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XB6536A
Public Made by Adomby adom
XySemi Battery Management ICs, DFN-6-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownXB6536A
XySemi · Battery Management ICs · DFN-6-EP(2x2)
XB6536A from XySemi, in a DFN-6-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Power supply input for the IC, connected to the positive terminal of the cell (absolute maximum -0.3 to 6 V). |
| 2 | GND | power_in | Ground pin; connect the negative terminal of the battery to this pin. |
| 3 | GND | power_in | Ground pin; connect the negative terminal of the battery to this pin. |
| 4 | VM | bidirectional | Negative terminal of the battery pack, connected internally to GND through the FET switch (absolute maximum -6 to 10 V). |
| 5 | VM | bidirectional | Negative terminal of the battery pack, connected internally to GND through the FET switch (absolute maximum -6 to 10 V). |
| 6 | VM | bidirectional | Negative terminal of the battery pack, connected internally to GND through the FET switch (absolute maximum -6 to 10 V). |
| 7 | EPAD | passive | Exposed pad; connect to a large metal GND area. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XySemi |
| Package | DFN-6-EP(2x2) |
| Category | Power Management ICs |
| Pins | 7 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Overcharge Detection Voltage | VCU | 4.25 | 4.3 | 4.35 | V | TA = 25°C | 3 |
| Overcharge Release Voltage | VCL | 4.05 | 4.1 | 4.15 | V | TA = 25°C | 3 |
| Overdischarge Detection Voltage | VDL | 2.3 | 2.4 | 2.5 | V | TA = 25°C | 3 |
| Overdischarge Release Voltage | VDR | 2.9 | 3 | 3.1 | V | TA = 25°C | 3 |
| Overdischarge Current1 Detection | IOV1 | 3.3 | 4.8 | 6.3 | A | VDD=3.6V | 3 |
| Overcharge Current Detection | ICHOC | 2.8 | 4 | 5.2 | A | VDD=3.6V | 3 |
| Load Short-Circuiting Detection | ISHORT | 10 | 20 | 30 | A | VDD=3.6V | 3 |
| Current Consumption in Normal Operation | IOPE | 2.8 | 6 | μA | VDD=3.6V, VM=0V | 3 | |
| Current Consumption in Power Down | IPDN | 1.5 | 3 | μA | VDD=2.0V, VM pin floating | 3 | |
| Internal Resistance between VM and VDD | RVMD | 200 | 300 | 400 | kΩ | VDD=2.0V, VM pin floating | 3 |
| Internal Resistance between VM and GND | RVMS | 10 | 20 | 30 | kΩ | VDD=3.6V, VM=1.0V | 3 |
| Equivalent FET on Resistance | RSS(ON) | 30 | 35 | 42 | mΩ | VDD=3.6V, IVM=1.0A | 3 |
| Overcharge Voltage Detection Delay Time | tCU | 80 | 130 | 200 | mS | 4 | |
| Overdischarge Voltage Detection Delay Time | tDL | 20 | 40 | 60 | mS | 4 | |
| Overdischarge Current Detection Delay Time | tIOV | 5 | 10 | 20 | mS | VDD=3.6V | 4 |
| Overcharge Current Detection Delay Time | tCHOC | 5 | 10 | 20 | mS | VDD=3.6V | 4 |
| Load Short-Circuiting Detection Delay Time | tSHORT | 70 | 140 | 230 | uS | VDD=3.6V | 4 |
| Over Temperature Protection | TSHD+ | 120 | °C | 3 | |||
| Over Temperature Recovery Degree | TSHD- | 100 | °C | 4 | |||
| VDD input pin voltage | VDD | -0.3 | 6 | V | 2 | ||
| VM input pin voltage | VM | -6 | 10 | V | 2 | ||
| Operating Ambient Temperature | -40 | 85 | °C | 2 | |||
| Maximum Junction Temperature | 125 | °C | 2 | ||||
| Storage Temperature | -55 | 150 | °C | 3 | |||
| Lead Temperature | 300 | °C | Soldering, 10 sec | 3 | |||
| Power Dissipation | 0.4 | W | T=25°C | 3 | |||
| HBM ESD | 2000 | V | 3 | ||||
| Package Thermal Resistance (Junction to Ambient) | θJA | 250 | °C/W | 3 | |||
| Package Thermal Resistance (Junction to Case) | θJC | 130 | °C/W | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | ppa | affecting the human body, such as exercise equipment ,medical equipment, security systems, gas equipment, or any apparatus installed in airplanes and other vehicles, | 13 |
CAD (KiCad official)
- Symbol:
XB6536A - Footprint:
Package_DFN_QFN:DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm - 3D model: DFN-6-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
xb6536a-etched.step/xb6536a-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xb6536a.step/xb6536a.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XySemi datasheet (13 pp, sha256
8a9346046c92c766, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).