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W25X10CLUXIG

Public Made by Adom

by adom

Winbond Elec NOR FLASH, USON-8-EP(2x3). Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Datasheet

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Contents

README

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W25X10CLUXIG

Winbond Elec · NOR FLASH · USON-8-EP(2x3)

W25X10CLUXIG from Winbond Elec, in a USON-8-EP(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input SPI Chip Select input, active low. Enables device when low; when high the device is deselected and DO/IO0/IO1 outputs go high impedance. Must track VCC at power-up; a pull-up to VCC is recommended.
2 DO (IO1) bidirectional Standard SPI Serial Data Output (DO) on falling edge of CLK, or bidirectional IO1 line during Dual SPI (Fast Read Dual Output 3Bh / Fast Read Dual I/O BBh). High impedance when /CS is high.
3 /WP input Write Protect input, active low. Used with Status Register SRP and BP1/BP0/TB bits to hardware-protect a region or the entire array from Status Register writes.
4 GND power_in Ground reference for the device.
5 DI (IO0) bidirectional Standard SPI Serial Data Input (DI) latched on rising edge of CLK, or bidirectional IO0 line during Dual SPI (Fast Read Dual Output 3Bh / Fast Read Dual I/O BBh).
6 CLK input SPI Serial Clock input. Provides timing for serial input and output; supports SPI Mode 0 (0,0) and Mode 3 (1,1) up to 104MHz.
7 /HOLD input Hold input, active low. When /CS is low and /HOLD is low, DO becomes high impedance and DI/CLK are ignored, pausing device operation without deselecting it. Useful when the SPI bus is shared with other devices.
8 VCC power_in Power supply, 2.3V to 3.6V. Typical active current 1mA, power-down current <1uA.

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package USON-8-EP(2x3)
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • W25X10CLUXIG
  • W25X10CLUXIGSNIG

CAD (KiCad official)

  • Symbol: W25X10CLUXIG
  • Footprint: Package_SON:Winbond_USON-8-1EP_3x2mm_P0.5mm_EP0.2x1.6mm
  • 3D model: USON-8-EP(2x3) (KiCad packages3D, STEP)
  • 3D model files: w25x10cluxig-etched.step / w25x10cluxig-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25x10cluxig.step / w25x10cluxig.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (47 pp, sha256 b218f5f6dfec5e01, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF