component

W25Q16JV 16Mbit SPI Flash

Public Made by Adom

by adom

16 Mbit (2 MB) serial NOR flash with Standard/Dual/Quad SPI up to 133 MHz.

flashspinormemoryquad-spiwinbondsoic-8
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3D Model

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Symbol & Footprint

Schematic Symbol

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PCB Footprint

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Datasheet

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Contents

README

markdown

W25Q16JV

Winbond · SPI NOR Flash · SOIC-8 (208 mil)

The W25Q16JV is a 16 Mbit (2 MB) serial NOR flash memory. It supports Standard, Dual, and Quad SPI at clock rates up to 133 MHz, organizing its array into 256-byte pages, 4 KB sectors, and 32/64 KB blocks. It is a common choice for MCU firmware storage, code shadowing, and data logging.

Pinout

Pin Name Type Function
1 /CS input Chip Select input (active low). When /CS is high the device is deselected and DO/IOx are high-impedance; when brought low the device is selected and instructions can be issued. A pull-up resistor on /CS is recommended to hold it high during power-up.
2 DO/IO1 bidirectional Serial Data Output (Standard SPI); becomes bidirectional IO1 in Dual/Quad SPI mode. Data is shifted out on the falling edge of CLK.
3 IO2 bidirectional Data Input/Output 2, used only for Quad SPI instructions. In Standard/Dual SPI mode this pin may be used as /WP (write protect) depending on QE status register bit.
4 GND power_in Ground reference (0V) for the device.
5 DI/IO0 bidirectional Serial Data Input (Standard SPI); becomes bidirectional IO0 in Dual/Quad SPI mode. Instructions, addresses and data are shifted in on the rising edge of CLK.
6 CLK input SPI Serial Clock Input. Provides the timing reference for all serial input/output operations. Supports up to 133MHz.
7 IO3 bidirectional Data Input/Output 3, used only for Quad SPI instructions. In Standard/Dual SPI mode this pin may be used as /HOLD or /RESET depending on the QE status register bit.
8 VCC power_in Power supply, 2.7V to 3.6V. Recommended decoupling: 100nF ceramic close to the pin.

Key specifications

Parameter Value
Density 16 Mbit (2 MB)
Interface SPI: Standard / Dual / Quad
Max clock 133 MHz (Quad up to 532 MHz equivalent)
Page size 256 bytes
Sector / block 4 KB sector, 32 KB / 64 KB block
Supply voltage 2.7 V to 3.6 V
Endurance 100,000 erase/program cycles
Operating temperature -40 C to 85 C

Ordering variants

Same part, different packaging or reel option.

  • W25Q16JVSNIQ
  • W25Q16JVSSIQ
  • W25Q16JVSTIQ
  • W25Q16JVUXIQ
  • W25Q16JVZPIQ
  • W25Q16JVUUIQ
  • W25Q16JVXGIQ
  • W25Q16JVBYIQ

CAD (KiCad official)

  • Symbol: w25q16.kicad_sym
  • Footprint: w25q16.kicad_mod
  • 3D model: SOIC-8 208 mil (wide) body from KiCad Package_SO/SOIC-8_5.3x5.3mm_P1.27mm.
  • 3D model files: w25q16-etched.step / w25q16-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25q16.step / w25q16.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond datasheet (74 pp, sha256 97430b7ae9fc3758, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF