component
W25N50
Public Made by Adomby adom
Shandong Jingdao Microelectronics MOSFETs, TO-247-3L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 13d ago |
| viewers | 13d ago |
| package.json | 13d ago |
| page.json | 13d ago |
| README.md | 13d ago |
| w25n50-etched.glb | 13d ago |
| w25n50-etched.step | 13d ago |
| w25n50-hero.glb | 13d ago |
| w25n50-hero.overlay.json | 13d ago |
| w25n50.glb | 13d ago |
| w25n50.kicad_mod | 13d ago |
| w25n50.kicad_sym | 13d ago |
| w25n50.lbr | 13d ago |
| w25n50.step | 13d ago |
W25N50
Shandong Jingdao Microelectronics · MOSFETs · TO-247-3L
W25N50 from Shandong Jingdao Microelectronics, in a TO-247-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal of the MOSFET, rated for a gate-source voltage VGSS of ±30 V. |
| 2 | Drain | passive | Drain terminal, rated for a drain-source voltage VDSS of 500 V and a continuous drain current ID of 25 A. |
| 3 | Source | passive | Source terminal, the reference for the gate-source voltage and the drain-source breakdown voltage BVDSS of 500 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shandong Jingdao Microelectronics |
| Package | TO-247-3L |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 500 | V | VGS=0V,ID=250uA | 2 | ||
| Gate Threshold Voltage | VGS(TH) | 2 | 4 | V | VDS=VGS,ID=250uA | 2 | |
| Static Drain-Source On-State Resistance | RDS(ON) | 0.27 | Ω | VGS=10V,ID=12.5A | 2 | ||
| Drain-Source Leakage Current | IDSS | 1 | uA | VDS=500V,VGS=0V | 2 | ||
| Gate-Source Leakage Current | IGSS | -100 | 100 | nA | Forward VGS=30V,VDS=0V; Reverse VGS=-30V,VDS=0V | 2 | |
| Drain-Source Voltage | VDSS | 500 | V | 1 | |||
| Gate-Source Voltage | VGSS | -30 | 30 | V | 1 | ||
| Continuous Drain Current | ID | 25 | A | Tc=25℃ | 1 | ||
| Continuous Drain Current | ID | 17.6 | A | Tc=100℃ | 1 | ||
| Pulsed Drain Current | IDM | 100 | A | Note 2: pulse width limited by maximum junction temperature | 1 | ||
| Avalanche Energy Single Pulsed | EAS | 780 | mJ | Note 3: L=6.1mH, IAS=16A, VDD=50V, RG=25Ω, Starting TJ=25°C | 1 | ||
| Power Dissipation | PD | 219 | W | 1 | |||
| Peak Diode Recovery dv/dt | dv/dt | 50 | V/ns | Note 4: ISD≤16A, di/dt≤200A/μs, VDD≤BVDSS, Starting TJ=25°C | 1 | ||
| Operation Junction and Storage Temperature | Tj,Tstg | -55 | 150 | °C | 1 | ||
| Junction to Ambient Thermal Resistance | RthJA | 62.5 | °C/W | 1 | |||
| Junction to Case Thermal Resistance | RthJC | 0.57 | °C/W | 1 | |||
| Input Capacitance | CISS | 2660 | pF | VDS=25V, VGS=0V, f=1.0MHz | 2 | ||
| Output Capacitance | COSS | 220 | pF | VDS=25V, VGS=0V, f=1.0MHz | 2 | ||
| Reverse Transfer Capacitance | CRSS | 10.4 | pF | VDS=25V, VGS=0V, f=1.0MHz | 2 | ||
| Total Gate Charge | QG | 30 | nC | VDS=400V,VGS=10V,ID=25A,IG=1mA (NOTE1,2) | 2 | ||
| Gate-Drain Charge | QGD | 12 | nC | VDS=400V,VGS=10V,ID=25A,IG=1mA (NOTE1,2) | 2 | ||
| Gate-Source Charge | QGS | 8 | nC | VDS=400V,VGS=10V,ID=25A,IG=1mA (NOTE1,2) | 2 | ||
| Turn-On Delay Time | tD(ON) | 26 | ns | VDS=250V,VGS=10V,ID=25A,RG=25Ω (NOTE1,2) | 2 | ||
| Turn-On Rise Time | tR | 72 | ns | VDS=250V,VGS=10V,ID=25A,RG=25Ω (NOTE1,2) | 2 | ||
| Turn-Off Delay Time | tD(OFF) | 49 | ns | VDS=250V,VGS=10V,ID=25A,RG=25Ω (NOTE1,2) | 2 | ||
| Turn-Off Fall Time | tF | 40 | ns | VDS=250V,VGS=10V,ID=25A,RG=25Ω (NOTE1,2) | 2 | ||
| Maximum Body-Diode Continuous Current | IS | 16 | A | 2 | |||
| Maximum Body-Diode Pulsed Current | ISM | 64 | A | 2 | |||
| Drain-Source Diode Forward Voltage | VSD | 1.4 | V | IS=25A,VGS=0V | 2 | ||
| Reverse Recovery Time | trr | 470 | ns | IS=25A,VGS=0V,di/dt=100A/us (NOTE1) | 2 | ||
| Reverse Recovery Charge | Qrr | 5 | uC | IS=25A,VGS=0V,di/dt=100A/us | 2 |
CAD (KiCad official)
- Symbol:
W25N50 - Footprint:
Package_TO_SOT_THT:TO-247-3_Vertical - 3D model: TO-247-3L (KiCad packages3D, STEP)
- 3D model files:
w25n50-etched.step/w25n50-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);w25n50.step/w25n50.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shandong Jingdao Microelectronics datasheet (8 pp, sha256
795d55ed264ab013, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusoff(skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).