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W25X10CLSNIG

Public Made by Adom

by adom

Winbond Elec NOR FLASH, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

markdown

W25X10CLSNIG

Winbond Elec · NOR FLASH · SOIC-8

W25X10CLSNIG from Winbond Elec, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Active-low Chip Select input that enables and disables device operation; when high the device is deselected and DO is high impedance, and /CS must transition high to low before a new instruction is accepted.
2 DO (IO1) bidirectional Serial data output in Standard SPI and bidirectional IO1 in Dual SPI, changing on the falling edge of CLK and high impedance when deselected.
3 /WP input Active-low Write Protect input that prevents the Status Register from being written when used with the TB, BP1, BP0 and SRP bits.
4 GND power_in Ground.
5 DI (IO0) bidirectional Serial data input in Standard SPI and bidirectional IO0 in Dual SPI, sampled on the rising edge of CLK.
6 CLK input Serial Clock input that provides the timing for serial input and output operations.
7 /HOLD input Hold input that pauses the device while selected: when low with /CS low, DO is high impedance and DI and CLK are ignored.
8 VCC power_in Power supply input for a single 2.3V to 3.6V supply.

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package SOIC-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC 2.3 3.6 V FR = 80MHz, fR = 33MHz (2.3 min); FR = 104MHz, fR = 50MHz (2.7 min) 36
Ambient Temperature, Operating TA -40 85 °C Industrial 36
Supply Voltage (absolute maximum) VCC -0.6 4.6 V 36
Voltage Applied to Any Pin VIO -0.6 V Relative to Ground; upper limit VCC +0.4 36
Storage Temperature TSTG -65 150 °C 36
Electrostatic Discharge Voltage VESD -2000 2000 V Human Body Model 36
VCC (min) to /CS Low tVSL 10 µs characterized only 37
Write Inhibit Threshold Voltage VWI 1 2 V characterized only 37
Input Capacitance CIN 6 pF VIN = 0V 38
Output Capacitance Cout 8 pF VOUT = 0V 38
Input Leakage ILI -2 2 µA 38
I/O Leakage ILO -2 2 µA 38
Standby Current ICC1 10 50 µA /CS = VCC, VIN = GND or VCC 38
Power-down Current ICC2 1 5 µA /CS = VCC, VIN = GND or VCC 38
Current Write Status Register ICC4 8 12 mA /CS = VCC 38
Current Page Program ICC5 10 15 mA /CS = VCC 38
Current Sector/Block Erase ICC6 10 15 mA /CS = VCC 38
Current Chip Erase ICC7 10 15 mA /CS = VCC 38
Input Low Voltage VIL -0.5 V max printed as VCCx0.3 38
Output Low Voltage VOL 0.4 V IOL = 100 µA 38
Clock frequency, all instructions except Read Data (03h) FR 104 MHz 2.7V-3.6V VCC & Industrial Temperature 40
Clock frequency, all instructions except Read Data (03h) FR 80 MHz 2.3V-2.7V VCC & Industrial Temperature 40
Clock freq. Read Data instruction 03h fR 50 MHz 2.7V-3.6V VCC & Industrial Temperature 40
Clock freq. Read Data instruction 03h fR 33 MHz 2.3V-2.7V VCC & Industrial Temperature 40
Clock High, Low Time (Fast Read / other) tCLH, tCLL 4 ns 40
Clock High, Low Time for Read Data (03h) tCRLH, tCRLL 6 ns 40
Data In Setup Time tDVCH 2 ns 40
Data In Hold Time tCHDX 5 ns 40
/CS Deselect Time (Array Read to Array Read) tSHSL1 50 ns 40
Output Disable Time tSHQZ 7 ns 40
Clock Low to Output Valid tCLQV1 8 ns 40
Output Hold Time tCLQX 0 ns 41
/HOLD to Output High-Z tHLQZ 12 ns 41
/CS High to Power-down Mode tDP 3 µs 41
/CS High to Standby Mode without Electronic Signature Read tRES1 3 µs 41
/CS High to Standby Mode with Electronic Signature Read tRES2 1.8 µs 41
Write Status Register Time tW 10 15 ms 41
Page Program Time tPP 0.4 0.8 ms 41
Sector Erase Time (4KB) tSE 30 300 ms 41
Block Erase Time (32KB) tBE1 120 800 ms 41
Block Erase Time (64KB) tBE2 150 1000 ms 41
Chip Erase Time tCE 0.25 1 s W25X10CL 41

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin 10.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 43 10.2 8-Pin VSOP8 150-mil (Package Code SV)........................................... 3

CAD (KiCad official)

  • Symbol: W25X10CLSNIG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: w25x10clsnig-etched.step / w25x10clsnig-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25x10clsnig.step / w25x10clsnig.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (51 pp, sha256 2f0ee8f6e18cf01a, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF