component
W25Q128JVPIQ
Public Made by Adomby adom
Winbond Elec NOR FLASH, WSON-8-EP(5x6). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownW25Q128JVPIQ
Winbond Elec · NOR FLASH · WSON-8-EP(5x6)
W25Q128JVPIQ from Winbond Elec, in a WSON-8-EP(5x6). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | /CS | input | Chip Select Input; driving it high deselects the device and puts DO/IO pins in high impedance, and it must track VCC at power-up and power-down. |
| 2 | DO (IO1) | bidirectional | Data Output (Data Input Output 1) used for standard and dual SPI instructions; it is high impedance when the device is deselected. |
| 3 | /WP (IO2) | bidirectional | Write Protect Input (Data Input Output 2) that is active low and is used as IO2 for Quad SPI instructions when QE=1. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | DI (IO0) | bidirectional | Data Input (Data Input Output 0) used for standard and dual SPI instructions, sampled on the rising edge of CLK. |
| 6 | CLK | input | Serial Clock Input that provides the timing for serial input and output operations. |
| 7 | /HOLD (IO3) | bidirectional | Hold Input (Data Input Output 3) that is active low and pauses the device while selected in standard/dual SPI; it is used as IO3 for Quad SPI when QE=1 and the hold function is then disabled. |
| 8 | VCC | power_in | Power Supply; the device operates on a single 2.7V to 3.6V supply. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Winbond Elec |
| Package | WSON-8-EP(5x6) |
| Category | Memory |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
W25Q128JVPIQ - Footprint:
Package_SON:WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4.3mm - 3D model: WSON-8-EP(5x6) (KiCad packages3D, STEP)
- 3D model files:
w25q128jvpiq-etched.step/w25q128jvpiq-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);w25q128jvpiq.step/w25q128jvpiq.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Winbond Elec datasheet (78 pp, sha256
809f066e62bcde10, retrieved 2026-10-08, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).