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XC6201P302MR-HXY

HXY MOSFET · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-5L

XC6201P302MR-HXY from HXY MOSFET, in a SOT-23-5L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Regulator input supply; withstands up to 12V (absolute maximum -0.3 to +15V) with recommended VOUT+2.0V for rated output.
2 GND power_in Ground reference for the regulator.
3 NC unconnected No connect pin with no internal function stated.
4 NC unconnected No connect pin with no internal function stated.
5 VOUT power_out Regulated 3.0V output (±2%) for the XC6201P30 variant, delivering up to 300mA with 400mA typical short-circuit current limit.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-23-5L
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage VOUT 2.94 3 3.06 V VIN=VOUT+2.0V, IOUT=10mA 3
Output Current IOUT 300 mA VIN=VOUT+2.0V 3
Load Regulation △ VOUT 37 100 mV VIN=VOUT+2.0V 1mA≤IOUT≤300mA 3
Voltage Drop VDIF 210 300 mV IOUT=100mA,△VOUT=2% 3
Quiescent Current ISS 3 μA 3
Line Regulation △ VOUT/ VOUT* △ VIN 0.2 %/V VOUT+1.0V≤VIN≤12V, IOUT=1mA 3
Input Voltage VIN 12 V 3
Temperature Coefficient △ VOUT/ △ TA*VOUT -100 100 ppm/℃ VIN=VOUT+2.0V,IOUT=10mA,-40℃≤TA≤85℃ 3
Output Short Circuit Current Ilim 400 mA VOUT=0V 3
Limit Power Voltage VIN -0.3 15 V 2
Storage Temperature Range TSTG -50 125 ℃ 2
Operating Free-air Temperature Range TA -40 85 ℃ 2
Thermal Resistance (SOT23-5) θJA 500 ℃/W 2
Power Dissipation (SOT23-5) PW 200 mW 2

CAD (KiCad official)

  • Symbol: XC6201P302MR-HXY
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5L (KiCad packages3D, STEP)
  • 3D model files: xc6201p302mr-hxy-etched.step / xc6201p302mr-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xc6201p302mr-hxy.step / xc6201p302mr-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (8 pp, sha256 96c1716c0c8691f1, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF