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Name	Last commit message	Last updated
docs	Publish 0.1.0 · Ray	13h ago
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package.json	Publish 0.1.0 · Ray	13h ago
page.json	Set visibility: public · Ray	13h ago
README.md	Publish 0.1.0 · Ray	13h ago
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w25q16jvsnim-etched.step	w25q16jvsnim: factory component page (tier=lcsc) · Ray	13h ago
w25q16jvsnim-hero.glb	w25q16jvsnim: hero GLB from the etched model (keeps the MPN mark) · Ray	13h ago
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w25q16jvsnim.step	Publish 0.1.0 · Ray	13h ago

W25Q16JVSNIM

WINBOND(华邦) · NOR FLASH · SO-8

W25Q16JVSNIM from WINBOND(华邦), in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	/CS	input	Active-low chip select input; when /CS is high the device is deselected and the DO/IO pins are high impedance, and /CS must track VCC at power-up and power-down.
2	DO (IO1)	bidirectional	Data output (DO) in Standard SPI, read on the falling edge of CLK, and bidirectional IO1 in Dual, Quad and QPI operation.
3	/WP (IO2)	bidirectional	Active-low Write Protect input used with the Status Register protect bits, which becomes IO2 when the QE bit is set and the /WP function is then unavailable.
4	GND	power_in	Ground reference for the device.
5	DI (IO0)	bidirectional	Data input (DI) for Standard SPI, latched on the rising edge of CLK, and bidirectional IO0 in Dual, Quad and QPI operation.
6	CLK	input	Serial clock input that provides the timing for serial input and output operations.
7	/HOLD or /RESET (IO3)	bidirectional	Active-low /HOLD input pauses operation while /CS is low, or acts as /RESET when HOLD/RST=1 (only when QE=0); when QE=1 it becomes IO3 and /HOLD and /RESET are disabled.
8	VCC	power_in	Power supply input; the device operates from a single 2.7V to 3.6V supply.

Key specifications

Parameter	Value
Manufacturer	WINBOND(华邦)
Package	SO-8
Category	Memory
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply Voltage	VCC	-0.6		4.6	V		83
Voltage Applied to Any Pin	VIO	-0.6			V	Relative to Ground; max printed as VCC+0.4	83
Transient Voltage on any Pin	VIOT	-2			V	<20nS Transient, relative to ground; max printed as VCC+2.0V	83
Storage Temperature	TSTG	-65		150	°C		83
Electrostatic Discharge Voltage	VESD	-2000		2000	V	Human Body Model	83
Supply Voltage (FR = 133MHz)	VCC	3		3.6	V	FR = 133MHz, fR = 50MHz	83
Supply Voltage (FR = 104MHz)	VCC	2.7		3	V	FR = 104MHz, fR = 50MHz	83
Ambient Temperature, Operating (Industrial)	TA	-40		85	°C	Industrial grade (I)	83
Write Inhibit Threshold Voltage	VWI	1		2	V		84
Input Leakage	ILI	-2		2	µA		85
I/O Leakage	ILO	-2		2	µA		85
Standby Current	ICC1		10	50	µA	/CS = VCC, VIN = GND or VCC	85
Power-down Current	ICC2		1	15	µA	/CS = VCC, VIN = GND or VCC	85
Current Read Data / Dual / Quad 1MHz	ICC3		2	10	mA	C = 0.1 VCC / 0.9 VCC, DO = Open	85
Current Read Data / Dual / Quad 50MHz	ICC3		4	15	mA	C = 0.1 VCC / 0.9 VCC, DO = Open	85
Current Read Data / Dual / Quad 80MHz	ICC3		6	18	mA	C = 0.1 VCC / 0.9 VCC, DO = Open	85
Current Read Data / Dual / Quad 104MHz	ICC3		8	20	mA	C = 0.1 VCC / 0.9 VCC, DO = Open	85
Current Write Status Register	ICC4		20	25	mA	/CS = VCC	85
Current Page Program	ICC5		20	25	mA	/CS = VCC	85
Current Sector/Block Erase	ICC6		20	25	mA	/CS = VCC	85
Current Chip Erase	ICC7		20	25	mA	/CS = VCC	85
Input Low Voltage	VIL	-0.5			V	max printed as VCC x 0.3	85
Output Low Voltage	VOL			0.2	V	IOL = 100 µA	85
Clock frequency except Read Data (03h) & DTR (3.0V-3.6V)	FR			133	MHz	3.0V-3.6V; MIN printed as D.C.	87
Clock frequency except Read Data (03h) & DTR (2.7V-3.0V)	FR			104	MHz	2.7V-3.0V; MIN printed as D.C.	87
Clock frequency for Read Data instruction (03h)	fR			50	MHz	MIN printed as D.C.	87
Clock frequency DTR instructions (3.0V-3.6V)	FR			66	MHz	3.0V-3.6V; MIN printed as D.C.	87
Clock frequency DTR instructions (2.7V-3.0V)	FR			52	MHz	2.7V-3.0V; MIN printed as D.C.	87
Clock High, Low Time (all instructions except Read Data 03h)	tCLH, tCLL	45			%PC		87
Write Status Register Time	tW		10	15	ms		88
Page Program Time	tPP		0.4	3	ms		88
Sector Erase Time (4KB)	tSE		45	400	ms		88
Block Erase Time (32KB)	tBE1		120	1600	ms		88
Block Erase Time (64KB)	tBE2		150	2000	ms		88
Chip Erase Time	tCE		5	25	s		88

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts		tin	10.1 8-Pin SOIC 150-mil (Package Code SN) ...........................................................................90 10.3 8-Pin SOIC 208-mil (Package Code SS).......................................	4

CAD (KiCad official)

Symbol: W25Q16JVSNIM
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SO-8 (KiCad packages3D, STEP)
3D model files: w25q16jvsnim-etched.step / w25q16jvsnim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25q16jvsnim.step / w25q16jvsnim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: WINBOND(华邦) datasheet (99 pp, sha256 c5fef2a6b8052117, retrieved 2026-10-20, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF