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VIPER35HDTR

STMicroelectronics · AC-DC Controllers & Regulators · SOIC-16

VIPER35HDTR from STMicroelectronics, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Device ground and source of the power MOSFET.
2 GND power_in Device ground and source of the power MOSFET.
3 N.C. unconnected Not internally connected; it can be connected to GND.
4 N.A. passive Not available for user; it is mechanically connected to the controller die pad of the frame and should be connected to GND (pins 1, 2) to improve noise immunity.
5 VDD power_in Supply voltage of the control section that provides the charging current of the external capacitor during power-up; the absolute maximum VDD is self-limited and the input current IDD is rated at 25 mA.
6 ZCD input Multifunction pin providing zero-current detection for quasi-resonant operation, drain current limit (IDlim) setup via RLIM, feed-forward compensation setup via RFF, and output overvoltage protection setup via the ROVP/RLIM divider; the input pin voltage is self-limited with IZCD = 1 mA.
7 FB input Control input for duty cycle control, where a voltage below VFBbm activates burst-mode operation and a level close to VFBlin means the cycle-by-cycle overcurrent set-point is close; the absolute input voltage range is -0.3 V to 5.5 V.
8 BR input Brown-out protection input with hysteresis that shuts down (does not latch) the device when below VBRth and restarts when the voltage exceeds VBRth + VBRhyst; it must be connected to ground when not used.
9 N.C. unconnected Not internally connected; must be left floating to get a safe clearance distance.
10 N.C. unconnected Not internally connected; must be left floating to get a safe clearance distance.
11 N.C. unconnected Not internally connected; must be left floating to get a safe clearance distance.
12 N.C. unconnected Not internally connected; must be left floating to get a safe clearance distance.
13 DRAIN passive High voltage drain pin rated for 800 V drain-to-source (ground); the built-in high voltage start-up bias current is drawn from this pin, and it is connected to the metal frame to help heat dissipation.
14 DRAIN passive High voltage drain pin rated for 800 V drain-to-source (ground); the built-in high voltage start-up bias current is drawn from this pin, and it is connected to the metal frame to help heat dissipation.
15 DRAIN passive High voltage drain pin rated for 800 V drain-to-source (ground); the built-in high voltage start-up bias current is drawn from this pin, and it is connected to the metal frame to help heat dissipation.
16 DRAIN passive High voltage drain pin rated for 800 V drain-to-source (ground); the built-in high voltage start-up bias current is drawn from this pin, and it is connected to the metal frame to help heat dissipation.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SOIC-16
Category Power Management ICs
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-source (ground) voltage VDRAIN 800 V 8
Repetitive avalanche energy EAV 5 mJ limited by TJ = 150 °C 8
Repetitive avalanche current IAR 1.5 A limited by TJ = 150 °C 8
Single pulse drain current IDRAIN 3 A 8
Input pin voltage (ZCD) VZCD -0.3 V with IZCD = 1 mA; max self limited 8
Input pin voltage (FB) VFB -0.3 5.5 V 8
Input pin voltage (BR) VBR -0.3 V with IBR = 0.25 mA; max self limited 8
Supply voltage VDD -0.3 V max self limited 8
Input current IDD 25 mA 8
Power dissipation PTOT 1.5 W TA < 60 °C 8
Operating junction temperature range TJ -40 150 °C 8
Storage temperature TSTG -55 150 °C 8
Thermal resistance junction to pin (SO16N) RthJP 35 °C/W dissipated power = 1 W 8
Thermal resistance junction to ambient (SO16N) RthJA 110 °C/W dissipated power = 1 W 8
Thermal resistance junction to ambient, FR4 100 mm2 Cu (SO16N) RthJA 80 °C/W dissipated power = 1 W; standard single side FR4 board, 100 mm2 Cu (footnote 1) 8
Off-state drain current IOFF 60 uA VDRAIN = 800 V, VFB = GND, TJ = 25 °C 9
Drain-source on-state resistance RDS(on) 4.5 Ω IDRAIN = 0.4 A, VFB = 3 V, VBR = GND, TJ = 25 °C 9
Drain-source on-state resistance RDS(on) 9 Ω IDRAIN = 0.4 A, VFB = 3 V, VBR = GND, TJ = 125 °C 9
Drain-source start voltage VDRAIN_START 60 80 100 V 9
Start-up charging current (power-up) IDDch1 -2 -3 -4 mA VDRAIN = 120 V, VBR = GND, VFB = GND, VDD = 4 V 9
Start-up charging current (auto-restart) IDDch2 -0.4 -0.6 -0.8 mA VDRAIN = 120 V, VBR = GND, VFB = GND, VDD = 5 V, after fault 9
Operating voltage range VDD 8.5 23.5 V After turn-on 9
VDD start-up threshold VDDon 13 14 15 V VDRAIN = 120 V, VBR = GND, VFB = GND 9
VDD undervoltage shutdown threshold VDDoff 7.5 8 8.5 V 9
VDD restart voltage threshold VDD(RESTART) 4 4.5 5 V 9
Overvoltage threshold VOVP 3.8 4.2 4.6 V 12
Internal frequency limit (H type) FOSClim 200 225 250 kHz VIPER35H 12
Brown-out threshold VBRth 0.41 0.45 0.49 A Voltage falling 12
Brown-out voltage hysteresis above VBRth VBRHyst 40 50 60 mV 12
Brown-out current hysteresis IBRHyst 7 12 µA 12
Brown-out disable voltage VDIS 50 150 mV 12
Thermal shutdown temperature TSD 150 160 °C specification assured by design, characterization and statistical correlation (footnote 1) 12
Breakdown voltage VBVDSS 800 V IDRAIN = 1 mA, VFB = GND, TJ = 25 °C 9
Effective (energy related) output capacitance COSS 17 pF VDRAIN = 0 to 640 V 9
Clamp voltage VDDclamp 23.5 V IDD = 20 mA 9
Strobe time tSTROBE 2.2 µs 12
Brown-out clamp voltage VBRclamp 3 V IBR = 250 µA 12
Thermal shutdown hysteresis THYST 30 °C specification assured by design, characterization and statistical correlation (footnote 1) 12

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper Note: The copper area for heat dissipation has to be designed under the DRAIN pins. 7

CAD (KiCad official)

  • Symbol: VIPER35HDTR
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: viper35hdtr-etched.step / viper35hdtr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); viper35hdtr.step / viper35hdtr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (44 pp, sha256 99aabfeaadc8ea2d, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF