component
W25Q64JVSSIM
Public Made by Adomby adom
Winbond Elec NOR FLASH, SOIC-8-208mil. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownW25Q64JVSSIM
Winbond Elec · NOR FLASH · SOIC-8-208mil
W25Q64JVSSIM from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | /CS | input | Chip select input (active low); device is selected when driven low and deselected when high with output pins in high impedance state. |
| 2 | DO (IO1) | bidirectional | Serial data output for standard SPI mode; functions as bidirectional IO1 in dual and quad SPI modes. |
| 3 | /WP (IO2) | bidirectional | Write protect input (active low); prevents status register writes when low and protects memory array via block protect bits; functions as bidirectional IO2 in quad SPI mode. |
| 4 | GND | power_in | Ground (0V reference). |
| 5 | DI (IO0) | bidirectional | Serial data input for standard SPI mode; functions as bidirectional IO0 in dual and quad SPI modes. |
| 6 | CLK | input | Serial clock input providing timing for serial input/output operations with maximum frequency of 133 MHz at 3.0-3.6V supply or 104 MHz at 2.7-3.0V supply. |
| 7 | /HOLD or /RESET (IO3) | bidirectional | Hold input (active low) to pause device operation in standard/dual SPI modes; functions as bidirectional IO3 in quad SPI mode when QE bit is set in Status Register-2. |
| 8 | VCC | power_in | Single positive supply power input operating at 2.7V to 3.6V nominal 3.3V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Winbond Elec |
| Package | SOIC-8-208mil |
| Category | Memory |
| Pins | 8 |
CAD (KiCad official)
- Symbol:
W25Q64JVSSIM - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8-208mil (KiCad packages3D, STEP)
- 3D model files:
w25q64jvssim-etched.step/w25q64jvssim-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);w25q64jvssim.step/w25q64jvssim.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Winbond Elec datasheet (78 pp, sha256
2b1a0b90d88b9731, retrieved 2026-09-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).