# W25N02KVZEIR TR

**Winbond Elec** · NAND FLASH · WSON-8(6x8)

W25N02KVZEIR TR from Winbond Elec, in a WSON-8(6x8). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | /CS | input | Active-low chip select input; device is selected when low and deselected when high with I/O pins driven to high impedance. |
| 2 | DO (IO1) | bidirectional | Serial data output in standard SPI mode; functions as bidirectional IO1 data I/O in dual and quad SPI modes. |
| 3 | /WP (IO2) | bidirectional | Active-low write protect input for hardware protection of status register in standard/dual SPI mode; functions as bidirectional IO2 data I/O in quad SPI mode. |
| 4 | GND | power_in | Ground reference; device ground connection. |
| 5 | DI (IO0) | bidirectional | Serial data input in standard SPI mode; functions as bidirectional IO0 data I/O in dual and quad SPI modes. |
| 6 | CLK | input | Serial clock input for SPI synchronization; supports clock frequencies up to 104 MHz. |
| 7 | /HOLD (IO3) | bidirectional | Active-low hold input that pauses device operation during standard/dual SPI modes; functions as bidirectional IO3 data I/O in quad SPI mode. |
| 8 | VCC | power_in | Power supply input; device operates with supply voltage between 2.7V and 3.6V. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Winbond Elec |
| Package | WSON-8(6x8) |
| Category | Memory |
| Pins | 9 |

## CAD (KiCad official)

- Symbol: `W25N02KVZEIR TR`
- Footprint: `Package_SON:WSON-8-1EP_8x6mm_P1.27mm_EP3.4x4.3mm`
- 3D model: WSON-8(6x8), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.75 mm nominal WSON height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `w25n02kvzeir-tr-etched.step` / `w25n02kvzeir-tr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `w25n02kvzeir-tr.step` / `w25n02kvzeir-tr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Winbond Elec datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590908217675767808) (74 pp, sha256 `3b1ab7e5f738d915`, retrieved 2026-10-01, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-4-6` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/w25n02kvzeir-tr-datasheet.pdf)