VIPER06HSTR from STMicroelectronics, in a SOP-10. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	GND	power_in	Connected to the source of the internal power MOSFET and controller ground reference.
2	VDD	power_in	Supply voltage of the control section that provides the charging current of the external capacitor, with an operating voltage range of 11.5 V to 23.5 V.
3	LIM	input	Sets the drain current limitation; an external resistor to GND reduces the limit, and the pin is left open for the default limitation.
4	FB	input	Inverting input of the internal transconductance error amplifier with reference voltage VREF_FB of 3.2 V to 3.4 V; a single resistor from output gives the reference voltage, and an external divider is required for higher output voltages.
5	COMP	output	Output of the internal transconductance error amplifier; the compensation network is placed between this pin and GND, with a linear voltage range from VCOMPL to VCOMPH.
6	DRAIN	passive	High-voltage drain pin of the internal power MOSFET, rated 800 V, which also draws the high-voltage switched startup bias current and is connected to the metal frame for heat dissipation.
7	DRAIN	passive	High-voltage drain pin of the internal power MOSFET, rated 800 V, which also draws the high-voltage switched startup bias current and is connected to the metal frame for heat dissipation.
8	DRAIN	passive	High-voltage drain pin of the internal power MOSFET, rated 800 V, which also draws the high-voltage switched startup bias current and is connected to the metal frame for heat dissipation.
9	DRAIN	passive	High-voltage drain pin of the internal power MOSFET, rated 800 V, which also draws the high-voltage switched startup bias current and is connected to the metal frame for heat dissipation.
10	DRAIN	passive	High-voltage drain pin of the internal power MOSFET, rated 800 V, which also draws the high-voltage switched startup bias current and is connected to the metal frame for heat dissipation.

Key specifications

Parameter	Value
Manufacturer	STMicroelectronics
Package	SOP-10
Category	Power Management (PMIC)
Pins	10

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Drain-to-source (ground) voltage	VDRAIN			800	V		5
Repetitive avalanche energy	EAV			2	mJ	limited by TJ = 150 °C	5
Repetitive avalanche current	IAR			1	A	limited by TJ = 150 °C	5
Pulse drain current	IDRAIN			2.5	A	limited by TJ = 150 °C	5
Input pin voltage COMP	VCOMP	-0.3		3.5	V		5
Input pin voltage FB	VFB	-0.3		4.8	V		5
Input pin voltage LIM	VLIM	-0.3		2.8	V		5
Input current	IDD			20	mA		5
Power dissipation (SSO10)	PTOT			1	W	TA < 50 °C (SSO10)	5
Operating junction temperature range	TJ	-40		150	°C		5
Storage temperature	TSTG	-55		150	°C		5
Thermal resistance junction pin	RthJP			35	°C/W	dissipated power = 1 W (SSO10)	5
Thermal resistance junction ambient	RthJA			145	°C/W	dissipated power = 1 W (SSO10)	5
Thermal resistance junction ambient (FR4 100 mm2 Cu)	RthJA			90	°C/W	standard single side FR4 board with 100 mm2 Cu (35 µm)	5
Breakdown voltage	VBVDSS	800			V	IDRAIN = 1 mA, VCOMP = GND, TJ = 25 °C	7
OFF state drain current	IOFF			60	µA	VDRAIN = max rating, VCOMP = GND	7
Operating voltage range	VDD	11.5		23.5	V		7
VDD startup threshold	VDDon	12	13	14	V		7
VDD on internal high-voltage current generator threshold	VDDCSon	9.5	10.5	11.5	V		7
VDD undervoltage shutdown threshold	VDDoff	7	8	9	V		7
FB reference voltage	VREF_FB	3.2	3.3	3.4	V		8
Burst mode threshold	VCOMPL	1	1.1	1.2	V	TJ = 25 °C	8
COMP pin voltage change ratio	HCOMP	3		6	V/A	ΔVCOMP / ΔIDRAIN	8
Max source current	ICOMP			220	µA	VCOMP = GND, VFB = GND	8
Drain current limitation	IDlim	0.32	0.35	0.38	A	ILIM = -10 µA, VCOMP = 3.3 V, TJ = 25 °C	8
Switching frequency VIPER06Hx	FOSC	103	115	127	kHz	VIPER06Hx	8
Modulation depth	FD	-8		8	kHz	FOSC = 115 kHz	8
Thermal shutdown temperature	TSD	150	160		°C		8

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts	copper		The copper area for heat dissipation has to be designed under the DRAIN pins.	4

CAD (KiCad official)

Symbol: VIPER06HSTR
Footprint: Package_SO:SOIC-10_3.9x4.9mm_P1mm
3D model: SOP-10 (KiCad packages3D, STEP)
3D model files: viper06hstr-etched.step / viper06hstr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); viper06hstr.step / viper06hstr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: STMicroelectronics datasheet (28 pp, sha256 1f4b7d4d7eefd84f, retrieved 2026-11-05, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

VIPER06HSTR

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3D Model

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Schematic Symbol

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Datasheet

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