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XB8886G

Public Made by Adom

by adom

XySemi Battery Management ICs, ESOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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XB8886G

XySemi · Battery Management ICs · ESOP-8

XB8886G from XySemi, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VM input Negative terminal of the battery pack; the internal FET switch connects this terminal to GND. VM input pin voltage is rated -6 to 10 V (absolute maximum).
2 VM input Negative terminal of the battery pack; the internal FET switch connects this terminal to GND. VM input pin voltage is rated -6 to 10 V (absolute maximum).
3 VM input Negative terminal of the battery pack; the internal FET switch connects this terminal to GND. VM input pin voltage is rated -6 to 10 V (absolute maximum).
4 VM input Negative terminal of the battery pack; the internal FET switch connects this terminal to GND. VM input pin voltage is rated -6 to 10 V (absolute maximum).
5 GND power_in Ground; connect to the negative terminal of the battery.
6 VDD power_in Power supply pin; VDD input pin voltage is rated -0.3 to 6 V (absolute maximum).
7 GND power_in Ground; connect to the negative terminal of the battery.
8 GND power_in Ground; connect to the negative terminal of the battery.
9 EPAD power_in Exposed pad; must connect with GND of the XB8886G by mass metal.

Key specifications

Parameter Value
Manufacturer XySemi
Package ESOP-8
Category Power Management ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Overcharge Detection Voltage VCU 4.375 4.425 4.475 V 3
Overcharge Release Voltage VCL 4.2 4.25 4.3 V 3
Overdischarge Detection Voltage VDL 2.3 2.4 2.5 V 3
Overdischarge Release Voltage VDR 2.9 3 3.1 V 3
Overdischarge Current1 Detection IOV1 10.5 15 19.5 A VDD=3.6V 3
Overdischarge Current1 Recovery IROV1 30 50 80 uA VDD=3.6V 3
Overcharge Current Detection ICHOC 10 14 18 A VDD=3.6V 3
Load Short-Circuiting Detection Current ISHORT 30 60 80 A VDD=3.6V 3
Current Consumption in Normal Operation IOPE 7.8 13 uA VDD=3.6V, VM=0V 3
Current Consumption in Power Down IPDN 4.5 7 uA VDD=2.0V, VM pin floating 3
Internal Resistance between VM and VDD RVMD 100 150 200 kOhm VDD=2.0V, VM pin floating 3
Internal Resistance between VM and GND RVMS 7 12 18 kOhm VDD=3.6V, VM=1.0V 3
Equivalent FET on Resistance RSS(ON) 7 8.5 9 mOhm VDD=3.6V, IVM=1.0A 3
Overcharge Voltage Detection Delay Time tCU 80 130 180 mS 4
Overdischarge Voltage Detection Delay Time tDL 20 40 60 mS 4
Overdischarge Current Detection Delay Time tIOV 5 10 20 mS VDD=3.6V 4
Overcharge Current Detection Delay Time tCHOC 5 10 20 mS VDD=3.6V 4
Load Short-Circuiting Detection Delay Time tSHORT 180 380 600 uS VDD=3.6V 4
Over Temperature Protection TSHD+ 150 oC 4
Over Temperature Recovery Degree TSHD- 110 oC 4
VDD input pin voltage VDD -0.3 6 V 2
VM input pin voltage VM -6 10 V 2
Operating Ambient Temperature -40 85 °C 2
Maximum Junction Temperature 150 °C 3
Storage Temperature -55 150 °C 3
Lead Temperature (Soldering) 300 °C Soldering, 10 sec 3
Power Dissipation at T=25°C 0.625 W T=25°C 3
Package Thermal Resistance (Junction to Ambient) θJA 250 °C/W 3
Package Thermal Resistance (Junction to Case) θJC 130 °C/W 3
ESD 2000 V 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing ppa affecting the human body, such as exercise equipment ,medical equipment, security systems, gas equipment, or any apparatus installed in airplanes and other vehicles, 12

CAD (KiCad official)

  • Symbol: XB8886G
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: xb8886g-etched.step / xb8886g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xb8886g.step / xb8886g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XySemi datasheet (12 pp, sha256 5391def5ad1765b2, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF