component

W25X40CLSSIG-TR

Public Made by Adom

by adom

Winbond Elec NOR FLASH, SOIC-8-208mil. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs w25x40clssig-tr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 4d ago
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray 1mo ago
package.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray 1mo ago
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray 1mo ago
page.json Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout") · Ray 11d ago
README.md w25x40clssig-tr: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray 17d ago
w25x40clssig-tr-etched.fit.json w25x40clssig-tr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 4d ago
w25x40clssig-tr-etched.glb w25x40clssig-tr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 4d ago
w25x40clssig-tr-etched.step w25x40clssig-tr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 4d ago
w25x40clssig-tr.glb Publish 0.1.0 · Ray 1mo ago
w25x40clssig-tr.kicad_mod Publish 0.1.0 · Ray 1mo ago
w25x40clssig-tr.kicad_sym Publish 0.1.0 · Ray 1mo ago
w25x40clssig-tr.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect and oval pad as a SQUARE EAGLE smd; this carries the real pad shape across (0 -> 8 rounded pads) and stops dropping geometry drawn on KiCad User.N layers. Attributes, connects, pads and the pin-1 marker are gated against decreasing and are unchanged. · Ray 1mo ago
w25x40clssig-tr.step Publish 0.1.0 · Ray 1mo ago

W25X40CLSSIG-TR

Winbond Elec · NOR FLASH · SOIC-8-208mil

W25X40CLSSIG-TR from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input SPI Chip Select input (active low). When high, device is deselected and DO/IO0/IO1 are high-impedance and the device enters standby. Must track VCC at power-up; a pull-up resistor to VCC is recommended.
2 DO (IO1) bidirectional Serial Data Output in Standard SPI mode (unidirectional, data shifted out on falling edge of CLK). Becomes bidirectional IO1 during Dual SPI instructions (Fast Read Dual Output 3Bh, Fast Read Dual I/O BBh).
3 /WP input Write Protect input (active low). Used with the Status Register's SRP and Block Protect bits (TB, BP2, BP1, BP0) to hardware-protect portions of the memory array or the Status Register itself from writes.
4 GND power_in Device ground reference.
5 DI (IO0) bidirectional Serial Data Input in Standard SPI mode (unidirectional, data shifted in on rising edge of CLK). Becomes bidirectional IO0 during Dual SPI instructions (Fast Read Dual Output 3Bh, Fast Read Dual I/O BBh).
6 CLK input SPI Serial Clock input. Provides timing for serial input and output operations. Supports SPI Modes 0 (CPOL=0, CPHA=0) and 3 (CPOL=1, CPHA=1) up to 104 MHz.
7 /HOLD input Hold input (active low). While /CS is low, driving /HOLD low pauses the device: DO goes high-impedance and DI/CLK are ignored. Useful when sharing the SPI bus with other devices.
8 VCC power_in Power supply input, 2.3 V to 3.6 V. Active current ~1 mA (typ), power-down current <1 µA (typ). Bypass with a decoupling capacitor to GND.

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package SOIC-8-208mil
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • W25X40CLSSIG-TR
  • W25X40CLSSIG-TRSNIG
  • W25X40CLSSIG-TRSVIG
  • W25X40CLSSIG-TRZPIG
  • W25X40CLSSIG-TRUXIG
  • W25X40CLSSIG-TRDAIG

CAD (KiCad official)

  • Symbol: W25X40CLSSIG-TR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8-208mil (KiCad packages3D, STEP)
  • 3D model files: w25x40clssig-tr-etched.step / w25x40clssig-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25x40clssig-tr.step / w25x40clssig-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (53 pp, sha256 815a536a29f475d0, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF