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Ray Publish 0.1.0 aab7608 16d ago

X5163S8Z-2.7

RENESAS · Monitors & Reset Circuits · SOIC-8

X5163S8Z-2.7 from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS/WDI input Chip select input: HIGH deselects the device (SO high impedance, standby), LOW enables it; a HIGH to LOW transition is required after power-up, and as watchdog input a HIGH to LOW transition restarts the watchdog timer, otherwise RESET/RESET goes active.
2 SO tri_state Push/pull serial data output that shifts data out on the falling edge of SCK and is high impedance when CS is HIGH.
3 WP input Write protect input that works with the nonvolatile WPEN bit to lock the watchdog timer control and memory write protect bits (In-Circuit Programmable ROM mode when LOW with WPEN=1).
4 VSS power_in Ground.
5 SI input Serial data input for all opcodes, byte addresses and memory data, MSB first, latched on the rising edge of SCK.
6 SCK input Serial clock controlling bus timing; rising edge latches opcode, address or data on SI and falling edge changes data on SO (max 2MHz).
7 RESET output Open drain reset output (active LOW on X5163) that goes active when VCC falls below the VTRIP sense level (2.55-2.7V for -2.7) or on watchdog timeout, stays active 200ms after VCC recovers, and is valid from VCC = 1V.
8 VCC power_in Supply voltage, 2.7V to 5.5V for the -2.7 version.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reset Trip Point Voltage X5163-2.7 VTRIP 2.55 2.63 2.7 V X5163-2.7, X5165-2.7 15
Supply Voltage VCC 2.7 5.5 V 12
Operating Temperature (X5163S8Z-2.7) 0 70 °C Ordering table, 8 Ld SOIC, 0 to 70 2
Temperature range (recommended operating conditions) -40 85 °C 12
Temperature under bias -65 135 °C 12
Storage temperature -65 150 °C 12
Voltage on any pin with respect to VSS -1 7 V 12
D.C. output current 5 mA 12
Lead temperature (soldering, 10s) 300 °C 12
VCC Write Current (Active) ICC1 5 mA SCK = VCC x 0.1/VCC x 0.9 @ 2MHz, SO = Open 12
VCC Read Current (Active) ICC2 0.4 mA SCK = VCC x 0.1/VCC x 0.9 @ 2MHz, SO = Open 12
VCC Standby Current WDT = OFF ISB1 1 µA CS = VCC, VIN = VSS or VCC, VCC = 5.5V 12
VCC Standby Current WDT = ON ISB2 50 µA CS = VCC, VIN = VSS or VCC, VCC = 5.5V 12
VCC Standby Current WDT = ON ISB3 20 µA CS = VCC, VIN = VSS or VCC, VCC = 3.6V 12
Input Leakage Current ILI 0.1 10 µA VIN = VSS to VCC 12
Output Leakage Current ILO 0.1 10 µA VOUT = VSS to VCC 12
Input LOW Voltage VIL -0.5 0.3 V max is VCC x 0.3 12
Input HIGH Voltage VIH 0.7 0.5 V min is VCC x 0.7; max is VCC + 0.5 12
Output LOW Voltage VOL1 0.4 V VCC > 3.3V, IOL = 2.1mA 12
Output HIGH Voltage VOH1 0.8 V VCC > 3.3V, IOH = -1.0mA; min is VCC - 0.8 12
Output HIGH Voltage VOH2 0.4 V 2V < VCC ≤ 3.3V, IOH = -0.4mA; min is VCC - 0.4 12
Reset Output LOW Voltage VOLS 0.4 V IOL = 1mA 12
Output Capacitance (SO, RESET, RESET) COUT 8 pF TA = +25°C, f = 1MHz, VCC = 5V, VOUT = 0V 12
Input Capacitance (SCK, SI, CS, WP) CIN 6 pF TA = +25°C, f = 1MHz, VCC = 5V, VIN = 0V 12
Clock Frequency fSCK 0 2 MHz 2.7-5.5V 13
Cycle Time tCYC 500 ns 2.7-5.5V 13
CS Lead Time tLEAD 250 ns 2.7-5.5V 13
CS Lag Time tLAG 250 ns 2.7-5.5V 13
Clock HIGH Time tWH 200 ns 2.7-5.5V 13
Clock LOW Time tWL 200 ns 2.7-5.5V 13
Data Setup Time tSU 50 ns 2.7-5.5V 13
Data Hold Time tH 50 ns 2.7-5.5V 13
Input Rise Time tRI 100 ns 2.7-5.5V 13
Input Fall Time tFI 100 ns 2.7-5.5V 13
CS Deselect Time tCS 500 ns 2.7-5.5V 13
Write Cycle Time tWC 10 ms 2.7-5.5V 13
Output Disable Time tDIS 250 ns 2.7-5.5V 14
Output Valid from Clock Low tV 200 ns 2.7-5.5V 14
Output Hold Time tHO 0 ns 2.7-5.5V 14
Output Rise Time tRO 100 ns 2.7-5.5V 14
Output Fall Time tFO 100 ns 2.7-5.5V 14
Power-up Reset Time Out tPURST 100 200 280 ms 15
VCC Detect to Reset/Output tRPD 500 ns 15
VCC Fall Time tF 100 µs 15
VCC Rise Time tR 100 µs 15
Reset Valid VCC VRVALID 1 V 15
VTRIP Hysteresis VTH 20 mV HIGH to LOW vs. LOW to HIGH VTRIP voltage 15
Watchdog Time Out Period tWDO 100 200 300 ms WD1 = 1, WD0 = 0 15
Watchdog Time Out Period tWDO 450 600 800 ms WD1 = 0, WD0 = 1 15
Watchdog Time Out Period tWDO 1 1.4 2 sec WD1 = 0, WD0 = 0 15
CS Pulse Width to Reset the Watchdog tCST 400 ns 15
Reset Time Out tRST 100 200 300 ms 15

CAD (KiCad official)

  • Symbol: X5163S8Z-2.7
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: x5163s8z-2-7-etched.step / x5163s8z-2-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); x5163s8z-2-7.step / x5163s8z-2-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (22 pp, sha256 aeeab924f9892e1f, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF