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XD833

Public Made by Adom

by adom

XINLUDA Operational Amplifier, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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XD833

XINLUDA · Operational Amplifier · DIP-8

XD833 from XINLUDA, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT1 output Amplifier 1 output; output short circuit to ground or either supply is unlimited in duration, with typical swing of ±14.1 V/-14.6 V into 10 kΩ.
2 IN1- input Amplifier 1 inverting input; input current is limited to ±10 mA and the input voltage must not exceed the supply voltage.
3 IN1+ input Amplifier 1 non-inverting input; input current is limited to ±10 mA and the input voltage must not exceed the supply voltage.
4 VCC- power_in Negative supply, recommended -5 V to -18 V (absolute maximum -18 V); VCC+ to VCC- must not exceed 36 V.
5 IN2+ input Amplifier 2 non-inverting input; input current is limited to ±10 mA and the input voltage must not exceed the supply voltage.
6 IN2- input Amplifier 2 inverting input; input current is limited to ±10 mA and the input voltage must not exceed the supply voltage.
7 OUT2 output Amplifier 2 output; output short circuit to ground or either supply is unlimited in duration, with typical swing of ±14.1 V/-14.6 V into 10 kΩ.
8 VCC+ power_in Positive supply, recommended 5 V to 18 V (absolute maximum 18 V); VCC+ to VCC- must not exceed 36 V.

Key specifications

Parameter Value
Manufacturer XINLUDA
Package DIP-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC+ VCC+ 18 V 3
Supply voltage VCC- VCC- -18 V 3
Supply voltage VCC+ - VCC- VCC+ -VCC- 36 V 3
Input current, either input -10 10 mA 3
Storage temperature range Tstg -65 150 °C 3
Operating virtual junction temperature TJ 150 °C 3
ESD Human-Body Model (HBM) 2.5 kV Human-Body Model (HBM) 3
ESD Charged-Device Model (CDM) 1.5 kV Charged-Device Model (CDM) 3
Package thermal impedance, junction to free air (P package) JA 85 °C/W P package 3
Supply voltage VCC- VCC- -18 -5 V 3
Supply voltage VCC+ VCC+ 5 18 V 3
Operating free-air temperature range TA -40 85 °C 3
Input offset voltage VIO 0.15 2 mV Vo = 0, Rs = 10 Ω, Vcm = 0, TA = 25°C 4
Input offset voltage VIO 3 mV Vo = 0, Rs = 10 Ω, Vcm = 0, TA = -40°C to 85°C 4
Input bias current IIB 300 750 nA Vo = 0, Vcm = 0, TA = 25°C 4
Input bias current IIB 800 nA Vo = 0, Vcm = 0, TA = -40°C to 85°C 4
Input offset current IIO 25 150 nA Vo = 0, Vcm = 0, TA = 25°C 4
Input offset current IIO 175 nA Vo = 0, Vcm = 0, TA = -40°C to 85°C 4
Common-mode input voltage range VICR -13 14 V ΔVIO = 5 mV, Vo = 0 4
Large-signal differential voltage amplification AVD 90 110 dB RL ≥ 2 kΩ, Vo = ±10 V, TA = 25°C 4
Large-signal differential voltage amplification AVD 85 dB RL ≥ 2 kΩ, Vo = ±10 V, TA = -40°C to 85°C 4
Maximum output voltage swing VOM+ VOM+ 13.2 13.8 V VID = ±1 V, RL = 2 kΩ 4
Maximum output voltage swing VOM- VOM- -13.7 -13.2 V VID = ±1 V, RL = 2 kΩ 4
Maximum output voltage swing VOM+ VOM+ 13.5 14.1 V VID = ±1 V, RL = 10 kΩ 4
Maximum output voltage swing VOM- VOM- -14.6 -14 V VID = ±1 V, RL = 10 kΩ 4
Common-mode rejection ratio CMMR 80 100 dB VIN = ±13 V 4
Supply-voltage rejection ratio KSVR 80 105 dB VCC+ = 5 V to 15 V, VCC- = -5 V to -15 V 4
Output short-circuit current, source IOS 15 29 mA /VID/ = 1 V, output to GND 4
Output short-circuit current, sink IOS -37 -20 mA /VID/ = 1 V, output to GND 4
Supply current (per channel) ICC 2.05 2.5 mA VO = 0, TA = 25°C 4
Supply current (per channel) ICC 2.75 mA VO = 0, TA = -40°C to 85°C 4
Slew rate at unity gain SR 5 7 V/ms AVD = 1, VIN = -10 V to 10 V, RL = 2 kΩ, CL = 100 pF 4
Gain bandwidth product GBW 10 16 MHz f = 100 kHz 4

CAD (KiCad official)

  • Symbol: XD833
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: xd833-etched.step / xd833-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xd833.step / xd833.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XINLUDA datasheet (17 pp, sha256 704964020f93a6a7, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF