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Ray Publish 0.1.0 47afca6 11d ago

XD07

XINLUDA · Precision OpAmps · DIP-8

XD07 from XINLUDA, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OFFSET N1 input External input offset voltage adjustment pin (adjustable ±4 mV with a 20 kΩ potentiometer between N1 and N2, wiper to V+).
2 IN- input Inverting input of the amplifier.
3 IN+ input Noninverting input of the amplifier.
4 V- power_in Negative supply, operating range ±3 V to ±18 V dual supply (or GND for single supply).
5 NC unconnected Do not connect.
6 OUT output Amplifier output, typical swing ±12.8 V (±11.5 V min) at VS = ±15 V.
7 V+ power_in Positive supply, operating range ±3 V to ±18 V dual supply (6 V to 36 V single supply).
8 OFFSET N2 input External input offset voltage adjustment pin (adjustable ±4 mV with a 20 kΩ potentiometer between N1 and N2).

Key specifications

Parameter Value
Manufacturer XINLUDA
Package DIP-8
Category Amplifiers
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage, single supply VS 40 V Single supply 3
Supply voltage, dual supply VS -20 20 V Dual supply (±20) 3
Input voltage, differential -28 28 V Differential 3
Input voltage, single-ended -20 20 V Single-ended 3
Operating junction temperature TJ -40 85 °C 3
Storage temperature Tstg -55 125 °C 3
ESD HBM V(ESD) -1000 1000 V Human-body model, ANSI/ESDA/JEDEC JS-001 4
ESD CDM V(ESD) -1000 1000 V Charged-device model, JESD22-C101 4
Supply voltage, single supply VS 6 36 V Single supply 4
Supply voltage, dual supply VS -18 18 V Dual supply (±3 to ±18) 4
Common-mode input voltage VCM -13 13 V VS = ±15 V 4
Operating ambient temperature TA -40 85 °C 4
Junction-to-ambient thermal resistance RθJA 85 °C/W P (DIP) 8 pins 4
Junction-to-case (top) thermal resistance RθJC(top) 68.6 °C/W P (DIP) 8 pins 4
Junction-to-board thermal resistance RθJB 55.6 °C/W P (DIP) 8 pins 4
Junction-to-top characterization parameter ψJT 38.3 °C/W P (DIP) 8 pins 4
Junction-to-board characterization parameter ψJB 55.2 °C/W P (DIP) 8 pins 4
Input offset voltage VOS -60 60 μV XD07, TA = 25°C, VS = ±15 V 4
Input offset voltage over temperature VOS -85 85 μV XD07, TA = -40°C to 85°C 4
Input offset voltage drift dVOS/dT -0.5 0.5 μV/°C XD07, TA = -40°C to 85°C 4
Input bias current IB -1.8 1.8 nA XD07 4
Input bias current over temperature IB -2.2 2.2 nA XD07, TA = -40°C to 85°C 4
Input bias current drift -18 18 pA/°C XD07 4
Input offset current IOS -0.8 0.8 nA XD07 4
Input offset current over temperature IOS -1.6 1.6 nA XD07, TA = -40°C to 85°C 4
Offset adjustment range 4 mV Rs = 20 kΩ (±4) 4
Power supply rejection ratio PSRR 7 32 μV/V VS = ±3 V to ±18 V 4
Power supply rejection ratio over temperature PSRR 10 51 μV/V VS = ±3 V to ±18 V, TA = -40°C to 85°C 4
Common-mode voltage VCM 13 14 V ±13 min, ±14 typ 5
Common-mode voltage over temperature VCM 13 13.5 V TA = -40°C to 85°C 5
Common-mode rejection ratio CMRR 100 120 dB XD07, VCM = ±13 V 5
Common-mode rejection ratio over temperature CMRR 97 120 dB XD07, TA = -40°C to 85°C 5
Open-loop voltage gain AOL 100 400 V/mV XD07, 1.4 V < VO < 11.4 V, RL = 500 kΩ 5
Input resistance rI 7 33 MΩ 5
Voltage output swing 11.5 12.8 V ±11.5 min, ±12.8 typ 5
Voltage output swing over temperature 11 12.6 V TA = -40°C to 85°C 5
Power dissipation PD 80 150 mW No load 5
Power dissipation, VS = ±3 V PD 4 8 mW VS = ±3 V, no load 5
Long-term drift of input offset voltage 0.4 µV/mo ±0.4 4
Input offset current drift 12 pA/°C XD07 4
Unity gain bandwidth 0.4 0.6 MHz 5
Slew rate SR 0.3 V/μs VS = 5 V, RL = 2 kΩ 5
Input voltage noise 0.38 μVPP f = 0.1 Hz to 10 Hz 5
Input voltage noise density eN 9.8 nV/√Hz f = 1 kHz 5

CAD (KiCad official)

  • Symbol: XD07
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: xd07-etched.step / xd07-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xd07.step / xd07.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XINLUDA datasheet (12 pp, sha256 2050b4534c9afc01, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF