low tRZL(SHDN) 5500 ns Figure 8 5
Time to shutdown (receiver) tSHDN 50 340 700 ns 5

CAD (KiCad official)

  • Symbol: XL13085
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: xl13085-etched.step / xl13085-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xl13085.step / xl13085.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XINLUDA datasheet (18 pp, sha256 dfc197c1a314b055, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF