# XCH2310

**XCH(旭昌辉)** · IC · SOT-23

XCH2310 from XCH(旭昌辉), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±20 V, threshold 1.0 to 2.0 V at VDS=VGS, ID=250μA. |
| 2 | S | passive | Source; continuous drain current 3 A at TA=25℃ and body diode continuous forward current 3 A. |
| 3 | D | passive | Drain; drain-source voltage rated 60 V, continuous current 3 A, pulsed 12 A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | XCH(旭昌辉) |
| Package | SOT-23 |
| Category |  |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS |  |  | 60 | V |  | 1 |
| Gate-Source Voltage | VGSS | -20 |  | 20 | V |  | 1 |
| Continuous Drain Current | ID |  |  | 3 | A | TA = 25℃ | 1 |
| Continuous Drain Current | ID |  |  | 2 | A | TA = 100℃ | 1 |
| Pulsed Drain Current | IDM |  |  | 12 | A | note1 | 1 |
| Power Dissipation | PD |  |  | 1.5 | W | TA = 25℃ | 1 |
| Thermal Resistance, Junction to Ambient | RθJA |  |  | 83 | ℃/W |  | 1 |
| Operating and Storage Temperature Range | TJ, TSTG | -55 |  | 150 | ℃ |  | 1 |
| Drain-Source Breakdown Voltage | V(BR)DSS | 60 |  |  | V | VGS=0V, ID=250μA | 2 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | μA | VDS=60V, VGS=0V | 2 |
| Gate to Body Leakage Current | IGSS | -100 |  | 100 | nA | VDS=0V, VGS=±20V | 2 |
| Gate Threshold Voltage | VGS(th) | 1 | 1.4 | 2 | V | VDS=VGS, ID=250μA | 2 |
| Static Drain-Source on-Resistance | RDS(on) |  | 75 | 100 | mΩ | VGS=10V, ID=3A | 2 |
| Static Drain-Source on-Resistance | RDS(on) |  | 85 | 120 | mΩ | VGS=4.5V, ID=2A | 2 |
| Maximum Continuous Drain to Source Diode Forward Current | IS |  |  | 3 | A |  | 2 |
| Maximum Pulsed Drain to Source Diode Forward Current | ISM |  |  | 12 | A |  | 2 |
| Drain to Source Diode Forward Voltage | VSD |  |  | 1.2 | V | VGS = 0V, IS=3A | 2 |

## CAD (KiCad official)

- Symbol: `XCH2310`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `xch2310-etched.step` / `xch2310-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `xch2310.step` / `xch2310.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [XCH(旭昌辉) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603201070282137600) (5 pp, sha256 `2483dac0fa554285`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/xch2310-datasheet.pdf)