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X0405C

FUXINSEMI · TRIACs · TO-126-3

X0405C from FUXINSEMI, in a TO-126-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the SCR (K1), the return terminal for the on-state current and gate drive.
2 A passive Anode of the SCR (A2), which blocks VDRM/VRRM of 600/800 V and carries up to 4.0 A RMS on-state current.
3 G input Gate trigger input (G3) with IGT of 10 to 200 μA max at VD=12 V and VGT max 0.8 V.

Key specifications

Parameter Value
Manufacturer FUXINSEMI
Package TO-126-3
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate trigger current IGT 10 200 μA VD =12V RL=140Ω Tj =25℃ 2
Gate trigger voltage VGT 0.8 V 2
Gate non-trigger voltage VGD 0.2 V VD =VDRM RGK=1kΩ Tj =110℃ 2
Latching current IL 6 mA IG=1mA RGK=1kΩ Tj =25℃ 2
Holding current IH 5 mA IT=50mA RGK=1kΩ Tj =25℃ 2
Critical-rate of rise of commutation voltage dVD/dt 10 V/μs VD=2/3VDRM RGK=1kΩ Tj =110℃ 2
Forward on voltage VTM 1.55 V ITM =8A tp=380μs 2
Repetitive Peak Off-State Current IDRM 5 μA VD =VDRM VR =VRRM Tj=25℃ 2
Repetitive Peak Reverse Current IRRM 0.15 mA Tj=110℃ 2
RMS on-state current IT(RMS) 4 A 2
Non repetitive surge peak on-state current ITSM 30 A full cycle, F=50Hz 2
I2t value for fusing I2t 4.5 A2s tp=10ms 2
Critical rate of rise of on-state current dIT/dt 50 A/μs IG =2×IGT 2
Peak gate current IGM 1.2 A 2
Average gate power dissipation PG(AV) 0.2 W 2
Junction Temperature TJ -40 110 ℃ 2
Storage Temperature TSTG -40 150 ℃ 2
Thermal resistance junction to case Rth(j-c) 7.2 ℃/W Junction to case (AC) 2
Thermal resistance junction to ambient Rth(j-a) 100 ℃/W Junction to ambient 2

CAD (KiCad official)

  • Symbol: X0405C
  • Footprint: Package_TO_SOT_THT:TO-126-3_Vertical
  • 3D model: TO-126-3 (KiCad packages3D, STEP)
  • 3D model files: x0405c-etched.step / x0405c-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); x0405c.step / x0405c.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: FUXINSEMI datasheet (4 pp, sha256 a04e7b8c7f2ee90b, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF