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WPM5001-3

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WILLSEMI Will Semicon MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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WPM5001-3

WILLSEMI Will Semicon · MOSFETs · SOT-23

WPM5001-3 from WILLSEMI Will Semicon, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; P-channel gate with ESD protection, gate-source voltage limited to ±20 V and threshold of -0.8 to -2.0 V.
2 S passive Source of the P-channel MOSFET; body diode runs between source and drain.
3 D passive Drain; drain-source voltage rated -50 V with continuous drain current of -0.2 A (10 s, TA=25°C).

Key specifications

Parameter Value
Manufacturer WILLSEMI Will Semicon
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -50 V 2
Gate-Source Voltage VGS -20 20 V 2
Continuous Drain Current ID -0.2 A TA=25°C, t≤10 s; footnote a,d (1 in² pad) 2
Continuous Drain Current ID -0.18 A TA=25°C, steady state; footnote a,d (1 in² pad) 2
Continuous Drain Current ID -0.16 A TA=70°C, t≤10 s; footnote a,d (1 in² pad) 2
Continuous Drain Current ID -0.14 A TA=70°C, steady state; footnote a,d (1 in² pad) 2
Continuous Drain Current ID -0.19 A TA=25°C, t≤10 s; footnote b (minimum pad) 2
Continuous Drain Current ID -0.17 A TA=25°C, steady state; footnote b (minimum pad) 2
Continuous Drain Current ID -0.15 A TA=70°C, t≤10 s; footnote b (minimum pad) 2
Maximum Power Dissipation PD 0.4 W TA=25°C, t≤10 s; footnote a,d (1 in² pad) 2
Maximum Power Dissipation PD 0.37 W TA=25°C, steady state; footnote a,d (1 in² pad) 2
Maximum Power Dissipation PD 0.29 W TA=70°C, t≤10 s; footnote a,d (1 in² pad) 2
Maximum Power Dissipation PD 0.23 W TA=70°C, steady state; footnote a,d (1 in² pad) 2
Maximum Power Dissipation PD 0.3 W TA=25°C, steady state; footnote b (minimum pad) 2
Maximum Power Dissipation PD 0.26 W TA=70°C, t≤10 s; footnote b (minimum pad) 2
Maximum Power Dissipation PD 0.22 W TA=70°C, steady state; footnote b (minimum pad) 2
Pulsed Drain Current IDM -0.8 A Pulse width<380µs, duty cycle<2% (footnote c) 2
Operating Junction Temperature TJ -55 150 °C 2
Lead Temperature TL 260 °C 2
Storage Temperature Range Tstg -55 150 °C 2
Gate Threshold Voltage VGS(TH) -0.8 -1.5 -2 V VGS = VDS, ID = -250uA 3
Drain-to-Source On-resistance RDS(on) 3 8 Ω VGS = -10V, ID = -0.4A 3
Drain-to-Source On-resistance RDS(on) 3.5 10 Ω VGS = -5V, ID = -0.3A 3
Gate-to-source Leakage Current IGSS -5 5 uA VDS = 0 V, VGS = ±20V 3
Zero Gate Voltage Drain Current IDSS -1 uA VDS = -50V, VGS = 0V 3
Forward Voltage VSD -0.9 -1.5 V VGS = 0 V, IS = -0.25A 3
Junction-to-Ambient Thermal Resistance (footnote a, t≤10 s) RθJA 240 270 °C/W t≤10 s; surface mounted on FR-4, 1 in² pad, 1oz copper 2
Junction-to-Ambient Thermal Resistance (footnote a, steady state) RθJA 280 335 °C/W Steady state; surface mounted on FR-4, 1 in² pad, 1oz copper 2
Junction-to-Ambient Thermal Resistance (footnote b, t≤10 s) RθJA 270 300 °C/W t≤10 s; surface mounted on FR-4, minimum pad, 1oz copper 2
Junction-to-Ambient Thermal Resistance (footnote b, steady state) RθJA 300 350 °C/W Steady state; surface mounted on FR-4, minimum pad, 1oz copper 2
Junction-to-Case Thermal Resistance RθJC 130 180 °C/W Steady state 2

CAD (KiCad official)

  • Symbol: WPM5001-3
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: wpm5001-3-etched.step / wpm5001-3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); wpm5001-3.step / wpm5001-3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI Will Semicon datasheet (8 pp, sha256 6e17976c5651bfe9, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF