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Contents

README

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WS3085W

GEC · RS-485/RS-422 ICs · SOP-8

WS3085W from GEC, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output. When the receiver is enabled and V(A)-V(B) > -50mV, RO drives high; when V(A)-V(B) < -200mV, RO drives low. Fail-safe: outputs high when inputs are open or shorted.
2 /RE input Receiver output enable (active low). RO is enabled when /RE is low and disabled (high-Z) when /RE is high. With /RE=high and DE=low the chip enters low-power shutdown mode (typ. 1.8 µA).
3 DE input Driver output enable (active high). When DE is high the driver is enabled; when DE is low the driver outputs are high impedance. With /RE=high and DE=low the chip enters shutdown mode.
4 DI input Driver input. When DI is low the non-inverting driver output (A) is forced low and the inverting output (B) is forced high; when DI is high, A is forced high and B is forced low. VIH ≥ 2.0V, VIL ≤ 0.8V.
5 GND power_in Ground reference for the device.
6 A bidirectional RS-485/RS-422 bus interface: non-inverting driver output and non-inverting receiver input. Provides ±15kV HBM / ±12kV IEC 61000-4-2 contact-discharge ESD protection. Absolute range -8V to +13V.
7 B bidirectional RS-485/RS-422 bus interface: inverting driver output and inverting receiver input. Provides ±15kV HBM / ±12kV IEC 61000-4-2 contact-discharge ESD protection. Absolute range -8V to +13V.
8 VCC power_in Positive supply, 3.0V to 5.25V (nominal 3.3V/5V). Bypass to GND with a 0.1 µF ceramic capacitor. Typical ICC 450 µA (max 600 µA) no-load; 1.8 µA typ in shutdown.

Key specifications

Parameter Value
Manufacturer GEC
Package SOP-8
Category Comm/UART
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • WS3085WEESA

CAD (KiCad official)

  • Symbol: WS3085W
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: ws3085w-etched.step / ws3085w-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ws3085w.step / ws3085w.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GEC datasheet (10 pp, sha256 83e24e937c025f43, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF