component
VBZM150N10
Public Made by Adomby adom
VBsemi Elec MOSFETs, TO-220AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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VBZM150N10
VBsemi Elec · MOSFETs · TO-220AB
VBZM150N10 from VBsemi Elec, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limit is ±20 V with a threshold of 2.5 V to 4 V at ID = 250 μA. |
| 2 | D | passive | Drain; drain-source voltage is rated 100 V and continuous drain current 120 A (package limited) at TC = 25 °C. |
| 3 | S | passive | Source; carries the full drain current up to 120 A continuous and 480 A pulsed (t = 100 μs). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-220AB |
| Category | Transistors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | VDS | 100 | V | VGS = 0 V, ID = 250 μA | 2 | ||
| Gate Threshold Voltage | VGS(th) | 2.5 | 4 | V | VDS = VGS, ID = 250 μA | 2 | |
| Gate-Body Leakage | IGSS | -250 | 250 | nA | VDS = 0 V, VGS = ± 20 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | μA | VDS = 100 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 150 | μA | VDS = 100 V, VGS = 0 V, TJ = 125 °C | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 5 | mA | VDS = 100 V, VGS = 0 V, TJ = 175 °C | 2 | ||
| On-State Drain Current | ID(on) | 120 | A | VDS ≥ 10 V, VGS = 10 V | 2 | ||
| Total Gate Charge | Qg | 76 | 120 | nC | VDS = 50 V, VGS = 10 V, ID = 20 A | 2 | |
| Gate Resistance | Rg | 0.6 | 3.3 | 6.6 | Ω | f = 1 MHz | 2 |
| Turn-On Delay Time | td(on) | 15 | 30 | ns | VDD = 50 V, RL = 5 Ω, ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 22 | 40 | ns | VDD = 50 V, RL = 5 Ω, ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 55 | 100 | ns | VDD = 50 V, RL = 5 Ω, ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 15 | 30 | ns | VDD = 50 V, RL = 5 Ω, ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Body Diode Pulsed Current | ISM | 480 | A | TC = 25 °C | 2 | ||
| Body Diode Forward Voltage | VSD | 0.8 | 1.5 | V | IF = 10 A, VGS = 0 V | 2 | |
| Drain-Source Voltage | VDS | 100 | V | TC = 25 °C | 1 | ||
| Gate-Source Voltage | VGS | -20 | 20 | V | TC = 25 °C | 1 | |
| Continuous Drain Current | ID | 120 | A | TJ = 150 °C, TC = 25 °C | 1 | ||
| Pulsed Drain Current | IDM | 480 | A | t = 100 μs | 1 | ||
| Avalanche Current | IAS | 73 | A | 1 | |||
| Single Avalanche Energy | EAS | 266 | mJ | L = 0.1 mH | 1 | ||
| Maximum Power Dissipation | PD | 370 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 120 | W | TC = 125 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 175 | °C | 1 | ||
| Junction-to-Ambient (PCB Mount) | RthJA | 40 | °C/W | 1 | |||
| Junction-to-Case (Drain) | RthJC | 0.4 | °C/W | 1 | |||
| Drain-Source On-State Resistance | RDS(on) | 0.005 | Ω | VGS = 10 V, ID = 20 A | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.006 | Ω | VGS = 7.5 V, ID = 15 A | 2 | ||
| Forward Transconductance | gfs | 82 | S | VDS = 15 V, ID = 20 A | 2 | ||
| Input Capacitance | Ciss | 10000 | pF | VGS = 0 V, VDS = 50 V, f = 1 MHz | 2 | ||
| Output Capacitance | Coss | 2025 | pF | VGS = 0 V, VDS = 50 V, f = 1 MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 165 | pF | VGS = 0 V, VDS = 50 V, f = 1 MHz | 2 | ||
| Gate-Source Charge | Qgs | 23 | nC | VDS = 50 V, VGS = 10 V, ID = 20 A | 2 | ||
| Gate-Drain Charge | Qgd | 17 | nC | VDS = 50 V, VGS = 10 V, ID = 20 A | 2 |
CAD (KiCad official)
- Symbol:
VBZM150N10 - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220AB (KiCad packages3D, STEP)
- 3D model files:
vbzm150n10-etched.step/vbzm150n10-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);vbzm150n10.step/vbzm150n10.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (8 pp, sha256
3185630fbe805d5f, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# VBZM150N10
**VBsemi Elec** · MOSFETs · TO-220AB
VBZM150N10 from VBsemi Elec, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limit is ±20 V with a threshold of 2.5 V to 4 V at ID = 250 μA. |
| 2 | D | passive | Drain; drain-source voltage is rated 100 V and continuous drain current 120 A (package limited) at TC = 25 °C. |
| 3 | S | passive | Source; carries the full drain current up to 120 A continuous and 480 A pulsed (t = 100 μs). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-220AB |
| Category | Transistors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | VDS | 100 | | | V | VGS = 0 V, ID = 250 μA | 2 |
| Gate Threshold Voltage | VGS(th) | 2.5 | | 4 | V | VDS = VGS, ID = 250 μA | 2 |
| Gate-Body Leakage | IGSS | -250 | | 250 | nA | VDS = 0 V, VGS = ± 20 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | μA | VDS = 100 V, VGS = 0 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 150 | μA | VDS = 100 V, VGS = 0 V, TJ = 125 °C | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 5 | mA | VDS = 100 V, VGS = 0 V, TJ = 175 °C | 2 |
| On-State Drain Current | ID(on) | 120 | | | A | VDS ≥ 10 V, VGS = 10 V | 2 |
| Total Gate Charge | Qg | | 76 | 120 | nC | VDS = 50 V, VGS = 10 V, ID = 20 A | 2 |
| Gate Resistance | Rg | 0.6 | 3.3 | 6.6 | Ω | f = 1 MHz | 2 |
| Turn-On Delay Time | td(on) | | 15 | 30 | ns | VDD = 50 V, RL = 5 Ω, ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω | 2 |
| Rise Time | tr | | 22 | 40 | ns | VDD = 50 V, RL = 5 Ω, ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω | 2 |
| Turn-Off Delay Time | td(off) | | 55 | 100 | ns | VDD = 50 V, RL = 5 Ω, ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω | 2 |
| Fall Time | tf | | 15 | 30 | ns | VDD = 50 V, RL = 5 Ω, ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω | 2 |
| Body Diode Pulsed Current | ISM | | | 480 | A | TC = 25 °C | 2 |
| Body Diode Forward Voltage | VSD | | 0.8 | 1.5 | V | IF = 10 A, VGS = 0 V | 2 |
| Drain-Source Voltage | VDS | | | 100 | V | TC = 25 °C | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | TC = 25 °C | 1 |
| Continuous Drain Current | ID | | | 120 | A | TJ = 150 °C, TC = 25 °C | 1 |
| Pulsed Drain Current | IDM | | | 480 | A | t = 100 μs | 1 |
| Avalanche Current | IAS | | | 73 | A | | 1 |
| Single Avalanche Energy | EAS | | | 266 | mJ | L = 0.1 mH | 1 |
| Maximum Power Dissipation | PD | | | 370 | W | TC = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 120 | W | TC = 125 °C | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 175 | °C | | 1 |
| Junction-to-Ambient (PCB Mount) | RthJA | | | 40 | °C/W | | 1 |
| Junction-to-Case (Drain) | RthJC | | | 0.4 | °C/W | | 1 |
| Drain-Source On-State Resistance | RDS(on) | | 0.005 | | Ω | VGS = 10 V, ID = 20 A | 2 |
| Drain-Source On-State Resistance | RDS(on) | | 0.006 | | Ω | VGS = 7.5 V, ID = 15 A | 2 |
| Forward Transconductance | gfs | | 82 | | S | VDS = 15 V, ID = 20 A | 2 |
| Input Capacitance | Ciss | | 10000 | | pF | VGS = 0 V, VDS = 50 V, f = 1 MHz | 2 |
| Output Capacitance | Coss | | 2025 | | pF | VGS = 0 V, VDS = 50 V, f = 1 MHz | 2 |
| Reverse Transfer Capacitance | Crss | | 165 | | pF | VGS = 0 V, VDS = 50 V, f = 1 MHz | 2 |
| Gate-Source Charge | Qgs | | 23 | | nC | VDS = 50 V, VGS = 10 V, ID = 20 A | 2 |
| Gate-Drain Charge | Qgd | | 17 | | nC | VDS = 50 V, VGS = 10 V, ID = 20 A | 2 |
## CAD (KiCad official)
- Symbol: `VBZM150N10`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220AB (KiCad packages3D, STEP)
- 3D model files: `vbzm150n10-etched.step` / `vbzm150n10-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `vbzm150n10.step` / `vbzm150n10.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [VBsemi Elec datasheet](docs/vbzm150n10-datasheet.pdf) (8 pp, sha256 `3185630fbe805d5f`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/vbzm150n10-datasheet.pdf)