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VSSB310-E3

Vishay Intertech · Schottky Diodes · SMB(DO-214AA)

VSSB310-E3 from Vishay Intertech, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRRM 100 V 1
Maximum DC forward current IF (1) 3 A Note (1): mounted on 10 mm x 10 mm pad areas, 1 oz. FR4 PCB 1
Maximum DC forward current IF (2) 1.9 A Note (2): free air, mounted on recommended copper pad area 1
Peak forward surge current IFSM 80 A 10 ms single half sine-wave superimposed on rated load 1
Non-repetitive avalanche energy EAS 50 mJ at TJ = 25 °C, L = 60 mH 1
Peak repetitive reverse current IRRM 1 A tp = 2 μs, 1 kHz, TJ = 38 °C ± 2 °C 1
Operating junction and storage temperature range TJ, TSTG -40 150 °C 1
Breakdown voltage VBR 100 V IR = 1.0 mA, TA = 25 °C 2
Instantaneous forward voltage VF (1) 0.62 0.7 V IF = 3.0 A, TA = 25 °C; pulse test 300 µs pulse width, 1 % duty cycle (note 1) 2
Instantaneous forward voltage VF (1) 0.56 0.65 V IF = 3.0 A, TA = 125 °C; pulse test 300 µs pulse width, 1 % duty cycle (note 1) 2
Reverse current IR (2) 7 250 μA VR = 100 V, TA = 25 °C; pulse width ≤ 40 ms (note 2) 2
Reverse current IR (2) 3.6 20 mA VR = 100 V, TA = 125 °C; pulse width ≤ 40 ms (note 2) 2
Reverse current IR (2) 1.5 μA VR = 70 V, TA = 25 °C; pulse width ≤ 40 ms (note 2) 2
Reverse current IR (2) 1.2 mA VR = 70 V, TA = 125 °C; pulse width ≤ 40 ms (note 2) 2
Typical junction capacitance CJ 230 pF 4.0 V, 1 MHz 2
Typical thermal resistance, junction to ambient RJA 120 °C/W Note (1): free air, mounted on recommended PCB 1 oz. pad area 2
Typical thermal resistance, junction to mount RJM 15 °C/W Note (2): units mounted on PCB with 10 mm x 10 mm copper pad areas 2

CAD (KiCad official)

  • Symbol: VSSB310-E3
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: vssb310-e3-etched.step / vssb310-e3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); vssb310-e3.step / vssb310-e3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (4 pp, sha256 f9d9c11dfb784512, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF