component
W25Q128JWSIQ TR
Public Made by Adomby adom
Winbond Elec NOR FLASH, SOIC-8-208mil. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownW25Q128JWSIQ TR
Winbond Elec · NOR FLASH · SOIC-8-208mil
W25Q128JWSIQ TR from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | /CS | input | Chip select input (active low) that selects the device and enables instruction acceptance; when high, device is deselected and output pins are high-impedance. |
| 2 | DO (IO1) | output | Data output in standard SPI mode on the falling edge of CLK; functions as bidirectional IO1 in dual and quad SPI modes. |
| 3 | /WP (IO2) | input | Write protect input (active low) that prevents status register writes when used with SRP bit in standard/dual SPI modes; functions as bidirectional IO2 in quad SPI mode when QE bit is set to 1. |
| 4 | GND | power_in | Ground; 0V reference. |
| 5 | DI (IO0) | input | Data input in standard SPI mode sampled on the rising edge of CLK; functions as bidirectional IO0 in dual and quad SPI modes. |
| 6 | CLK | input | Serial clock input providing timing for serial input and output operations; maximum 133 MHz for quad I/O (EBh) instructions, 104 MHz for other instructions. |
| 7 | /HOLD or /RESET (IO3) | input | Hold input (active low) in standard/dual SPI modes to pause operation while /CS is low; becomes bidirectional IO3 in quad SPI mode when QE bit is set; hardware reset function only available on SOIC-16 and TFBGA packages. |
| 8 | VCC | power_in | Power supply input; operating voltage range 1.7V to 1.95V at -40°C to +85°C for industrial grade per section 9.2. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Winbond Elec |
| Package | SOIC-8-208mil |
| Category | Memory |
| Pins | 8 |
CAD (KiCad official)
- Symbol:
W25Q128JWSIQ TR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8-208mil (KiCad packages3D, STEP)
- 3D model files:
w25q128jwsiq-tr-etched.step/w25q128jwsiq-tr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);w25q128jwsiq-tr.step/w25q128jwsiq-tr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Winbond Elec datasheet (79 pp, sha256
4d065361637dcc10, retrieved 2026-09-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).