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XD485

XINLUDA · RS-485/RS-422 ICs · DIP-8

XD485 from XINLUDA, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receive output, which is high resistance when RE is high.
2 RE input Receive Enable, active low; when high the receive output is high resistance.
3 DE input Transmit Enable, active high; when DE is low the transmit output is high resistance and the chip works in receive state.
4 DI input Transmit data input.
5 GND power_in Ground.
6 A bidirectional Receive input/transmit output (bus line A), ESD protected to ±15kV HBM.
7 B bidirectional Receive input/transmit output (bus line B), ESD protected to ±15kV HBM.
8 VCC power_in Power supply, operating range 4.5V to 5.5V (absolute maximum 6.5V).

Key specifications

Parameter Value
Manufacturer XINLUDA
Package DIP-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating voltage range Vcc 4.5 5.5 V 4
Driver differential output (with load) VOD2 1.5 V Figure 1, R=54Ω or R=27Ω 4
Driver differential output (no load) VOD1 5 V 4
Change in driver differential output amplitude ΔVOD 0.2 V 4
Driver common mode output voltage VOC 1 3 V 4
Change in driver common mode output voltage amplitude ΔVOC 0.2 V 4
Input high voltage VIH 2 V DE,RE,DI 4
Input low voltage VIL 0.8 V DE,RE,DI 4
Input current IIN1 -2 2 uA DE,RE,DI 4
Input current (A,B), VIN=5V IIN2 40 90 uA DE=0V, Vcc=5V, VIN=5V 4
Input current (A,B), VIN=0V IIN2 60 100 uA DE=0V, Vcc=5V, VIN=0V 4
Receiver differential input threshold voltage VTH -200 -50 mV -7V ≤ VCM ≤ +12V 4
Receiver input hysteresis ΔVTH 25 mV 4
Receiver output high VOH 4 V IO=-4mA 4
Receiver output low VOL 0.4 V IO=4mA 4
Receiver tri-state output current IOZR 1 uA 0.4V ≤ Vo ≤ 2.4V 4
Receiver input impedance RIN 96 kΩ -7V ≤ VCM ≤ +12V 4
No-load operating current, DE=Vcc ICC 480 600 uA No-load, RE=DI=GND or Vcc, DE=Vcc 4
No-load operating current, DE=GND ICC 450 600 uA No-load, RE=DI=GND or Vcc, DE=GND 4
Receiver output short-circuit current IOSR 50 mA 0V ≤ VRO ≤ VCC 4
ESD protection A/B, Human Body Model 8 15 kV A/B, Body Mode 4
Driver input to output delay tDPLH tDPLH 34 60 nS Figure 3 and Figure 5 RDIFF=50Ω, CL1=CL2=100pF 5
Driver input to output delay tDPHL tDPHL 34 60 nS Figure 3 and Figure 5 RDIFF=50Ω, CL1=CL2=100pF 5
Driver output skew tDSKEW -10 -2.5 10 nS Figure 3 and Figure 5 RDIFF=50Ω, CL1=CL2=100pF 5
Driver rise time tDR 10 25 nS Figure 3 and Figure 5 RDIFF=50Ω, CL1=CL2=100pF 5
Driver fall time tDF 10 25 nS Figure 3 and Figure 5 RDIFF=50Ω, CL1=CL2=100pF 5
Driver enable to output high tDZH 150 nS Figure 4 and Figure 6, CL=100pF, S2 close 5
Driver enable to output low tDZL 150 nS Figure 4 and Figure 6, CL=100pF, S1 close 5
Driver from low to off tDLZ 100 nS Figure 4 and Figure 6, CL=15pF, S1 close 5
Driver from high to off tDHZ 100 nS Figure 4 and Figure 6, CL=15pF, S2 close 5
Receiver input to output tRPLH tRPLH 150 nS Figure 7 and Figure 9, /VID/ ≥ 2.0V; VID rise and fall time ≤15nS 5
Receiver input to output tRPHL tRPHL 150 nS Figure 7 and Figure 9, /VID/ ≥ 2.0V; VID rise and fall time ≤15nS 5
Differential receiver offset tRSKEW -10 0 10 nS 5
Receiver enable to output low tRZL 20 50 nS Figure 2 and Figure 8 CL=100pF, S1 close 5
Receiver enable to output high tRZH 20 50 nS Figure 2 and Figure 8 CL=100pF, S2 close 5
Receiver low to off tRLZ 20 50 nS Figure 2 and Figure 8 CL=100pF, S1 close 5
Receiver high to off tRHZ 20 50 nS Figure 2 and Figure 8 CL=100pF, S2 close 5
Driver output short-circuit current IOD 100 mA Short-circuit current between A/B 5
Maximum data speed fMAX 10 Mbps 5
Supply voltage range VCC 6.5 V 3
Receiver input voltage (bus A, bus B) VBUS-IN -15 15 V 3
Driver output voltage (bus A, bus B) VBUS-OUT -15 15 V 3
Receiver output current IRO -60 60 mA 3
Continuous power consumption (DIP8) PD 470 mW TA=+70°C 3
Operation temperature range TOP -40 85 ℃ 3
Storage temperature range TSTG -55 150 ℃ 3
Operating temperature -40 85 °C 10

CAD (KiCad official)

  • Symbol: XD485
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: xd485-etched.step / xd485-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xd485.step / xd485.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XINLUDA datasheet (12 pp, sha256 466cd5ea90217763, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF