component
W25Q40CLSNIG
Public Made by Adomby adom
Winbond Elec NOR FLASH, SOIC-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownW25Q40CLSNIG
Winbond Elec · NOR FLASH · SOIC-8
W25Q40CLSNIG from Winbond Elec, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | /CS | input | Chip Select Input; active low; device selected and instructions accepted when low; outputs high impedance when high. |
| 2 | DO (IO1) | bidirectional | Data Output in standard SPI mode; Data Input/Output 1 in quad SPI mode (when QE=1); shifts data on CLK falling edge in standard mode. |
| 3 | /WP (IO2) | bidirectional | Write Protect Input in standard/dual SPI mode; active low; prevents Status Register writes when low; becomes I/O2 in quad SPI mode (when QE=1). |
| 4 | GND | power_in | Ground; reference voltage for all device circuits and operations. |
| 5 | DI (IO0) | bidirectional | Data Input in standard SPI mode; Data Input/Output 0 in quad SPI mode (when QE=1); accepts data on CLK rising edge in standard mode. |
| 6 | CLK | input | Serial Clock Input; provides timing for all serial input and output operations; supports up to 104 MHz (at 2.7-3.6 V) or 80 MHz (at 2.3-2.7 V). |
| 7 | /HOLD (IO3) | bidirectional | Hold Input in standard/dual SPI mode; active low; pauses device operation while /CS is low; becomes I/O3 in quad SPI mode (when QE=1). |
| 8 | VCC | power_in | Power Supply Input; 2.3 V to 3.6 V single supply; provides operating voltage for all device circuits. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Winbond Elec |
| Package | SOIC-8 |
| Category | Memory |
| Pins | 8 |
CAD (KiCad official)
- Symbol:
W25Q40CLSNIG - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
w25q40clsnig-etched.step/w25q40clsnig-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);w25q40clsnig.step/w25q40clsnig.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Winbond Elec datasheet (65 pp, sha256
d92505fc4ff8f622, retrieved 2026-09-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).