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XC32M4-32.768-F12NJDTL

HCI · Crystals · SMD3225-4P

XC32M4-32.768-F12NJDTL from HCI, in a SMD3225-4P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CRYSTAL passive Crystal terminal 1 of the quartz resonator.
2 N.C. or GND passive Connected to the metal lid; may be left open (floating) or connected to ground.
3 CRYSTAL passive Crystal terminal 2 of the quartz resonator.
4 N.C. or GND passive Connected to the metal lid; may be left open (floating) or connected to ground.

Key specifications

Parameter Value
Manufacturer HCI
Package SMD3225-4P
Category Crystal Oscillator/Oscillator/Resonator
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Nominal frequency range 8 60 MHz 1
Frequency tolerance (option) -10 10 ppm ±10ppm option of ±10/±20/±30ppm; other options available 1
Frequency tolerance (option) -20 20 ppm ±20ppm option of ±10/±20/±30ppm; other options available 1
Frequency tolerance (option) -30 30 ppm ±30ppm option of ±10/±20/±30ppm; other options available 1
Frequency stability (option) -10 10 ppm ±10ppm option of ±10/±15ppm; other options available 1
Frequency stability (option) -15 15 ppm ±15ppm option of ±10/±15ppm; other options available 1
Operating temperature range (option) -20 70 °C -20 to +70°C option; other options available 1
Operating temperature range (option) -30 85 °C -30 to +85°C option; other options available 1
Equivalent series resistance ESR 40 Ω 30.000 to 54.000MHz 1
Load capacitance 6 32 pF 6 ~ 32pF or SERIES; please specify 1
Shunt capacitance C0 3 pF 1
Drive level 100 300 µW 1
Storage temperature range Tstg -55 125 °C 1

CAD (KiCad official)

  • Symbol: XC32M4-32.768-F12NJDTL
  • Footprint: Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm
  • 3D model: SMD3225-4P (KiCad packages3D, STEP)
  • 3D model files: xc32m4-32-768-f12njdtl-etched.step / xc32m4-32-768-f12njdtl-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xc32m4-32-768-f12njdtl.step / xc32m4-32-768-f12njdtl.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HCI datasheet (1 pp, sha256 97563fdaed801469, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF