W25Q64JVSSIQ

@@ -0,0 +1,62 @@+# W25Q64JVSSIQ++**Winbond Elec** · NOR FLASH · SOIC-8-208mil++W25Q64JVSSIQ from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | /CS | input | Chip Select input (active low). When /CS is high the device is deselected and IO pins are high impedance; when /CS is brought low the device is selected and instructions can be written/read. /CS must track VCC at power-up. |+| 2 | DO (IO1) | bidirectional | Serial Data Output in Standard SPI mode; bidirectional IO1 in Dual/Quad SPI modes. Data is clocked out on the falling edge of CLK. |+| 3 | /WP (IO2) | bidirectional | Write Protect input (active low) in Standard/Dual SPI; used with SRP/CMP/SEC/TB/BP bits to hardware-protect a portion or the entire array. Repurposed as IO2 when Quad SPI is enabled (QE=1). |+| 4 | GND | power_in | Ground reference (0 V) for the device. |+| 5 | DI (IO0) | bidirectional | Serial Data Input in Standard SPI mode; bidirectional IO0 in Dual/Quad SPI modes. Data is latched on the rising edge of CLK. |+| 6 | CLK | input | SPI Serial Clock input providing timing for all serial I/O operations. Supports up to 133 MHz. |+| 7 | /HOLD or /RESET (IO3) | bidirectional | Multi-function pin: /HOLD (active low) pauses SPI transactions while /CS is low, or /RESET input, in Standard/Dual SPI modes. Becomes IO3 when Quad SPI is enabled (QE=1). Note: this is NOT a dedicated hardware reset pin on the SOIC-8 package; the dedicated /RESET is only present on SOIC-16 and TFBGA packages. |+| 8 | VCC | power_in | Power supply input, 2.7 V to 3.6 V (3.3 V nominal). Power-down current <1 uA typical. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Winbond Elec |+| Package | SOIC-8-208mil |+| Category | Memory |+| Pins | 8 |++## Ordering variants++- `W25Q64JVSSIQSSIQ`+- `W25Q64JVSSIQSSIG`+- `W25Q64JVSSIQZPIQ`+- `W25Q64JVSSIQZPIG`+- `W25Q64JVSSIQZEIQ`+- `W25Q64JVSSIQZEIG`+- `W25Q64JVSSIQXGIQ`+- `W25Q64JVSSIQXGIG`+- `W25Q64JVSSIQSFIQ`+- `W25Q64JVSSIQSFIG`+- `W25Q64JVSSIQTBIQ`+- `W25Q64JVSSIQTBIG`+- `W25Q64JVSSIQTCIQ`+- `W25Q64JVSSIQTCIG`+- `W25Q64JVSSIQBYIQ`+- `W25Q64JVSSIQBYIG`++## CAD (KiCad official)++- Symbol: `W25Q64JVSSIQ`+- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`+- 3D model: SOIC-8-208mil (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Winbond Elec datasheet](docs/w25q64jvssiq-datasheet.pdf) (78 pp, sha256 `9f2073343ef0e6a9`, retrieved 2026-08-17, tier: lcsc)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/w25q64jvssiq-datasheet.pdf)

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