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Contents

README

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W25Q32JWUUIQ

Winbond Elec · NOR FLASH · USON-8(3x4)

W25Q32JWUUIQ from Winbond Elec, in a USON-8(3x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Chip Select, active low to enable device and must transition from high to low after power-up before accepting new instructions.
2 DO (IO1) bidirectional Data Output in standard SPI mode on the falling edge of CLK, or Data Input/Output 1 in Dual and Quad SPI modes.
3 /WP (IO2) bidirectional Write Protect, active low for Status Register and memory array protection via Block Protect bits in standard mode, or Data Input/Output 2 in Quad SPI mode.
4 GND power_in Ground reference for device power supply.
5 DI (IO0) bidirectional Data Input in standard SPI mode on the rising edge of CLK for instructions, addresses or data, or Data Input/Output 0 in Dual and Quad SPI modes.
6 CLK input Serial Clock Input providing timing for serial input and output operations with maximum frequency of 133MHz for Quad I/O and Quad Output instructions.
7 /HOLD or /RESET (IO3) bidirectional Hold Input, active low to pause device operation in standard SPI mode; functions as Data Input/Output 3 in Quad SPI mode or as /RESET input in TFBGA packages requiring minimum pulse width of ~1µS.
8 VCC power_in Power Supply operating from 1.7V to 1.95V with standby current as low as 0.1µA in power-down mode.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package USON-8(3x4)
Category Memory
Pins 9

CAD (KiCad official)

  • Symbol: W25Q32JWUUIQ
  • Footprint: Package_SON:Winbond_USON-8-2EP_3x4mm_P0.8mm_EP0.2x0.8mm
  • 3D model: USON-8(3x4), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.55 mm nominal UFQFPN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: w25q32jwuuiq-etched.step / w25q32jwuuiq-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25q32jwuuiq.step / w25q32jwuuiq.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (78 pp, sha256 cc812bfef3cdaf83, retrieved 2026-10-01, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF