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README

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VSC8664XIC

Microchip Tech · Telecommunication Interface ICs · BGA-256(17x17)

VSC8664XIC from Microchip Tech, in a BGA-256(17x17). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
A1 NC unconnected No-connect ball; leave floating and do not connect it to other pins or ground.
A2 TXVPA_3 passive Channel A positive TX/RX signal of the twisted pair interface on PHY 3 (ADIFF).
A3 TXVPB_3 passive Channel B positive TX/RX signal of the twisted pair interface on PHY 3 (ADIFF).
A4 TXVPC_3 passive Channel C positive TX/RX signal of the twisted pair interface on PHY 3 (ADIFF).
A5 TXVPD_3 passive Channel D positive TX/RX signal of the twisted pair interface on PHY 3 (ADIFF).
A6 TXVPA_2 passive Channel A positive TX/RX signal of the twisted pair interface on PHY 2 (ADIFF).
A7 TXVPB_2 passive Channel B positive TX/RX signal of the twisted pair interface on PHY 2 (ADIFF).
A8 TXVPC_2 passive Channel C positive TX/RX signal of the twisted pair interface on PHY 2 (ADIFF).
A9 TXVPD_2 passive Channel D positive TX/RX signal of the twisted pair interface on PHY 2 (ADIFF).
A10 TXVPA_1 passive Channel A positive TX/RX signal of the twisted pair interface on PHY 1 (ADIFF).
A11 TXVPB_1 passive Channel B positive TX/RX signal of the twisted pair interface on PHY 1 (ADIFF).
A12 TXVPC_1 passive Channel C positive TX/RX signal of the twisted pair interface on PHY 1 (ADIFF).
A13 TXVPD_1 passive Channel D positive TX/RX signal of the twisted pair interface on PHY 1 (ADIFF).
A14 TXVPA_0 passive Channel A positive TX/RX signal of the twisted pair interface on PHY 0 (ADIFF).
A15 TXVPB_0 passive Channel B positive TX/RX signal of the twisted pair interface on PHY 0 (ADIFF).
A16 NC unconnected No-connect ball; leave floating and do not connect it to other pins or ground.
B1 VSS power_in 0 V general device ground.
B2 TXVNA_3 passive Channel A negative TX/RX signal of the twisted pair interface on PHY 3 (ADIFF).
B3 TXVNB_3 passive Channel B negative TX/RX signal of the twisted pair interface on PHY 3 (ADIFF).
B4 TXVNC_3 passive Channel C negative TX/RX signal of the twisted pair interface on PHY 3 (ADIFF).
B5 TXVND_3 passive Channel D negative TX/RX signal of the twisted pair interface on PHY 3 (ADIFF).
B6 TXVNA_2 passive Channel A negative TX/RX signal of the twisted pair interface on PHY 2 (ADIFF).
B7 TXVNB_2 passive Channel B negative TX/RX signal of the twisted pair interface on PHY 2 (ADIFF).
B8 TXVNC_2 passive Channel C negative TX/RX signal of the twisted pair interface on PHY 2 (ADIFF).
B9 TXVND_2 passive Channel D negative TX/RX signal of the twisted pair interface on PHY 2 (ADIFF).
B10 TXVNA_1 passive Channel A negative TX/RX signal of the twisted pair interface on PHY 1 (ADIFF).
B11 TXVNB_1 passive Channel B negative TX/RX signal of the twisted pair interface on PHY 1 (ADIFF).
B12 TXVNC_1 passive Channel C negative TX/RX signal of the twisted pair interface on PHY 1 (ADIFF).
B13 TXVND_1 passive Channel D negative TX/RX signal of the twisted pair interface on PHY 1 (ADIFF).
B14 TXVNA_0 passive Channel A negative TX/RX signal of the twisted pair interface on PHY 0 (ADIFF).
B15 TXVNB_0 passive Channel B negative TX/RX signal of the twisted pair interface on PHY 0 (ADIFF).
B16 VSS power_in 0 V general device ground.
C1 XTAL2 passive Crystal oscillator output; connect the crystal across XTAL1 and XTAL2 with 33 pF to ground, or leave floating when driving XTAL1/REFCLK with a reference clock.
C2 VDD33 power_in General 3.3 V power supply.
C3 VSS power_in 0 V general device ground.
C4 VDD33 power_in General 3.3 V power supply.
C5 VSS power_in 0 V general device ground.
C6 VDD33 power_in General 3.3 V power supply.
C7 VDD12A power_in 1.2 V analog power supply requiring additional PCB power supply filtering.
C8 VDD12A power_in 1.2 V analog power supply requiring additional PCB power supply filtering.
C9 VDD12A power_in 1.2 V analog power supply requiring additional PCB power supply filtering.
C10 RESERVED unconnected Reserved pin; leave unconnected (floating).
C11 VDD33 power_in General 3.3 V power supply.
C12 VSS power_in 0 V general device ground.
C13 VDD12A power_in 1.2 V analog power supply requiring additional PCB power supply filtering.
C14 VDD33 power_in General 3.3 V power supply.
C15 TXVNC_0 passive Channel C negative TX/RX signal of the twisted pair interface on PHY 0 (ADIFF).
C16 TXVPC_0 passive Channel C positive TX/RX signal of the twisted pair interface on PHY 0 (ADIFF).
D1 XTAL1/REFCLK input Crystal input when OSCEN is high (25 MHz parallel-resonant crystal, ±50 ppm, with 33 pF to ground); reference clock input when OSCEN is low (25 MHz with PLLMODE low, or 125 MHz with PLLMODE high).
D2 OSCEN input Oscillator enable, sampled on the rising edge of NRESET; high enables the on-chip oscillator, and low or floating disables it.
D3 REF_FILT passive Reference filter pin; connect to an external 1 µF capacitor to analog ground.
D4 REF_REXT passive Reference external pin; connect to an external 2 kΩ (1%) resistor to analog ground.
D5 VSS power_in 0 V general device ground.
D6 VSS power_in 0 V general device ground.
D7 VSS power_in 0 V general device ground.
D8 VSS power_in 0 V general device ground.
D9 VSS power_in 0 V general device ground.
D10 VSS power_in 0 V general device ground.
D11 VSS power_in 0 V general device ground.
D12 VSS power_in 0 V general device ground.
D13 RESERVED unconnected Reserved pin; leave unconnected (floating).
D14 CMODE5 passive Configuration mode (CMODE) analog input used to set device functions at reset.
D15 TXVND_0 passive Channel D negative TX/RX signal of the twisted pair interface on PHY 0 (ADIFF).
D16 TXVPD_0 passive Channel D positive TX/RX signal of the twisted pair interface on PHY 0 (ADIFF).
E1 PLLMODE input PLL mode select sampled at power-up or reset; low requires a 25 MHz REFCLK, high requires 125 MHz, and it must be pulled low when using a crystal.
E2 TMS input JTAG test mode select input, with on-chip pull-up to VDD33; 5 V tolerant.
E3 NTRST input JTAG reset input, with on-chip pull-up to VDD33; when JTAG is not used, tie it to VSS with a pull-down resistor.
E4 VDD33 power_in General 3.3 V power supply.
E5 VDD12 power_in 1.2 V supply for the internal digital logic.
E6 VSS power_in 0 V general device ground.
E7 VSS power_in 0 V general device ground.
E8 VSS power_in 0 V general device ground.
E9 VSS power_in 0 V general device ground.
E10 VSS power_in 0 V general device ground.
E11 VSS power_in 0 V general device ground.
E12 VDD12 power_in 1.2 V supply for the internal digital logic.
E13 RESERVED unconnected Reserved pin; leave unconnected (floating).
E14 CMODE4 passive Configuration mode (CMODE) analog input used to set device functions at reset.
E15 CMODE6 passive Configuration mode (CMODE) analog input used to set device functions at reset.
E16 CMODE7 passive Configuration mode (CMODE) analog input used to set device functions at reset.
F1 TDO output JTAG test serial data output, with on-chip pull-up to VDDIO.
F2 TDI input JTAG test serial data input, with on-chip pull-up to VDD33; 5 V tolerant.
F3 TCK input JTAG test clock input, with on-chip pull-up to VDD33; 5 V tolerant.
F4 VSS power_in 0 V general device ground.
F5 VDD12 power_in 1.2 V supply for the internal digital logic.
F6 VSS power_in 0 V general device ground.
F7 VSS power_in 0 V general device ground.
F8 VSS power_in 0 V general device ground.
F9 VSS power_in 0 V general device ground.
F10 VSS power_in 0 V general device ground.
F11 VSS power_in 0 V general device ground.
F12 VDD12 power_in 1.2 V supply for the internal digital logic.
F13 RESERVED unconnected Reserved pin; leave unconnected (floating).
F14 CMODE2 passive Configuration mode (CMODE) analog input used to set device functions at reset.
F15 CMODE3 passive Configuration mode (CMODE) analog input used to set device functions at reset.
F16 RCVRD_CLK1 output Recovered clock output 1, enabled through register 23G and selectable at 125 MHz or 25 MHz; held low when disabled or when NRESET or NSRESET is asserted.
G1 LED0_0 output Active-low LED direct-drive output for PHY 0 LED 0, driven from VDD33 at 3.3 V; can carry the serial LED stream.
G2 LED1_0 output Active-low LED direct-drive output for PHY 0 LED 1, driven from VDD33 at 3.3 V; can carry the serial LED clock.
G3 LED2_0 output Active-low LED direct-drive output for PHY 0 LED 2, driven from VDD33 at 3.3 V.
G4 LED3_0 output Active-low LED direct-drive output for PHY 0 LED 3, driven from VDD33 at 3.3 V.
G5 VDD12 power_in 1.2 V supply for the internal digital logic.
G6 VSS power_in 0 V general device ground.
G7 VSS power_in 0 V general device ground.
G8 VSS power_in 0 V general device ground.
G9 VSS power_in 0 V general device ground.
G10 VSS power_in 0 V general device ground.
G11 VSS power_in 0 V general device ground.
G12 VDD12 power_in 1.2 V supply for the internal digital logic.
G13 CMODE0 passive Configuration mode (CMODE) analog input used to set device functions at reset.
G14 CMODE1 passive Configuration mode (CMODE) analog input used to set device functions at reset.
G15 CLKOUT output Clock output of 125 MHz that can be enabled or disabled; held low when disabled and not active while NRESET is asserted.
G16 RCVRD_CLK2 output Recovered clock output 2, enabled through register 24G and selectable at 125 MHz or 25 MHz; held low when disabled or when NRESET or NSRESET is asserted.
H1 LED0_1 output Active-low LED direct-drive output for PHY 1 LED 0, driven from VDD33 at 3.3 V.
H2 LED1_1 output Active-low LED direct-drive output for PHY 1 LED 1, driven from VDD33 at 3.3 V.
H3 LED2_1 output Active-low LED direct-drive output for PHY 1 LED 2, driven from VDD33 at 3.3 V.
H4 LED3_1 output Active-low LED direct-drive output for PHY 1 LED 3, driven from VDD33 at 3.3 V.
H5 VDD12 power_in 1.2 V supply for the internal digital logic.
H6 VSS power_in 0 V general device ground.
H7 VSS power_in 0 V general device ground.
H8 VSS power_in 0 V general device ground.
H9 VSS power_in 0 V general device ground.
H10 VSS power_in 0 V general device ground.
H11 VSS power_in 0 V general device ground.
H12 VDD12 power_in 1.2 V supply for the internal digital logic.
H13 VDD33 power_in General 3.3 V power supply.
H14 GPIO13 bidirectional General-purpose input/output with on-chip pull-up to VDDIO or VDD33; can be used as a GPIO pin.
H15 THERMDC passive Thermal diode cathode (n-junction), connected internally to VSS.
H16 THERMDA passive Thermal diode anode (p-junction).
J1 LED0_2 output Active-low LED direct-drive output for PHY 2 LED 0, driven from VDD33 at 3.3 V.
J2 LED1_2 output Active-low LED direct-drive output for PHY 2 LED 1, driven from VDD33 at 3.3 V.
J3 LED2_2 output Active-low LED direct-drive output for PHY 2 LED 2, driven from VDD33 at 3.3 V.
J4 LED3_2 output Active-low LED direct-drive output for PHY 2 LED 3, driven from VDD33 at 3.3 V.
J5 VDD12 power_in 1.2 V supply for the internal digital logic.
J6 VSS power_in 0 V general device ground.
J7 VSS power_in 0 V general device ground.
J8 VSS power_in 0 V general device ground.
J9 VSS power_in 0 V general device ground.
J10 VSS power_in 0 V general device ground.
J11 VSS power_in 0 V general device ground.
J12 VDD12 power_in 1.2 V supply for the internal digital logic.
J13 VSS power_in 0 V general device ground.
J14 GPIO12 bidirectional General-purpose input/output with on-chip pull-up to VDDIO or VDD33; can be used as a GPIO pin.
J15 GPIO14 bidirectional General-purpose input/output with on-chip pull-up to VDDIO or VDD33; can be used as a GPIO pin.
J16 GPIO15 bidirectional General-purpose input/output with on-chip pull-up to VDDIO or VDD33; can be used as a GPIO pin.
K1 LED0_3 output Active-low LED direct-drive output for PHY 3 LED 0, driven from VDD33 at 3.3 V.
K2 LED1_3 output Active-low LED direct-drive output for PHY 3 LED 1, driven from VDD33 at 3.3 V.
K3 LED2_3 output Active-low LED direct-drive output for PHY 3 LED 2, driven from VDD33 at 3.3 V.
K4 LED3_3 output Active-low LED direct-drive output for PHY 3 LED 3, driven from VDD33 at 3.3 V.
K5 VDD12 power_in 1.2 V supply for the internal digital logic.
K6 VSS power_in 0 V general device ground.
K7 VSS power_in 0 V general device ground.
K8 VSS power_in 0 V general device ground.
K9 VSS power_in 0 V general device ground.
K10 VSS power_in 0 V general device ground.
K11 VSS power_in 0 V general device ground.
K12 VDD12 power_in 1.2 V supply for the internal digital logic.
K13 GPIO8/I2C_SDA bidirectional General-purpose input/output that can also serve as the I2C controller SDA pin if not used as GPIO.
K14 GPIO9/FastLinkFail bidirectional General-purpose input/output that also serves as the fast link failure indicator, asserting high when a link fails and the feature is enabled.
K15 GPIO10 bidirectional General-purpose input/output with on-chip pull-up to VDDIO or VDD33; can be used as a GPIO pin.
K16 GPIO11 bidirectional General-purpose input/output with on-chip pull-up to VDDIO or VDD33; can be used as a GPIO pin.
L1 RESERVED unconnected Reserved pin; leave unconnected (floating).
L2 MDINT3 output Management interrupt output for PHY 3, configured as active-low open-drain or active-high open-source by an external resistor at reset.
L3 NSRESET input Active-low device soft reset input; powers down the device, while register bits marked sticky keep their values.
L4 VSS power_in 0 V general device ground.
L5 VDD12 power_in 1.2 V supply for the internal digital logic.
L6 VSS power_in 0 V general device ground.
L7 VSS power_in 0 V general device ground.
L8 VSS power_in 0 V general device ground.
L9 VSS power_in 0 V general device ground.
L10 VSS power_in 0 V general device ground.
L11 VSS power_in 0 V general device ground.
L12 VDD12 power_in 1.2 V supply for the internal digital logic.
L13 GPIO4/I2C_SCL_0 bidirectional General-purpose input/output that can also serve as the I2C controller SCL pin for mux port 0 if not used as GPIO.
L14 GPIO5/I2C_SCL_1 bidirectional General-purpose input/output that can also serve as the I2C controller SCL pin for mux port 1 if not used as GPIO.
L15 GPIO6/I2C_SCL_2 bidirectional General-purpose input/output that can also serve as the I2C controller SCL pin for mux port 2 if not used as GPIO.
L16 GPIO7/I2C_SCL_3 bidirectional General-purpose input/output that can also serve as the I2C controller SCL pin for mux port 3 if not used as GPIO.
M1 RESERVED unconnected Reserved pin; leave unconnected (floating).
M2 MDINT0 output Management interrupt output for PHY 0, configured as active-low open-drain or active-high open-source by an external resistor at reset.
M3 NRESET input Active-low device reset input; powers down the device and sets all register bits to their default state.
M4 VDDIO power_in I/O power supply for MDC, MDIO, MDINTn and NRESET, selectable at 3.3 V, 2.5 V or 1.8 V.
M5 VDD12 power_in 1.2 V supply for the internal digital logic.
M6 VSS power_in 0 V general device ground.
M7 VSS power_in 0 V general device ground.
M8 VSS power_in 0 V general device ground.
M9 VSS power_in 0 V general device ground.
M10 VSS power_in 0 V general device ground.
M11 VSS power_in 0 V general device ground.
M12 VDD12 power_in 1.2 V supply for the internal digital logic.
M13 VDD33 power_in General 3.3 V power supply.
M14 GPIO1/SIGDET1 bidirectional General-purpose input/output that can also serve as the SIGDET input for PHY port 1 if not used as GPIO.
M15 GPIO2/SIGDET2 bidirectional General-purpose input/output that can also serve as the SIGDET input for PHY port 2 if not used as GPIO.
M16 GPIO3/SIGDET3 bidirectional General-purpose input/output that can also serve as the SIGDET input for PHY port 3 if not used as GPIO.
N1 RESERVED unconnected Reserved pin; leave unconnected (floating).
N2 MDIO bidirectional Management data input/output, clocked on the positive edge of MDC; datasheet lists it as open-drain and requires one external pull-up resistor at the station manager (2 kΩ per Section 3.13).
N3 MDINT1 output Management interrupt output for PHY 1, configured as active-low open-drain or active-high open-source by an external resistor at reset.
N4 MDINT2 output Management interrupt output for PHY 2, configured as active-low open-drain or active-high open-source by an external resistor at reset.
N5 VDD12 power_in 1.2 V supply for the internal digital logic.
N6 VSS power_in 0 V general device ground.
N7 VSS power_in 0 V general device ground.
N8 VSS power_in 0 V general device ground.
N9 VSS power_in 0 V general device ground.
N10 VSS power_in 0 V general device ground.
N11 VSS power_in 0 V general device ground.
N12 VDD12 power_in 1.2 V supply for the internal digital logic.
N13 VSS power_in 0 V general device ground.
N14 GPIO0/SIGDET0 bidirectional General-purpose input/output that can also serve as the SIGDET input for PHY port 0 if not used as GPIO.
N15 TDP_0 input SerDes MAC transmitter input pair, positive leg, for PHY 0 (IDIFF).
N16 TDN_0 input SerDes MAC transmitter input pair, negative leg, for PHY 0 (IDIFF).
P1 RESERVED unconnected Reserved pin; leave unconnected (floating).
P2 MDC input Management data clock input, 0 MHz to 12.5 MHz, used to clock MDIO data in and out of the PHY.
P3 VDDIO power_in I/O power supply for MDC, MDIO, MDINTn and NRESET, selectable at 3.3 V, 2.5 V or 1.8 V.
P4 VSS power_in 0 V general device ground.
P5 VDD33 power_in General 3.3 V power supply.
P6 VDD12A power_in 1.2 V analog power supply requiring additional PCB power supply filtering.
P7 VDD12A power_in 1.2 V analog power supply requiring additional PCB power supply filtering.
P8 VDD12A power_in 1.2 V analog power supply requiring additional PCB power supply filtering.
P9 VDD12A power_in 1.2 V analog power supply requiring additional PCB power supply filtering.
P10 VDD12A power_in 1.2 V analog power supply requiring additional PCB power supply filtering.
P11 VDD12A power_in 1.2 V analog power supply requiring additional PCB power supply filtering.
P12 VDD33 power_in General 3.3 V power supply.
P13 VDD33 power_in General 3.3 V power supply.
P14 VSS power_in 0 V general device ground.
P15 RDP_0 output SerDes MAC receiver output pair, positive leg, for PHY 0 (ODIFF).
P16 RDN_0 output SerDes MAC receiver output pair, negative leg, for PHY 0 (ODIFF).
R1 VSS power_in 0 V general device ground.
R2 FIBR_DOP_3 output SerDes media transmitter output pair, positive leg, for PHY 3 (ODIFF).
R3 FIBR_DIP_3 input SerDes media receiver input pair, positive leg, for PHY 3 (IDIFF).
R4 RDP_3 output SerDes MAC receiver output pair, positive leg, for PHY 3 (ODIFF).
R5 TDP_3 input SerDes MAC transmitter input pair, positive leg, for PHY 3 (IDIFF).
R6 FIBR_DOP_2 output SerDes media transmitter output pair, positive leg, for PHY 2 (ODIFF).
R7 FIBR_DIP_2 input SerDes media receiver input pair, positive leg, for PHY 2 (IDIFF).
R8 RDP_2 output SerDes MAC receiver output pair, positive leg, for PHY 2 (ODIFF).
R9 TDP_2 input SerDes MAC transmitter input pair, positive leg, for PHY 2 (IDIFF).
R10 FIBR_DOP_1 output SerDes media transmitter output pair, positive leg, for PHY 1 (ODIFF).
R11 FIBR_DIP_1 input SerDes media receiver input pair, positive leg, for PHY 1 (IDIFF).
R12 RDP_1 output SerDes MAC receiver output pair, positive leg, for PHY 1 (ODIFF).
R13 TDP_1 input SerDes MAC transmitter input pair, positive leg, for PHY 1 (IDIFF).
R14 FIBR_DOP_0 output SerDes media transmitter output pair, positive leg, for PHY 0 (ODIFF).
R15 FIBR_DIP_0 input SerDes media receiver input pair, positive leg, for PHY 0 (IDIFF).
R16 VSS power_in 0 V general device ground.
T1 NC unconnected No-connect ball; leave floating and do not connect it to other pins or ground.
T2 FIBR_DON_3 output SerDes media transmitter output pair, negative leg, for PHY 3 (ODIFF).
T3 FIBR_DIN_3 input SerDes media receiver input pair, negative leg, for PHY 3 (IDIFF).
T4 RDN_3 output SerDes MAC receiver output pair, negative leg, for PHY 3 (ODIFF).
T5 TDN_3 input SerDes MAC transmitter input pair, negative leg, for PHY 3 (IDIFF).
T6 FIBR_DON_2 output SerDes media transmitter output pair, negative leg, for PHY 2 (ODIFF).
T7 FIBR_DIN_2 input SerDes media receiver input pair, negative leg, for PHY 2 (IDIFF).
T8 RDN_2 output SerDes MAC receiver output pair, negative leg, for PHY 2 (ODIFF).
T9 TDN_2 input SerDes MAC transmitter input pair, negative leg, for PHY 2 (IDIFF).
T10 FIBR_DON_1 output SerDes media transmitter output pair, negative leg, for PHY 1 (ODIFF).
T11 FIBR_DIN_1 input SerDes media receiver input pair, negative leg, for PHY 1 (IDIFF).
T12 RDN_1 output SerDes MAC receiver output pair, negative leg, for PHY 1 (ODIFF).
T13 TDN_1 input SerDes MAC transmitter input pair, negative leg, for PHY 1 (IDIFF).
T14 FIBR_DON_0 output SerDes media transmitter output pair, negative leg, for PHY 0 (ODIFF).
T15 FIBR_DIN_0 input SerDes media receiver input pair, negative leg, for PHY 0 (IDIFF).
T16 NC unconnected No-connect ball; leave floating and do not connect it to other pins or ground.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package BGA-256(17x17)
Category Interface ICs
Pins 256

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage for VDDIO at 1.8 V VDDIO 1.7 1.8 1.9 V 85
Power supply voltage for VDDIO at 2.5 V VDDIO 2.37 2.5 2.63 V 85
Power supply voltage for VDDIO at 3.3 V VDDIO 3.13 3.3 3.47 V 85
Power supply voltage for VDD33 VDD33 3.13 3.3 3.47 V 85
Power supply voltage for VDD12 VDD12 1.14 1.2 1.26 V 85
Power supply voltage for VDD12A VDD12A 1.14 1.2 1.26 V 85
VSC8664 operating temperature T 0 90 °C Lower limit ambient, upper limit case (VSC8664XIC) 85
DC input voltage on VDDIO supply pin VDDIO -0.5 4 V 85
DC input voltage on VDD33 supply pin VDD33 -0.5 4 V 85
DC input voltage on VDD12 supply pin VDD12 -0.5 1.4 V 85
DC input voltage on VDD12A supply pin VDD12A -0.5 1.4 V 85
DC input voltage on JTAG 5 V-tolerant pins VDD(5 V) -0.5 5.5 V 85
DC input voltage on any non-supply pin VDD(PIN) -0.5 V Printed maximum is VDD + 0.5 V (not numeric) 85
Storage temperature TS -65 150 °C 85
Electrostatic discharge voltage, charged device model VESD_CDM -500 500 V 85
Output high voltage (VDD33 at 3.30 V) VOH 2.4 3.6 V IOH = -4 mA 76
Output low voltage (VDD33 at 3.30 V) VOL 0 0.5 V IOL = 4 mA 76
Input high voltage (VDD33 at 3.30 V) VIH 2.1 3.6 V 77
Input low voltage (VDD33 at 3.30 V) VIL -0.3 0.9 V 77
Output high voltage (VDDIO at 3.3 V) VOH 2.4 3.6 V IOH = -4 mA 75
Output low voltage (VDDIO at 3.3 V) VOL 0 0.5 V IOL = 4 mA 75
Input high voltage (VDDIO at 3.3 V) VIH 2.1 3.6 V 75
Input low voltage (VDDIO at 3.3 V) VIL -0.3 0.9 V 75
Output high voltage (VDDIO at 2.5 V) VOH 2 2.8 V IOH = -1.0 mA 75
Output low voltage (VDDIO at 2.5 V) VOL -0.3 0.4 V IOL = 1.0 mA 75
Input high voltage (VDDIO at 2.5 V) VIH 1.7 3 V 76
Input low voltage (VDDIO at 2.5 V) VIL -0.3 0.7 V 76
Output high voltage (VDDIO at 1.8 V) VOH 1.4 2.1 V IOH = -0.5 mA 76
Output low voltage (VDDIO at 1.8 V) VOL 0.3 V IOL = 0.5 mA 76
Input high voltage (VDDIO at 1.8 V) VIH 1.2 2.1 V 76
Input low voltage (VDDIO at 1.8 V) VIL 0.6 V 76
Output differential voltage (MAC_RDP/N_n, FIBR_DOP/N_n) VODIFF 700 1000 1200 mV Measured peak-to-peak. Based on 100 Ω differential load. 77
Output common-mode voltage (MAC_RDP/N_n, FIBR_DOP/N_n) VOCM 480 540 610 mV VDD12A = 1.20 V. 77
Input differential voltage (MAC_TDP/N_n, FIBR_DIP/N_n) VIDIFF 120 2400 mV Measured peak-to-peak. Based on 100 Ω differential load. 77
Input common mode voltage (MAC_TDP/N_n, FIBR_DIP/N_n) VICM 0.4 1.3 V VDD12A = 1.20 V. 77
Output high voltage (LED[3:0]_n) VOH 2.4 3.6 V IOH = -4.0 mA 78
Output low voltage (LED[3:0]_n) VOL 0 0.5 V IOL = 4.0 mA 78
Output high voltage (JTAG pins) VOH 2.4 3.6 V IOH = -1.5 mA 78
Output low voltage (JTAG pins) VOL 0 0.5 V IOL = 1.5 mA 78
Input high voltage (JTAG pins) VIH 2.1 3.6 V 78
Input low voltage (JTAG pins) VIL -0.3 0.9 V 78
Worst-case power consumption PD 3.19 W Typical Maximum column; single value printed, assigned to max 79
Current with VDDIO at 3.3 V IVDDIO 1 mA Typical Maximum column; single value printed, assigned to max 79
Current with VDD33 at 3.3 V IVDD33 460 mA Typical Maximum column; single value printed, assigned to max 79
Current with VDD12 at 1.2 V IVDD12 774 mA Typical Maximum column; single value printed, assigned to max 79
Current with VDD12A at 1.2 V IVDD12A 273 mA Typical Maximum column; single value printed, assigned to max 79
Frequency stability (REFCLK input frequency accuracy) fTOL 100 ppm 80
REFCLK duty cycle %DUTY 40 60 % 80
CLKOUT duty cycle %DUTY 40 50 60 % 80
RCVRD_CLK duty cycle %DUTY 45 50 55 % 81
Total jitter for 1000BASE-T (RCVRD_CLK) JCLK 325 400 ps Measured peak-to-peak 81
Total receive jitter tolerance (MAC_TDP/N_n, FIBR_DIP/N_n) JRXTotal 610 ps Measured peak-to-peak. 1000BASE-X mode. 82
MDC frequency fCLK 2.5 12.5 MHz 83
NRESET assertion time tRESET 100 ns 83
Thermal resistance junction-to-case θJC 7.5 °C/W 103
Thermal resistance junction-to-board θJB 11.2 °C/W 103
Thermal resistance junction-to-ambient θJA 21.9 °C/W 0 ft/min airflow 103
Thermal resistance junction-to-ambient θJA 20.4 °C/W 100 ft/min airflow 103
Thermal resistance junction-to-ambient θJA 19.4 °C/W 200 ft/min airflow 103

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC (BGA) with a 17 mm × 17 mm body size, 1 mm pin pitch, and 2 mm maximum height. Lead-free products from Vitesse comply with the temperatures and profiles defined in the joint IPC and 101
contacts copper • Supports 100BASE-FX fiber, 1000BASE-X fiber, and triple-speed copper SFPs over SerDes pins 13

CAD (KiCad official)

  • Symbol: VSC8664XIC
  • Footprint: Package_BGA:BGA-256_17.0x17.0mm_Layout16x16_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD
  • 3D model: BGA-256(17x17) (KiCad packages3D, STEP)
  • 3D model files: vsc8664xic-etched.step / vsc8664xic-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); vsc8664xic.step / vsc8664xic.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (108 pp, sha256 9cf43c1020671c57, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF