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W25Q16JVSNIM TR

Public Made by Adom

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Winbond Elec NOR FLASH, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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W25Q16JVSNIM TR

Winbond Elec · NOR FLASH · SOIC-8

W25Q16JVSNIM TR from Winbond Elec, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Chip Select Input; when high the device is deselected and the DO/IO pins are high impedance, and /CS must track VCC at power-up and power-down.
2 DO (IO1) bidirectional Data Output (Data Input Output 1); in standard SPI it outputs data on the falling edge of CLK, and it is IO1 for Dual/Quad SPI.
3 /WP (IO2) bidirectional Write Protect Input (Data Input Output 2); active low, used with the Status Register protect bits to hardware-protect the Status Register, and it becomes IO2 when QE=1 (WP function not available in Quad mode).
4 GND power_in Ground.
5 DI (IO0) bidirectional Data Input (Data Input Output 0); in standard SPI it latches instructions, addresses and data on the rising edge of CLK, and it is IO0 for Dual/Quad SPI.
6 CLK input Serial Clock Input providing timing for serial input and output operations; clock frequencies up to 133MHz are supported.
7 /HOLD or /RESET (IO3) bidirectional Hold or Reset Input (Data Input Output 3); active low /HOLD pauses the device when QE=0 and HOLD/RST=0 (factory default), it acts as /RESET when HOLD/RST=1, and it becomes IO3 when QE=1.
8 VCC power_in Power Supply; single 2.7V to 3.6V supply.

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package SOIC-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.6 4.6 V 84
Voltage Applied to Any Pin VIO -0.6 V Relative to Ground 84
Transient Voltage on any Pin VIOT -2 V <20nS Transient, Relative to Ground 84
Storage Temperature TSTG -65 150 °C 84
Electrostatic Discharge Voltage VESD -2000 2000 V Human Body Model 84
Supply Voltage VCC 3 3.6 V FR = 133MHz, fR = 50MHz 84
Supply Voltage VCC 2.7 3 V FR = 104MHz, fR = 50MHz 84
Ambient Temperature, Operating (Industrial) TA -40 85 °C Industrial 84
Write Inhibit Threshold Voltage VWI 1 2 V 85
Input Leakage ILI -2 2 µA 86
I/O Leakage ILO -2 2 µA 86
Standby Current ICC1 10 50 µA /CS = VCC, VIN = GND or VCC 86
Power-down Current ICC2 1 15 µA /CS = VCC, VIN = GND or VCC 86
Current Read Data / Dual / Quad 1MHz ICC3 2 10 mA C = 0.1 VCC / 0.9 VCC; DO = Open 86
Current Read Data / Dual / Quad 50MHz ICC3 4 15 mA C = 0.1 VCC / 0.9 VCC; DO = Open 86
Current Read Data / Dual / Quad 80MHz ICC3 6 18 mA C = 0.1 VCC / 0.9 VCC; DO = Open 86
Current Read Data / Dual / Quad 104MHz ICC3 8 20 mA C = 0.1 VCC / 0.9 VCC; DO = Open 86
Current Write Status Register ICC4 20 25 mA /CS = VCC 86
Current Page Program ICC5 20 25 mA /CS = VCC 86
Current Sector/Block Erase ICC6 20 25 mA /CS = VCC 86
Current Chip Erase ICC7 20 25 mA /CS = VCC 86
Input Low Voltage VIL -0.5 V 86
Clock frequency except for Read Data (03h) & DTR instructions (3.0V-3.6V) FR 133 MHz 88
Clock frequency except for Read Data (03h) & DTR instructions (2.7V-3.0V) FR 104 MHz 88
Clock frequency DTR instructions (3.0V-3.6V) FR 66 MHz 88
Clock frequency DTR instructions (2.7V-3.0V) FR 52 MHz 88
Clock frequency for Read Data instruction (03h) fR 50 MHz 88
Write Status Register Time tW 10 15 ms 89
Page Program Time tPP 0.4 3 ms 89
Sector Erase Time (4KB) tSE 45 400 ms 89
Block Erase Time (32KB) tBE1 120 1600 ms 89
Block Erase Time (64KB) tBE2 150 2000 ms 89
Chip Erase Time tCE 5 25 s 89

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin 10.1 8-Pin SOIC 150-mil (Package Code SN) ...........................................................................90 10.3 8-Pin SOIC 208-mil (Package Code SS)....................................... 4

CAD (KiCad official)

  • Symbol: W25Q16JVSNIM TR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: w25q16jvsnim-tr-etched.step / w25q16jvsnim-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25q16jvsnim-tr.step / w25q16jvsnim-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (99 pp, sha256 c5fef2a6b8052117, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF