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Contents

README

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W25Q256JWFIQ TR

Winbond Elec · NOR FLASH · SOIC-16

W25Q256JWFIQ TR from Winbond Elec, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /HOLD or /RESET (IO3) bidirectional Hold or Reset input (Data Input Output 3) used as IO3 for Quad SPI; the /HOLD function is only available on Standard/Dual SPI part numbers with the IM ordering option, and /HOLD is disabled on the IQ variant.
2 VCC power_in Power supply, specified at a single 1.7V to 1.95V supply.
3 /RESET input Dedicated hardware reset input that, when driven low for a minimum of about 1µs, terminates operations and returns the device to its power-on state; if unused it can be left floating or connected to VCC.
4 N/C unconnected No connect.
5 N/C unconnected No connect.
6 N/C unconnected No connect.
7 /CS input Active-low chip select; when high the device is deselected and DO/IO pins are high impedance, and /CS must track VCC at power-up and power-down.
8 DO (IO1) bidirectional Data output (Data Input Output 1), driven on the falling edge of CLK in Standard SPI and used as the bidirectional IO1 in Dual and Quad SPI.
9 /WP (IO2) bidirectional Active-low Write Protect input that, with the status register protect bits, prevents Status Register writes, and becomes IO2 when QE=1.
10 GND power_in Ground reference.
11 N/C unconnected No connect.
12 N/C unconnected No connect.
13 N/C unconnected No connect.
14 N/C unconnected No connect.
15 DI (IO0) bidirectional Data input (Data Input Output 0) that writes instructions, addresses and data on the rising edge of CLK in Standard SPI and is the IO0 line in Dual and Quad SPI.
16 CLK input Serial clock input that provides the timing for serial input and output operations.

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package SOIC-16
Category Memory
Pins 16

CAD (KiCad official)

  • Symbol: W25Q256JWFIQ TR
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: w25q256jwfiq-tr-etched.step / w25q256jwfiq-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25q256jwfiq-tr.step / w25q256jwfiq-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (99 pp, sha256 9032c4063ead2036, retrieved 2026-10-09, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF