component
W25Q64JVSSIQ
Public Made by Adomby adom
Winbond Elec NOR FLASH, SOIC-8-208mil. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownW25Q64JVSSIQ
Winbond Elec · NOR FLASH · SOIC-8-208mil
W25Q64JVSSIQ from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | /CS | input | Chip Select input (active low). When /CS is high the device is deselected and IO pins are high impedance; when /CS is brought low the device is selected and instructions can be written/read. /CS must track VCC at power-up. |
| 2 | DO (IO1) | bidirectional | Serial Data Output in Standard SPI mode; bidirectional IO1 in Dual/Quad SPI modes. Data is clocked out on the falling edge of CLK. |
| 3 | /WP (IO2) | bidirectional | Write Protect input (active low) in Standard/Dual SPI; used with SRP/CMP/SEC/TB/BP bits to hardware-protect a portion or the entire array. Repurposed as IO2 when Quad SPI is enabled (QE=1). |
| 4 | GND | power_in | Ground reference (0 V) for the device. |
| 5 | DI (IO0) | bidirectional | Serial Data Input in Standard SPI mode; bidirectional IO0 in Dual/Quad SPI modes. Data is latched on the rising edge of CLK. |
| 6 | CLK | input | SPI Serial Clock input providing timing for all serial I/O operations. Supports up to 133 MHz. |
| 7 | /HOLD or /RESET (IO3) | bidirectional | Multi-function pin: /HOLD (active low) pauses SPI transactions while /CS is low, or /RESET input, in Standard/Dual SPI modes. Becomes IO3 when Quad SPI is enabled (QE=1). Note: this is NOT a dedicated hardware reset pin on the SOIC-8 package; the dedicated /RESET is only present on SOIC-16 and TFBGA packages. |
| 8 | VCC | power_in | Power supply input, 2.7 V to 3.6 V (3.3 V nominal). Power-down current <1 uA typical. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Winbond Elec |
| Package | SOIC-8-208mil |
| Category | Memory |
| Pins | 8 |
Ordering variants
Same part, different packaging or reel option.
W25Q64JVSSIQW25Q64JVSSIQSSIGW25Q64JVSSIQZPIQW25Q64JVSSIQZPIGW25Q64JVSSIQZEIQW25Q64JVSSIQZEIGW25Q64JVSSIQXGIQW25Q64JVSSIQXGIGW25Q64JVSSIQSFIQW25Q64JVSSIQSFIGW25Q64JVSSIQTBIQW25Q64JVSSIQTBIGW25Q64JVSSIQTCIQW25Q64JVSSIQTCIGW25Q64JVSSIQBYIQW25Q64JVSSIQBYIG
CAD (KiCad official)
- Symbol:
W25Q64JVSSIQ - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8-208mil (KiCad packages3D, STEP)
- 3D model files:
w25q64jvssiq-etched.step/w25q64jvssiq-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);w25q64jvssiq.step/w25q64jvssiq.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Winbond Elec datasheet (78 pp, sha256
9f2073343ef0e6a9, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).