component

XB3306A

Public Made by Adom

by adom

XySemi Battery Management, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management (pmic)xb3306afactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
xb3306a / README.md
History Download
Ray Publish 0.1.0 98adb6e 17d ago

XB3306A

XySemi · Battery Management · SOT-23

XB3306A from XySemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VM passive Negative terminal of the battery pack (charger/load negative); the internal FET switch connects it to GND, with an internal RVMS of 100 kΩ to GND and RVMD of 320 kΩ to VDD, and its abs max input voltage is -6 to 10 V.
2 VDD power_in IC supply pin connected to the battery cell positive terminal, abs max input voltage -0.3 to 6 V.
3 GND power_in Ground pin, connected to the negative terminal of the battery cell.

Key specifications

Parameter Value
Manufacturer XySemi
Package SOT-23
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Overcharge detection voltage VCU 4.25 4.3 4.35 V 3
Overcharge release voltage VCL 4.05 4.1 4.15 V 3
Overdischarge detection voltage VDL 2.3 2.4 2.5 V 3
Overdischarge release voltage VDR 2.9 3 3.1 V 3
Normal operating current IOPE 2.8 6 μA VDD=3.6V, VM=0V 3
Power-down current IPDN 1.5 3 μA VDD=2.0V, VM pin open 3
Overcurrent 1 detection current IOV1 3 A VDD=3.6V 3
Load short-circuit detection current ISHORT 20 A VDD=3.6V 3
Internal resistance between VM and VDD RVMD 320 kΩ VDD=2.0V, VM pin open 3
Internal resistance between VM and GND RVMS 100 kΩ VDD=3.6V, VM=1.0V 3
FET equivalent on-resistance RSS(ON) 40 mΩ VDD=3.6V, IVM=1.0A 3
Overtemperature protection temperature TSHD+ 120 oC 3
Overtemperature protection recovery temperature TSHD- 100 oC 3
Overcharge detection delay time tCU 130 mS 4
Overdischarge detection delay time tDL 40 mS 4
Overcurrent detection delay time tIOV 10 mS VDD=3.6V 4
Short-circuit detection delay time tSHORT 75 uS VDD=3.6V 4
VDD input voltage VDD -0.3 6 V 2
VM input voltage VM -6 10 V 2
Operating ambient temperature -40 85 °C 2
Maximum junction temperature 125 °C 2
Storage temperature -55 150 °C 3
Lead temperature (soldering, 10 s) 300 °C 10 s soldering 3
Power dissipation at ambient 25°C 0.4 W ambient 25°C 3
Package thermal resistance (junction to ambient, as printed) θJA 250 °C/W 3
Package thermal resistance (as printed) θJC 130 °C/W 3
ESD rating 2000 V 3

CAD (KiCad official)

  • Symbol: XB3306A
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: xb3306a-etched.step / xb3306a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xb3306a.step / xb3306a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XySemi datasheet (12 pp, sha256 aa2c22478b7e980a, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF