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Contents

README

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XC6202P302MR-MS

MSKSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23

XC6202P302MR-MS from MSKSEMI, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT power_out Regulated output of the LDO; the 3.0 V version is specified at 70 mA minimum (100 mA typical) output current, and the datasheet lists 150 mA as the high output current feature.
2 VIN power_in Input supply pin; the absolute maximum limit power voltage is -0.3 V to +22 V, and the device is stated to withstand 20 V.
3 GND power_in Ground reference pin for the regulator.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOT-23
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage tolerance (accuracy) -2 2 % 2
Output Voltage VOUT 2.94 3 3.06 V VIN=VOUT+2.0V, IOUT=10mA 4
Output Current IOUT 70 100 mA VIN=VOUT+2.0V 4
Load Regulation ΔVOUT 25 60 mV VIN=VOUT+2.0V, 1mA≤IOUT≤50mA 4
Voltage Drop VDIF 30 100 mV IOUT=1mA, ΔVOUT=2% 4
Quiescent Current ISS 2 3 μA 4
Line Regulation ΔVOUT/VOUT*ΔVIN 0.2 %/V VOUT+1.0V≤VIN≤20V, IOUT=1mA 4
Input Voltage VIN 24 V 4
Output Voltage Temperature Coefficient ΔVOUT/ΔTA*VOUT -100 100 ppm/℃ VIN=VOUT+2.0V, IOUT=10mA, -40℃≤TA≤85℃ 4
Limit Power Voltage VIN -0.3 22 V 3
Storage Temperature Range TSTG -50 125 ℃ 3
Operating Free-air Temperature Range TA -40 85 ℃ 3
Thermal resistance, junction to ambient (SOT-23) θJA 500 ℃/W SOT-23 4
Power dissipation (SOT-23) PW 200 mW SOT-23 4

CAD (KiCad official)

  • Symbol: XC6202P302MR-MS
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: xc6202p302mr-ms-etched.step / xc6202p302mr-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xc6202p302mr-ms.step / xc6202p302mr-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (8 pp, sha256 d979d95867a7b655, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF