component

W25Q16JVSNIQ

Public Made by Adom

by adom

Winbond Elec NOR FLASH, SOIC-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs w25q16jvsniq: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 3d ago
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray 1mo ago
package.json Publish 0.2.0 · Ray 1mo ago
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray 1mo ago
page.json Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout") · Ray 10d ago
README.md w25q16jvsniq: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray 13d ago
w25q16jvsniq-etched.fit.json w25q16jvsniq: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 3d ago
w25q16jvsniq-etched.glb w25q16jvsniq: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 3d ago
w25q16jvsniq-etched.step w25q16jvsniq: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 3d ago
w25q16jvsniq.glb Publish 0.1.0 · Ray 1mo ago
w25q16jvsniq.kicad_mod Publish 0.1.0 · Ray 1mo ago
w25q16jvsniq.kicad_sym Publish 0.1.0 · Ray 1mo ago
w25q16jvsniq.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect and oval pad as a SQUARE EAGLE smd; this carries the real pad shape across (0 -> 8 rounded pads) and stops dropping geometry drawn on KiCad User.N layers. Attributes, connects, pads and the pin-1 marker are gated against decreasing and are unchanged. · Ray 1mo ago
w25q16jvsniq.step Publish 0.1.0 · Ray 1mo ago

W25Q16JVSNIQ

Winbond Elec · NOR FLASH · SOIC-8

W25Q16JVSNIQ from Winbond Elec, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input SPI Chip Select input, active low. Drive low to select the device; when high the device is deselected and DO/IOx go to high impedance and the part enters standby. /CS must track VCC at power-up/down; a pull-up to VCC is recommended.
2 DO (IO1) bidirectional Serial Data Output in Standard SPI (data shifted out on falling edge of CLK). Becomes bidirectional IO1 for Dual/Quad SPI instructions.
3 /WP (IO2) bidirectional Write Protect input, active low; when asserted with the appropriate Status Register bits (SRP/SRL, CMP, SEC, TB, BP[2:0]) it hardware-protects the Status Register from writes. Becomes bidirectional IO2 in Quad SPI mode when Status Register-2 QE bit = 1.
4 GND power_in Device ground reference (0 V).
5 DI (IO0) bidirectional Serial Data Input in Standard SPI (instructions, addresses and data shifted in on rising edge of CLK). Becomes bidirectional IO0 for Dual/Quad SPI instructions.
6 CLK input SPI Serial Clock input. Sampling edge for data-in on rising edge, data-out on falling edge. Supports SPI Modes 0 and 3, up to 133 MHz.
7 /HOLD or /RESET (IO3) bidirectional Multi-function pin. In Standard/Dual SPI it acts as /HOLD (active low, pauses SPI activity while /CS is low) or as /RESET when the feature is enabled in Status Register-3; in Quad SPI mode (QE=1) it becomes bidirectional IO3.
8 VCC power_in Core / I/O supply, 2.7 V to 3.6 V single supply. Typical power-down current <1 µA. /CS must track VCC at power-up/down; decouple with a local bypass capacitor.

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package SOIC-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • W25Q16JVSNIQ
  • W25Q16JVSNIQSNJQ
  • W25Q16JVSNIQSNIM
  • W25Q16JVSNIQSNJM
  • W25Q16JVSNIQSSIQ
  • W25Q16JVSNIQSSJQ
  • W25Q16JVSNIQSSIM
  • W25Q16JVSNIQSSJM
  • W25Q16JVSNIQZPIQ
  • W25Q16JVSNIQZPJQ
  • W25Q16JVSNIQZPIM
  • W25Q16JVSNIQZPJM
  • W25Q16JVSNIQUXIQ
  • W25Q16JVSNIQUXJQ
  • W25Q16JVSNIQUXIM
  • W25Q16JVSNIQUXJM
  • W25Q16JVSNIQUUIQ
  • W25Q16JVSNIQUUJQ
  • W25Q16JVSNIQUUIM
  • W25Q16JVSNIQUUJM
  • W25Q16JVSNIQXGIQ
  • W25Q16JVSNIQXGJQ
  • W25Q16JVSNIQBYIQ
  • W25Q16JVSNIQBYJQ

CAD (KiCad official)

  • Symbol: W25Q16JVSNIQ
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: w25q16jvsniq-etched.step / w25q16jvsniq-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25q16jvsniq.step / w25q16jvsniq.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
w25q16jvsniq.step 122 KB You want the bare part, or you mark your own boards.
w25q16jvsniq-etched.step 2.4 MB You want the part with W25Q16JVSNIQ already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 580 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (75 pp, sha256 6d23cdf57fd63fc2, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF