# W25Q64JVSFIQ

**Winbond Elec** · NOR FLASH · SOIC-16-300mil

W25Q64JVSFIQ from Winbond Elec, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | /HOLD or /RESET (IO3) | bidirectional | Hold or Reset input (Data Input Output 3); IO3 for Quad SPI, and the /HOLD function is only available for Standard/Dual SPI. |
| 2 | VCC | power_in | Power supply input; the device operates from a single 2.7V to 3.6V supply. |
| 3 | /RESET | input | Dedicated hardware reset input; when driven low for a minimum of about 1µS it terminates operations and returns the device to its power-on state, regardless of device settings. |
| 4 | N/C | unconnected | No connect; leave unconnected. |
| 5 | N/C | unconnected | No connect; leave unconnected. |
| 6 | N/C | unconnected | No connect; leave unconnected. |
| 7 | /CS | input | Chip Select input; when high the device is deselected and the DO/IO pins are high impedance, and /CS must track VCC at power-up and power-down. |
| 8 | DO (IO1) | bidirectional | Data Output (Data Input Output 1) for Standard SPI, read on the falling edge of CLK; IO1 for Dual/Quad SPI. |
| 9 | /WP (IO2) | bidirectional | Write Protect input, active low, used with the status register protect bits; becomes IO2 for Quad SPI when QE=1. |
| 10 | GND | power_in | Ground reference for the device. |
| 11 | N/C | unconnected | No connect; leave unconnected. |
| 12 | N/C | unconnected | No connect; leave unconnected. |
| 13 | N/C | unconnected | No connect; leave unconnected. |
| 14 | N/C | unconnected | No connect; leave unconnected. |
| 15 | DI (IO0) | bidirectional | Data Input (Data Input Output 0) for Standard SPI, sampled on the rising edge of CLK; IO0 for Dual/Quad SPI. |
| 16 | CLK | input | Serial Clock input providing the timing for serial input and output operations. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Winbond Elec |
| Package | SOIC-16-300mil |
| Category | Memory |
| Pins | 16 |

## CAD (KiCad official)

- Symbol: `W25Q64JVSFIQ`
- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`
- 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files: `w25q64jvsfiq-etched.step` / `w25q64jvsfiq-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `w25q64jvsfiq.step` / `w25q64jvsfiq.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Winbond Elec datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588941366651473920) (78 pp, sha256 `452d906c3be0da07`, retrieved 2026-10-20, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/w25q64jvsfiq-datasheet.pdf)