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XC6219B152MR-MS

MSKSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-5

XC6219B152MR-MS from MSKSEMI, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Power input pin; the supply must stay within the absolute maximum rating of -0.3V to 8V, and Vin is specified up to 8V.
2 GND power_in Ground pin; a 10uF input capacitor should connect between VIN and this pin, and the VIN-to-GND wiring resistance should be kept low to avoid instability.
3 CE input Chip enable pin that shuts down the internal circuitry; the datasheet suggests tying it to either a VIN or a VSS voltage, and its operating logic is set by the part's selection guide.
4 NC unconnected No connection; this pin is not connected internally.
5 VOUT power_out Regulated output (1.5V for the XC6219B152 variant, ±2% accuracy); an output capacitor of at least 10uF should be placed as close as possible to VOUT and GND.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOT-23-5
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage accuracy (tolerance) -2 2 % 2
Line Regulation △Vout1/(△Vin·Vout) 0.05 0.2 %/V 4.3V≤Vin≤8V, Iout=10mA 5
Load Regulation △Vout 10 30 V Vin= 4.3V, 1.0mA≤ Iout≤100mA 5
Output voltage Temperature Coefficient △Vout/(Ta·Vout) -100 100 ppm/C Iout=30mA, 0C≤Ta≤70C 5
Input Voltage Vin 8 V 5
Supply Voltage -0.3 8 V 4
Storage Temperature -50 125 C 4
Operating Temperature -40 85 C 4
Thermal Resistance (Junction to Ambient), SOT23-5 θJA 500 ℃/W Assume no ambient airflow, no heat sink 4
Power Dissipation, SOT23-5 PD 0.25 W Ta=25℃ 4

CAD (KiCad official)

  • Symbol: XC6219B152MR-MS
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: xc6219b152mr-ms-etched.step / xc6219b152mr-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xc6219b152mr-ms.step / xc6219b152mr-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (9 pp, sha256 86e38fb7ca4262ed, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF