# WPE1261KP1

**WPMtek(Wei Pan Microelectronics)** · ESD And Surge Protection (TVS/ESD) · DFN1006-2

WPE1261KP1 from WPMtek(Wei Pan Microelectronics), in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised bidirectional ESD/TVS diode; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised bidirectional ESD/TVS diode; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | WPMtek(Wei Pan Microelectronics) |
| Package | DFN1006-2 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Pulse Power (8/20µs) | Ppk |  |  | 180 | W | 8/20µs | 2 |
| Peak Pulse Current (8/20µs) | Ipp |  |  | 8 | A | 8/20µs | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD | -30 |  | 30 | kV | IEC 61000-4-2 air discharge | 2 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 |  | 30 | kV | IEC 61000-4-2 contact discharge | 2 |
| Operating Temperature Range | TJ | -55 |  | 125 | °C |  | 2 |
| Storage Temperature Range | Tstg | -55 |  | 150 | °C |  | 2 |
| Reverse Working Voltage | VRWM |  |  | 12 | V |  | 2 |
| Breakdown Voltage | VBR |  |  | 13.3 | V | IT = 1mA | 2 |
| Reverse Leakage Current | IR |  |  | 50 | nA | VRWM = 12V | 2 |
| Clamping Voltage | VC |  |  | 15.5 | V | IPP = 1A (8 x 20µs pulse) | 2 |
| Clamping Voltage | VC |  |  | 22.5 | V | IPP = 8A (8 x 20µs pulse) | 2 |
| Junction Capacitance | CJ |  |  | 30 | pF | VR = 0V, f = 1MHz | 2 |

## CAD (KiCad official)

- Symbol: `WPE1261KP1`
- Footprint: `Diode_SMD:D_SOD-882`
- 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files: `wpe1261kp1-etched.step` / `wpe1261kp1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `wpe1261kp1.step` / `wpe1261kp1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [WPMtek(Wei Pan Microelectronics) datasheet](docs/wpe1261kp1-datasheet.pdf) (5 pp, sha256 `e8a4c4d0c69660ca`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/wpe1261kp1-datasheet.pdf)