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WL9005HS3-30

WPMtek Wei Pan Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-3

WL9005HS3-30 from WPMtek Wei Pan Microelectronics, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin of the regulator (SOT23-3 pin assignment inferred from the page 2 figure, see review_required).
2 VOUT power_out Output pin, sourcing up to 500 mA with VOUT to GND absolute limits of -0.3 V to 5 V (SOT23-3 pin assignment inferred from the page 2 figure, see review_required).
3 VIN power_in Input pin, operating input voltage 1.2 V to 6.0 V with VIN to GND absolute limits of -0.3 V to 6 V (SOT23-3 pin assignment inferred from the page 2 figure, see review_required).

Key specifications

Parameter Value
Manufacturer WPMtek Wei Pan Microelectronics
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage tolerance (fixed 3.0V output) VOUT -2 2 % 1
Output current IOUT_MAX 500 mA 4
Operating input voltage VIN 1.2 6 V 4
EN high level VENH 0.83 V Enabled 4
EN low level VENL 0.78 V Shutdown 4
VIN to GND voltage VIN to GND -0.3 6 V 3
VOUT to GND voltage VOUT to GND -0.3 5 V 3
VIN to VOUT voltage VIN to VOUT -0.3 5 V 3
EN to GND voltage EN to GND -0.3 6 V 3
Operating temperature range TA -40 125 ℃ 3
Storage temperature range TSTG -40 150 ℃ 3
ESD human body model (HBM) VESD 4 KV Human body model (HBM) 3
ESD charged device model (CDM) VESD 200 V Charged device model (CDM) 3
Thermal resistance, junction to ambient (SOT23-3) RθJA 240 ℃/W Junction to ambient, SOT23-3 3
Power dissipation (SOT23-3) PD 500 mW SOT23-3 3

CAD (KiCad official)

  • Symbol: WL9005HS3-30
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: wl9005hs3-30-etched.step / wl9005hs3-30-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); wl9005hs3-30.step / wl9005hs3-30.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WPMtek Wei Pan Microelectronics datasheet (11 pp, sha256 030e3f5d58452b70, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF