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WS3243FCA

GEC · RS232 ICs · SSOP-28-208mil

WS3243FCA from GEC, in a SSOP-28-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 C2P passive Positive terminal of the inverting charge-pump capacitor, connected to the internal switched-capacitor voltage converter.
2 C2N passive Negative terminal of the inverting charge-pump capacitor, connected to the internal switched-capacitor voltage converter.
3 VN power_out Negative rail of about -5.4 V generated by the internal charge pump.
4 R1IN input Input of the first RS-232 receiver, accepting RS-232 level signals (-18 V to +18 V per the datasheet).
5 R2IN input Input of the second RS-232 receiver, accepting RS-232 level signals (-18 V to +18 V per the datasheet).
6 R3IN input Input of the third RS-232 receiver, accepting RS-232 level signals (-18 V to +18 V per the datasheet).
7 R4IN input Input of the fourth RS-232 receiver, accepting RS-232 level signals (-18 V to +18 V per the datasheet).
8 R5IN input Input of the fifth RS-232 receiver, accepting RS-232 level signals (-18 V to +18 V per the datasheet).
9 T1OUT output Output of the first RS-232 driver, delivering RS-232 level signals.
10 T2OUT output Output of the second RS-232 driver, delivering RS-232 level signals.
11 T3OUT output Output of the third RS-232 driver, delivering RS-232 level signals.
12 T3IN input TTL/CMOS input of the third RS-232 driver.
13 T2IN input TTL/CMOS input of the second RS-232 driver.
14 T1IN input TTL/CMOS input of the first RS-232 driver.
15 R5OUT output TTL-level output of the fifth RS-232 receiver.
16 R4OUT output TTL-level output of the fourth RS-232 receiver.
17 R3OUT output TTL-level output of the third RS-232 receiver.
18 R2OUT output TTL-level output of the second RS-232 receiver.
19 R1OUT output TTL-level output of the first RS-232 receiver.
20 R2OUTB output Non-inverting TTL-level output of the second RS-232 receiver, always enabled.
21 XIDLE output TTL/CMOS output indicating the XPWRSAVE or shutdown state.
22 XSD input Active-low shutdown control that turns off the drivers and the voltage converter.
23 XPWRSAVE input Power-save control; a high level forces the drivers enabled (SHUTDOWN must be high).
24 C1N passive Negative terminal of the boost charge-pump capacitor.
25 GND power_in Ground reference for the device.
26 VCC power_in Supply voltage of +3 V to +5.5 V (recommended operation 3 V to 5.25 V).
27 VP power_out Positive rail of about +5.4 V generated by the internal charge pump.
28 C1P passive Positive terminal of the boost charge-pump capacitor.

Key specifications

Parameter Value
Manufacturer GEC
Package SSOP-28-208mil
Category Interface
Pins 28

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating temperature range TA -40 25 85 ℃ Industrial grade; typ at 25°C 2
Supply voltage VCC 3 5 V VCC = +3.3V or +5V; typ printed as 3.3/5 2
Operating current, XPWRSAVE disabled 0.5 1 mA XPWRSAVE=VCC; XSD=VCC; TTL inputs=VCC/GND; RS-232 input=float; VCC=3.3V 2
Operating current, XPWRSAVE enabled 1 10 uA XPWRSAVE=GND; XSD=VCC; TTL inputs=VCC/GND; RS-232 input=float; VCC=3.3V 2
Shutdown current 1 10 uA XPWRSAVE=VCC/GND; XSD=GND; TTL inputs=VCC/GND; RS-232 inputs=float; VCC=3.3V 2
Driver input threshold voltage Low 0.8 V VCC = +3.3V or VCC = +5V supply 2
Driver input threshold voltage High 2.4 V 2
Driver input leakage current -1 0.1 1 uA 2
Receiver output voltage Low 0.4 V IOUT = 1.6mA 2
Receiver output leakage current -10 0.1 10 uA Receiver outputs disabled; VOUT = VCC or GND; XSD = GND 2
Receiver input voltage swing -18 18 V TA = 25°C; VCC = 3.3V or +5V supply 2
Receiver input threshold voltage Low 0.8 V 2
Receiver input threshold voltage High 2.4 V 2
Receiver input resistance 3 5 7 KΩ VIN = ±18V; TA = 25°C 2
Driver output voltage swing -5 5 V RL = 3kΩ; all outputs loaded 2
Driver output short-circuit current -60 60 mA VOUT = GND 2
Driver output leakage current -5 5 uA Transmitter disabled; VOUT = ±12V 2
Driver output voltage (T1OUT, T2OUT) -5 5 V T1IN=T2IN=GND; T3IN=VCC; T3OUT=3kΩ; T1OUT=T2OUT=-2.5mA 3
Charge pump capacitor C1P, C1N, C2P, C2N 0.1 0.1 1 uF 2
Maximum operating voltage VCC 7 V 6
Positive charge pump voltage VP -0.3 7 V 6
Negative charge pump voltage VN -7 0.3 V 6
Driver input pins TxIN, XEN, XSD, XPWRSAVE voltage TxIN -0.3 7 V 6
Receiver input pins RxIN voltage RxIN -18 18 V 6
Driver output pins TxOUT voltage TxOUT -15 15 V 6
Receiver output pins RxOUT voltage RxOUT -0.3 V Upper limit printed as VCC+0.3; not converted 6
Storage temperature TSTG -65 150 ℃ 6
Maximum junction temperature TJ 150 ℃ 6
ESD-HBM ESD-HBM 2000 V 6
Recommended operating voltage VDD 3 5.25 V Typ printed as 3.3/5 6
Recommended operating temperature TA -40 85 ℃ 6
ESD HBM, RS-232 inputs and outputs -15 15 KV RS-232 inputs and outputs 3
ESD EN61000-4-2 contact discharge -8 8 KV EN61000-4-2 contact discharge 3
ESD EN61000-4-2 air gap discharge -15 15 KV EN61000-4-2 air gap discharge 3
Driver input hysteresis 0.5 V 2
Receiver input hysteresis 0.5 V 2
Output resistance 300 Ω VCC = VP = VN = GND; VOUT = ±2V 2
Maximum data rate 1000 Kbps RL = 3kΩ; CL = 250pF; one transmitter switching; TA = 25°C 3
Transition slew rate 60 V/uS RL = 3~7kΩ; CL = 150pF to 250pF; one transmitter switching; TA = 25°C; measured from 3V to -3V or -3V to 3V 3
Driver input propagation delay 2 uS RL=3kΩ; CL=150pF; all loaded 3
Driver output propagation delay 2 uS 3
Driver input-to-output delay difference 100 nS 3
Driver enable to output time 400 nS 3
Driver output high to shutdown time 250 nS 3
Receiver input propagation delay 0.15 uS CL=150pF 3
Receiver output propagation delay 0.15 uS 3
Receiver input-to-output delay difference 50 nS 3
Receiver enable to output time 200 nS 3
Receiver output high to shutdown time 200 nS 3
Receiver input to XIDLE output high 1 uS 3
Receiver input to XIDLE output low 30 uS 3
Power save mode to driver enable 100 uS 3

CAD (KiCad official)

  • Symbol: WS3243FCA
  • Footprint: Package_SO:SSOP-28_5.3x10.2mm_P0.65mm
  • 3D model: SSOP-28-208mil (KiCad packages3D, STEP)
  • 3D model files: ws3243fca-etched.step / ws3243fca-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ws3243fca.step / ws3243fca.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GEC datasheet (10 pp, sha256 2cafdfa691e32143, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF